Patent classifications
C23C14/0005
Films including a water-soluble layer and a vapor-deposited inorganic coating
Films including a water-soluble polymeric material and a vapor-deposited inorganic coating are disclosed. The water-soluble polymeric material may comprise polyvinyl alcohol. The vapor-deposited inorganic coating may include a metal oxide. The vapor-deposited inorganic coating may include a plurality of microfractures. The films may form part of a package and/or a water-soluble unit dose article.
Thin leaf-like indium particles and method for producing same, glitter pigment, and water-based paint and coating film
Provided are thin leaf-like indium particles having a first peak and a second peak at a greater particle diameter than a particle diameter at which the first peak appears in a volume-based particle size distribution representing a relationship between particle diameters of indium particles and ratios by volume of the indium particles at the particle diameters, wherein a volume V1 of the indium particles at the first peak and a volume V2 of the indium particles at the second peak satisfy a formula (V1/V2)×100≥25%.
Two-dimensional amorphous carbon coating and methods of growing and differentiating stem cells
Described is a composite material composed of an atomically thin (single layer) amorphous carbon disposed on top of a substrate (metal, glass, oxides) and methods of growing and differentiating stem cells.
Method of manufacturing a diffractive grating
The invention relates to a method of manufacturing a diffractive grating. The method comprises providing a first substrate and manufacturing onto the first substrate a first surface profile using temporary grating material. Next, the first surface profile is covered entirely by a layer of final grating material and a second substrate is bonded onto the final grating material. Finally, the first substrate and the temporary grating material are removed for producing on the final grating material a second surface profile, which is a negative of the first surface profile. The invention allows for conveniently producing high quality gratings using e.g. inorganic materials and height and/or fill factor modulation for diffraction efficiency control.
Engineered platelets for additive manufacturing
The present disclosure is directed to systems and methods for producing a metal-containing powder useful for additive manufacturing. The metal-containing powder includes a plurality of metal-containing platelets having a defined physical geometry and a defined aspect ratio. The metal platelets may be produced by depositing a metal layer on a substrate that includes one or more recessed or raised surface features. The one or more recessed or raised surface features create a fracture pattern in a metal layer deposited across at least a portion of the one or more surface features. By separating the metal layer from the substrate and fracturing the metal layer along the fracture pattern, a plurality of metal platelets are produced. In some embodiments, a release agent may be disposed between the metal layer and the substrate to facilitate the separation of the metal layer from the substrate.
ULTRA-LOW DENSITY METALLIC COATINGS
Forming a porous multilayer material includes forming a multilayer material on a substrate. Forming the multilayer material includes alternately forming a sacrificial layer and a semi-sacrificial layer, where the sacrificial layer includes a first metal and the semi-sacrificial layer includes the first metal and a second metal or metallic alloy. Forming the porous multilayer material further includes removing at least a portion of the first metal from each of the sacrificial and semi-sacrificial layers to yield the porous multilayer material. The porous multilayer material includes a multiplicity of metal-containing layers, each layer having a thickness in a range between about 5 nm and about 100 nm and bonded to an adjacent layer. Each layer includes chromium, niobium, tantalum, vanadium, molybdenum, tungsten, or a combination thereof. A void is defined between each pair of layers, and a density of porous the multilayer material is <1% bulk density.
METHOD FOR PREPARING A CONDUCTIVE, TRANSPARENT AND FLEXIBLE MEMBRANE
The technique relates to a method for preparing a nanomesh metal membrane 5 transferable on a very wide variety of supports of different types and shapes comprising at least one step of de-alloying 1 a thin layer 6 of a metal alloy deposited on a substrate 7, said method being characterized in that said thin layer 6 has a thickness less than 100 nm, and in that said de-alloying step 1 is carried out by exposing said thin layer 6 to an acid vapor in the gas phase 8, in order to form said nanomesh metal membrane 5.
FILMS INCLUDING A WATER-SOLUBLE LAYER AND A VAPOR-DEPOSITED INORGANIC COATING
Methods for making films including a water-soluble polymeric material and a vapor-deposited inorganic coating are disclosed. The method comprises providing a layer of water-soluble polymeric material and vapor depositing an inorganic coating to at least one surface of the layer of water-soluble polymeric material, wherein the inorganic coating comprises a metal oxide. The method further comprises forming a plurality of microfractures extending along the surface of the inorganic coating.
MULTILAYER BODY
There is provided a laminate in which a decrease in the release function of a release layer can be suppressed even when the laminate is heat-treated under either temperature condition of low temperature and high temperature. This laminate includes a carrier; an adhesion layer on the carrier and containing a metal M.sup.1 having a negative standard electrode potential; a release-assisting layer on a surface of the adhesion layer opposite to the carrier and containing a metal M.sup.2 (M.sup.2 is a metal other than an alkali metal and an alkaline earth metal); a release layer on a surface of the release-assisting layer opposite to the adhesion layer; and a metal layer on a surface of the release layer opposite to the release-assisting layer, and T.sub.2/T.sub.1, a ratio of a thickness of the release-assisting layer, T.sub.2, to a thickness of the adhesion layer, T.sub.1, is more than 1 and 20 or less.
Methods for controlling physical vapor deposition metal film adhesion to substrates and surfaces
A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate.