A reverse emulsion-based slick water concentration system, wherein the reverse emulsion is obtained by dispersing an aqueous phase A to an oil phase B under mechanical agitation; wherein the aqueous phase A is composed of a water-soluble monomer A1, a water-soluble fluorocarbon surfactant A2, a water-soluble quaternary ammonium clay stabilizer A3 and water A4; wherein the oil phase B comprises an oil-soluble dispersant/surfactant B1, an oil-soluble radical initiator B2 and a hydrophobic solvent B3 as a dispersing medium; wherein, the percentages of each component described above, relative to the total weight of the reaction system is as the following: water-soluble monomer A1: 5.0-30.0%; water-soluble fluorocarbon surfactant A2: 0.1-5.0%; water-soluble quaternary ammonium clay stabilizer A3: 0.1-15.0%; water A4: 5.0-35.0%; oil-soluble dispersant/surfactant B1: 0.1-5.0%; oil-soluble radical initiator B2: 0.000001-0.100%; hydrophobic solvent B3: remainder.

A tile system for covering a surface. The tile system comprises a first tile assembly connected to a second tile assembly by a connector. Each tile assembly comprises a first tile stacked on a second tile, the first tile and the second tile joined to a reinforcing material disposed therebetween. The connector comprises a first component and a second component that is complementary to the first component. The first component is mounted to the first tile assembly, and the second component is mounted to the second tile assembly.

An improved composition and method of use is provided which is suitable for treating live animal growth facility, meat processing facilities and food processing facilities. The composition comprises 34-99.35 wt % water; 0.1 to 3 wt % hydrophobizing agents; up to 5 wt % antistatic agents; 0.05 to 3 wt % wetting agents; and 0.5 to 55 wt % film forming agent. The composition is applied to surfaces and allowed to dry.

A tile system for covering a surface. The tile system comprises a first tile assembly connected to a second tile assembly by a connector. Each tile assembly comprises a first tile stacked on a second tile, the first tile and the second tile joined to a reinforcing material disposed therebetween. The connector comprises a first component and a second component that is complementary to the first component. The first component is mounted to the first tile assembly, and the second component is mounted to the second tile assembly.

The present invention relates to a new rinse composition, the forming of resist patterns using the rinse composition, and a semiconductor device manufacturing method using the rinse composition in a photolithography method.

Surfactant mixture comprising (i) 50%-99% C1 comprising for 100% of its weight: (a) 65%-90% of a compound R1-C(O)NHCH(COOH)(CH2CH2)-COOH, R1 represents C7-C17, (b) 10%-35% of a compound R1-C(O)OH (ii) 1%-50% C2 comprising for 100% of its weight: (c) 37.5%-100% R3-O-(G3)p-H, R3 represents C12-C16, G3 represents the residue of a reducing sugar, 1.05p5, (d) 0%-37.5% of an alcohol R3-OH, (e) 0%-12.5% of R4-O-(G4)q-H, R4 represents C4-C7, G4 represents the residue of a reducing sugar, 1.05q5, (f) 0%-12.5% of an alcohol R4-OH. Use of the surfactant mixture as constituent of a fire-fighting foam liquid. Method for extinguishing a fire.

The present invention relates to novel compounds containing fluorinated end groups, to the use thereof as surface-active substances, and to compositions comprising these compounds.

The present disclosure relates to a cleaning agent composition for a substrate for a semiconductor device and a method for cleaning a substrate for a semiconductor device using the same. The cleaning agent composition contains a silicon-based compound represented by Formula 1 and an aprotic organic solvent with a dielectric constant of 10 or less, which can form a surface protective film capable of preventing collapse of the pattern even in a wet cleaning process of fine patterns with high aspect ratios, thereby providing a method for manufacturing a semiconductor device with an improved semiconductor manufacturing yield.

The present invention relates to a new rinse composition, the forming of resist patterns using the rinse composition, and a semiconductor device manufacturing method using the rinse composition in a photolithography method.

Improved stripper solutions for removing photoresists from substrates are provided that typically have freezing points below about 0? C. and high loading capacities. The stripper solutions comprise dimethyl sulfoxide, quaternary ammonium hydroxide, and an alkanolamine having at least two carbon atoms, at least one amino substituent and at least one hydroxyl substituent, the amino and hydroxyl substituents attached to two different carbon atoms. Some formulations can additionally contain a secondary solvent. The formulations do not contain tetramethylammonium hydroxide. Methods for use of the stripping solutions are additionally provided.