Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided is a laser dicing assistance sheet with which chips can be prevented from coming loose during full-cut dicing by laser light irradiation can be prevented. The laser dicing assistance sheet comprises an adhesive layer formed from an adhesive composition. The adhesive layer is characterized by being adjusted such that the residual weight (as measured under a flow of nitrogen (50 ml/min) at a heating rate of 10 C./min) of the constituent material (adhesive composition) at 500 C. is not more than 5.5%.

A pressure sensitive adhesive sheet for use for a battery is provided. The pressure sensitive adhesive sheet comprises a base material, a hard coat layer provided at one side of the base material, and a pressure sensitive adhesive layer provided at a side of the hard coat layer opposite to the base material. The pressure sensitive adhesive sheet can well maintain the adhesive strength to suppress delamination from an adherend even in case of contact with an electrolyte solution.

[Problems] Objects include providing a pressure sensitive adhesive sheet for batteries that is excellent in the insulation properties even after heated to high temperatures and also excellent in the insulation properties even when immersed in an electrolyte solution for a long time and then heated to high temperatures and also providing a lithium-ion battery in which the pressure sensitive adhesive sheet for batteries is used. [Solution] A pressure sensitive adhesive sheet for batteries (1), comprising: a base material (11); a hard coat layer (12) provided at one side of the base material (11); and a pressure sensitive adhesive layer (13) provided at a side of the hard coat layer (13) opposite to the base material (11), the hard coat layer (12) being formed of a composition for hard coat layer that contains a metal oxide sol, the metal oxide sol being a sol of a metal oxide that has insulation properties.

A primer is useful for adhering cured silicones to low energy plastic substrates. The primer is prepared from starting materials including a) an organoboron compound capable of forming a free radical generating species, and at least one of b) an organosilicon compound having, per molecule, at least one free radical reactive group and at least one other reactive group, and/or c) an organoborane liberating compound capable of reacting with starting material a) to liberate the free radical generating species. The method for forming the primer may further include use of d) an organic solvent, and e) a free radical polymerizable monomer, oligomer, macromonomer, or polymer.

A primer is useful for adhering cured silicones to low energy plastic substrates. The primer is prepared from starting materials including a) an organoboron compound capable of forming a free radical generating species, and at least one of b) an organosilicon compound having, per molecule, at least one free radical reactive group and at least one other reactive group, and/or c) an organoborane liberating compound capable of reacting with starting material a) to liberate the free radical generating species. The method for forming the primer may further include use of d) an organic solvent, and e) a free radical polymerizable monomer, oligomer, macromonomer, or polymer.

The present invention relates to a flexible film, more specifically, to a flexible film that not only exhibits high hardness, but also has excellent flexibility. According to the flexible film of the present invention, flexibility, bendability, high hardness, scratch resistance, and high transparency are exhibited, and there is no concern for damage of the film even when bended repeatedly or folded for a long time, and thus, it may be usefully applied for the front panels, display parts of bendable, flexible, rollable, or foldable mobile devices, display devices, various instrument panels, and the like.

Primer for adhesive tape with improved adhesion promoting properties, comprising a mixture G, which is dissolved or dispersed in one or more solvents, consisting of at least one copolymer obtained by copolymerization of a monomer mixture comprising an amount of at least 90 wt % of the following monomers: vinylcaprolactam and/or vinylpyrrolidone; one or more of the monomers a) and/or b): a) acrylic acid ester of a linear, primary alcohol having 2 to 10 carbon atoms in the alkyl group of the alcohol, b) acrylic acid ester of a branched, non-cyclic alcohol having 3 to 12 carbon atoms in the alkyl group, at least one chlorinated polyolefin, and at least one metal compound selected from the group consisting of metal acetylacetonates, metal alkoxides and alkoxy-metal acetylacetonates.

The pressure sensitive adhesive tape for semiconductor processing of the present invention is a pressure sensitive adhesive tape for semiconductor processing, which, in a step of grinding a back face of a semiconductor wafer having a groove formed on a front face thereof or having a modified region formed therein to singulate the semiconductor wafer into semiconductor chips, is stuck on the front face of the semiconductor wafer and used, the pressure sensitive adhesive tape for semiconductor processing including a base, a buffer layer provided on one face of the base, and a pressure sensitive adhesive layer provided on the other face of the base, and having a ratio (D2/D1) of a thickness (D2) of the buffer layer to a thickness (D1) of the base of 0.7 or less and an indentation depth (X) of the front face on the buffer layer side of 2.5 m or less.

A method for adhesively bonding two substrates, including the steps: (a) applying a liquid, radiation-curable primer composition onto the surface of a first substrate; (b) curing the liquid, radiation-curable primer composition by applying radiation with a suitable wavelength, intensity and temporal exposure such that the radiation-curable primer composition is cured into a solidified, coherent or interrupted layer adhering to the surface of the substrate; (c) optionally storing the primed substrate for a time of up to 6 months; (d) applying a curable adhesive composition onto the cured primer composition on the substrate; (e) joining a second substrate to the adhesive composition on the first substrate such that an adhesive bond is formed between the substrates, wherein the surface of the second substrate to be adhesively bonded is optionally pre-treated to improve adhesion before step (e) is performed; (f) curing the curable adhesive composition.