Patent classifications
C23C14/58
ENGINEERED MULTI-DIMENSIONAL METALLURGICAL PROPERTIES IN PVD MATERIALS
Multi-layer metal or pseudometallic materials having engineered anisotropy are disclosed. The multi-layer materials having defined engineered grain orientations in each layer of the multi-layer material and bond layers between adjacent layers orthogonal to the grain orientations. This configuration distributes applied stress across the plurality of layers in the multi-layer metal material and around a neutral axis of the multi-layer metal material and increases the overall mechanical properties of the disclosed multi-layer metal material relative to conventional wrought metal materials of the same or similar chemical constitution. The microstructure of each layer, group of layers, or across multiple layers may be tailored to the intended application of a device made from the material. Individual layers may be tuned for property variations, such as gradients, or to adjust the bond layer characteristics. A method of making the multi-layer metal materials by physical vapor deposition to deposit each layer as crystalline grain structures and allow for layer-by-layer control over the physical, mechanical and chemical properties of each layer in the multi-layer metal as well as a bond layer between adjacent layers is disclosed.
ENGINEERED MULTI-DIMENSIONAL METALLURGICAL PROPERTIES IN PVD MATERIALS
Multi-layer metal or pseudometallic materials having engineered anisotropy are disclosed. The multi-layer materials having defined engineered grain orientations in each layer of the multi-layer material and bond layers between adjacent layers orthogonal to the grain orientations. This configuration distributes applied stress across the plurality of layers in the multi-layer metal material and around a neutral axis of the multi-layer metal material and increases the overall mechanical properties of the disclosed multi-layer metal material relative to conventional wrought metal materials of the same or similar chemical constitution. The microstructure of each layer, group of layers, or across multiple layers may be tailored to the intended application of a device made from the material. Individual layers may be tuned for property variations, such as gradients, or to adjust the bond layer characteristics. A method of making the multi-layer metal materials by physical vapor deposition to deposit each layer as crystalline grain structures and allow for layer-by-layer control over the physical, mechanical and chemical properties of each layer in the multi-layer metal as well as a bond layer between adjacent layers is disclosed.
Fabric coloring method and colored fabric
The present application provides a fabric coloring method and a colored fabric, where the fabric coloring method includes: performing radiation drying on a base cloth; sequentially forming an adhesive layer and at least one color-generating layer on a surface of the base cloth after the radiation drying by vacuum deposition, where the adhesive layer contains at least one of Ti, Cr, Si and Ni, and a thickness of the adhesive layer ranges from 1 nm to 2000 nm; the color-generating layer contains at least one of Al, Ti, Cu, Fe, Mo, Zn, Ag, Au, and Mg, and the total thickness of the color-generating layer ranges from 1 nm to 4000 nm. The fabric coloring method can not only produce rich colors and make the colored fabric have good color fastness, but also reduce the sensitivity of color of the colored fabric to thickness of the film, thus improving the industrial operability.
Fabric coloring method and colored fabric
The present application provides a fabric coloring method and a colored fabric, where the fabric coloring method includes: performing radiation drying on a base cloth; sequentially forming an adhesive layer and at least one color-generating layer on a surface of the base cloth after the radiation drying by vacuum deposition, where the adhesive layer contains at least one of Ti, Cr, Si and Ni, and a thickness of the adhesive layer ranges from 1 nm to 2000 nm; the color-generating layer contains at least one of Al, Ti, Cu, Fe, Mo, Zn, Ag, Au, and Mg, and the total thickness of the color-generating layer ranges from 1 nm to 4000 nm. The fabric coloring method can not only produce rich colors and make the colored fabric have good color fastness, but also reduce the sensitivity of color of the colored fabric to thickness of the film, thus improving the industrial operability.
Film formation apparatus and film formation method
According to one embodiment, film formation apparatus includes: a carrying unit that includes a rotation table which circulates and carries a workpiece; a film formation process unit which includes a target formed of a silicon material, and a plasma producer that produces plasma of a sputter gas introduced between the target and the rotation table, and which forms a silicon film on the workpiece by sputtering; and a hydrogenation process unit which includes a process gas introducing unit that introduces a process gas containing a hydrogen gas, and a plasma producer that produces plasma of the process gas, and which performs hydrogenation on the silicon film formed on the workpiece. The carrying unit carries the workpiece so as to alternately pass through the film formation process unit and through the hydrogenation process unit.
LOW TEMPERATURE SYNTHESIS OF NiAl THIN FILMS
Contacting a multiplicity of seed crystals with an amorphous metallic alloy layer to form an amorphous precursor film or depositing an amorphous precursor film on a substrate and annealing the amorphous precursor film at a temperature between 50° C. and 400° C. to yield the metallic film with grains separated by grain boundaries.
METHOD FOR MODIFYING CARBON FIBER AND PRODUCT THEREOF
A method for modifying carbon fibers and a product thereof are provided. Modified carbon fibers are obtained by heating prepared carbon fibers under an inert atmosphere after magnetron sputtering treatment. The magnetron sputtering treatment takes the prepared carbon fibers as a substrate material and carbon as a target material, and sputtering conditions includes: a vacuum degree of 2×10.sup.−3 Pa, a distance from the target material to the substrate material of 4 cm, a magnetron sputtering power of 150-350 W, a magnetron sputtering pressure of 0.5-1.6 Pa, a magnetron sputtering duration of 20-60 min, a high purity argon as working gas, and an argon flow rate of 80 mL/min The heating treatment is carried out under conditions including: a heating rate of 5° C./min, a heating temperature of 200-600° C., and a heating duration of 25-40 min.
LaCoO3 THIN FILM DEPOSITION BY DC METAL CO-SPUTTERING
A method for producing a LaCoO.sub.3 film on a substrate that includes positioning the substrate in a vacuum chamber, positioning a cobalt target in the vacuum chamber, positioning a lanthanum target in the vacuum chamber, providing oxygen in the vacuum chamber, and sputtering cobalt atoms off of the cobalt target and lanthanum atoms off of the lanthanum target so that the cobalt and lanthanum atoms interact with the oxygen to form the LaCoO.sub.3 film on the substrate. A power limiter that employs one or more LaCoO.sub.3 films is also disclosed.
Electrode structure of back electrode of semiconductor substrate, method for producing the same, and sputtering target for use in producing the electrode structure
An electrode structure of a back electrode including metal layers laminated in the following order: a Ti layer, a Ni layer, and a Ag alloy layer. The Ag alloy layer includes an Ag alloy and an addition metal M selected from Sn, Sb, and Pd. The electrode structure is configured such that when subjected to elemental analysis with an X-ray photoelectron spectrometer in the depth direction from the Ag alloy layer to the Ni layer, on the boundary between the Ni layer and the Ag alloy layer, an intermediate region where spectra derived from all the metals, Ni, Ag, and the addition element M, can be detected is observable, and, when each metal content in the intermediate region is converted based on the spectra derived from all the metals Ni, Ag, and the addition element M, the maximum of the addition element M content is 5 at % or more.
Oxidation-Resistant Coated Superalloy
A coating-substrate combination includes: a Ni-based superalloy substrate comprising, by weight percent: 2.0-5.1 Cr; 0.9-3.3 Mo; 3.9-9.8 W; 2.2-6.8 Ta; 5.4-6.5 Al; 1.8-12.8 Co; 2.8-5.8 Re; 2.8-7.2 Ru; and a coating comprising, exclusive of Pt group elements, by weight percent: Ni as a largest content; 5.8-9.3 Al; 4.4-25 Cr; 3.0-13.5 Co; up to 6.0 Ta, if any; up to 6.2 W, if any; up to 2.4 Mo, if any; 0.3-0.6 Hf; 0.1-0.4 Si; up to 0.6 Y, if any; up to 0.4 Zr, if any; up to 1.0 Re, if any.