C09K3/14

Derivatized polyamino acids

A composition comprises, consists of, or consists essentially of a polymer including a derivatized amino acid monomer unit. A chemical mechanical polishing composition includes a water based liquid carrier, abrasive particles dispersed in the liquid carrier, and a cationic polymer having a derivatized amino acid monomer unit. A method of chemical mechanical polishing includes utilizing the chemical mechanical polishing composition to remove at least a portion of a metal or dielectric layer from a substrate and thereby polish the substrate.

Method of processing wafer
11615979 · 2023-03-28 · ·

A method of processing a workpiece with a disk-shaped blade containing abrasive grains includes the steps of placing an auxiliary plate made of a material having a modulus of elasticity higher than a material of which a front surface side of the workpiece is made, on the front surface side of the workpiece, causing the blade rotated to cut into the front surface side of the workpiece to cut the workpiece as well as the auxiliary plate, and removing the auxiliary plate from the workpiece that has been cut by the blade.

PORTABLE WET SAND BLASTER
20230035722 · 2023-02-02 ·

A portable wet sand blasting device or a portable wet sand blaster with a specially designed and shaped hand truck tank with an inclined side, wheels, axle, base feet, and a handle to allow the heavy device to be more easily moved from job to job. The specially designed and shaped hand truck tank includes a special pump and special internal plumbing and mixing outputs that provide optimum water and abrasive slurry mixing wherein sufficient slurry mixing is required for the effective use of a wet sand blasting device.

COATED ADHESION ENHANCEMENT COMPOSITIONS
20220348807 · 2022-11-03 ·

A coated composition for increasing adhesion between two surfaces that are in sliding, slipping, rolling-sliding or rolling-slipping contact with each other, the composition comprising: (a) a core, the core comprising one or more than one hard particle, each of the one or more than one hard particle having a Mohs hardness value of equal to or greater than 5, or a Vickers hardness of greater than or equal to 1000 and selected from the group of garnet, copper slag, silica sand, bauxite, Al.sub.2O.sub.3, staurolite, olivine, goethite, coal slag, MgO and Fe.sub.2O.sub.3, the core comprising about 70% to about 99.8% (wt/wt) of the composition; and (b) a coating over the core, the coating over the core comprising a resin and a conductivity additive, the resin comprising about 0.1% to about 20% (wt/wt) of the composition, and the conductivity additive comprising about 0.1% to about 10% (wt/wt) of the composition.

EASILY CRUSHABLE DIAMOND ABRASIVE GRAINS AND METHOD FOR MANUFACTURING SAME
20220348470 · 2022-11-03 ·

[Technical Problem]To provide diamond grits with enhanced friability, and method for the production comprising in combination internal microcracks within the diamond particle and surface irregularities, with or without a layer of non-diamond carbon covering the particle surface.

[Solution to Problem]

The diamond grits of the invention consist of diamond particles synthesized by a static ultrahigh pressure-high temperature process, comprising both microcracks generated within the particles due to the effect of heating, and surface irregularities formed on the particles by oxidizing etching at elevated temperatures.

The production method comprises providing a starting volume of diamond particles, from a synthesizing process in a static ultrahigh pressure-high temperature process, subjecting said diamond particles to a heating process in intimate contact with an oxidizing etchant at a temperature of 800° C. or higher, generating thus microcracks within the diamond particles and also causing to corrode the particle surface thus forming increased surface irregularities, and recovering the treated diamond particles.

SURFACE MODIFIED SILANIZED COLLOIDAL SILICA PARTICLES
20220348789 · 2022-11-03 ·

Modified silanized colloidal silica particles are reaction products of silanized colloidal silica particles having epoxy moieties with nitrogen of amines to form stable and tunable modified silanized colloidal silica particles. The modified silanized colloidal silica particles can be used as an abrasive in chemical mechanical polishing of various substrates.

ABRASIVE ARTICLES INCLUDING AN ANTI-LOADING SIZE LAYER WITH ENHANCED MANUFACTURABILITY

The present disclosure relates to an abrasive article construction containing an anti-loading composition which significantly reduces loading, is coatable, is durable, and is relatively inexpensive to manufacture. In particular, the use of the anti-loading compositions of the present disclosure as a size coat at least reduces if not eliminates the need for a supersize coat, while offering comparable if not superior performance and durability. In one aspect, the present disclosure provides an abrasive article including a backing with a first major surface and an opposing second major surface, an abrasive layer bonded to at least a portion of the first major surface, with the abrasive layer comprising abrasive particles retained in a make coat. The abrasive article further includes an anti-loading size layer comprising a size coat binder and wax at least partially disposed on the abrasive layer and also includes a blocked acid catalyst.

Shaped abrasive particles and method of forming same

An abrasive particle including a shaped abrasive particle including a body having a plurality of abrasive particles bonded to at least one surface of the body of the shaped abrasive particle.

Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates

Shallow Trench Isolation (STI) chemical mechanical planarization (CMP) polishing compositions, methods and systems of use therefore are provided. The CMP polishing composition comprises abrasives of ceria coated inorganic metal oxide particles, such as ceria-coated silica; and dual chemical additives for providing the tunable oxide film removal rates and tunable SiN film removal rates. Chemical additives comprise at least one nitrogen-containing aromatic heterocyclic compound and at least one non-ionic organic molecule having more than one hydroxyl functional group organic.

Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates

Shallow Trench Isolation (STI) chemical mechanical planarization (CMP) polishing compositions, methods and systems of use therefore are provided. The CMP polishing composition comprises abrasives of ceria coated inorganic metal oxide particles, such as ceria-coated silica; and dual chemical additives for providing the tunable oxide film removal rates and tunable SiN film removal rates. Chemical additives comprise at least one nitrogen-containing aromatic heterocyclic compound and at least one non-ionic organic molecule having more than one hydroxyl functional group organic.