Provided are adhesive articles and related methods that use a foam layer including an acrylic polymer or silicone polymer and having a pair of opposing major surfaces. An adhesive surface is disposed on each of the opposing major surfaces and a plurality of channels extend across at least one adhesive surface. The adhesive surface defining the channels contains a pressure-sensitive adhesive having a rheology enabling the plurality of channels to essentially disappear over time when the adhesive article is compressed. Advantageously, the provided articles and methods enable high immediate bond and handling strength, a high degree of wet out, weatherability, and superior aesthetics when used with transparent or translucent substrates.

A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness d, where the resin sheet has a 50% compression load of 20 N/cm.sup.2 or less at 235 C. in a direction of the thickness d, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23 C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness d at 23 C.

The present invention relates to an anti-scattering film and a method for manufacturing the same, the anti-scattering film including: a transparent film; and a hard coating layer formed on top of the transparent film, in which the hard coating layer is formed of a composition which includes a UV-curable acrylate resin, first inorganic nanoparticles, second inorganic nanoparticles, a photoinitiator, and a mixed solvent comprising a ketone-based solvent and an alcohol-based solvent, and a plurality of protruding parts is formed on an upper surface of the hard coating layer.

A pressure sensitive adhesive composition and a protective film employing the same are provided. The pressure sensitive adhesive composition includes 30-45 parts by weight of a tackifier and 55-70 parts by weight of a polymer. The polymer includes at least one block copolymer. The block copolymer includes a vinyl aromatic block polymerized by a vinyl aromatic monomer and a conjugated diene block polymerized by a conjugated diene monomer. The block copolymer meets one of the following conditions: (1) the content of the vinyl aromatic monomer is from 15 wt % to 25 wt % and the content of the vinyl group of the conjugated diene block is less than or equal to 45 wt % or, (2) the content of the vinyl aromatic monomer is from 10 wt % to 15 wt % and the content of the vinyl group of the conjugated diene block is less than or equal to 45 wt %, or greater than or equal to 60 wt %.

A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 m; a processing method of a semiconductor wafer; and a semiconductor chip.

A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 m; a processing method of a semiconductor wafer; and a semiconductor chip.

A single-sided pressure-sensitive adhesive tape includes a substrate, a reflective metal layer disposed on a surface of the substrate, a pressure-sensitive adhesive layer disposed on the reflective metal layer, a thermoplastic polymer layer, and a light-shielding layer disposed on a surface of the thermoplastic polymer layer; wherein the light-shielding layer is dry laminated to the surface of the substrate opposite the surface on which the reflective metal layer is disposed. Articles comprising the tape, and methods of making and using the tape are disclosed.

The present invention provides a method of manufacturing a high-strength carbon fiber resin tape and the high-strength carbon fiber resin tape that can be widely applied for reinforcement of PVC pipe, PP pipe, or the like. The high-strength carbon fiber resin tape according to the present invention comprises a base material including a binder, metal oxide sol, and potassium persulfate between acrylic carbon fibers; an adhesive material having one or more physical characteristics of heat resistance, cold resistance, or high-strength applied on one surface of the base material; and an ultraviolet protection coating applied on the other surface of the base material.

A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5 C./sec from 80 C. to 300 C. under pressure of 10 MPa, and then held at 300 C. for 2.5 minutes is in a range of 0.005 m.sup.2 to 0.5 m.sup.2.

In certain embodiments, the present disclosure relates to low emissivity films and articles comprising them. Other embodiments are directed to methods of reducing emissivity in an article comprising the use of low emissivity films. In some embodiments, the low emissivity films comprise a metal layer and a pair of layers, one comprising a metal oxide such as zinc tin oxide and the other layer comprising a silicon compound, adjacent each of the two sides of the metal layer. This type of assembly may serve various purposes, including being used as a sun control film. These constructions may be used, for example, as window films on glazing units for reducing transmission of infrared radiation across the film in both directions.