Provided is a barrier film comprising a base layer, and an inorganic layer including Si, N, and O, and including a first region and a second region, which have different elemental contents (atomic %) of Si, N, and O from each other as measured by XPS, wherein the film has a water vapor transmission rate of 5.0?10.sup.?4 g/m.sup.2.Math.day or less as measured under conditions of a temperature of 38? C. and 100% relative humidity after being stored at 85? C. and 85% relative humidity conditions for 250 hours, or wherein the inorganic layer has a compactness expressed through an etching rate of 0.17 nm/s in the thickness direction for an Ar ion etching condition to etch Ta.sub.2O.sub.5 at a rate of 0.09 nm/s. The barrier film has excellent barrier properties and optical properties and can be used for electronic products that are sensitive to moisture and the like.

The invention relates to a process for the manufacture of a metal, ceramic or composite part or of a supported metal, ceramic or composite microstructure by laser irradiation starting from metal oxalates, and also to the part and the microstructure obtained by said process, and to their uses.

Vacuum-integrated photoresist-less methods and apparatuses for forming metal hardmasks can provide sub-30 nm patterning resolution. A metal-containing (e.g., metal salt or organometallic compound) film that is sensitive to a patterning agent is deposited on a semiconductor substrate. The metal-containing film is then patterned directly (i.e., without the use of a photoresist) by exposure to the patterning agent in a vacuum ambient to form the metal mask. For example, the metal-containing film is photosensitive and the patterning is conducted using sub-30 nm wavelength optical lithography, such as EUV lithography.

A conductive nanowire film having a high aspect-ratio metal is described. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.

Forming a conductive film comprising depositing a non-conductive film on a surface of a substrate, wherein the film contains a plurality of copper nanoparticles and exposing at least a portion of the film to light to make the exposed portion conductive. Exposing of the film to light photosinters or fuses the copper nanoparticles.

An ink composition including a metal salt amine complex; wherein the metal salt amine complex is formed from a metal salt and an amine; a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator; and an optional solvent. A process including forming a metal salt amine complex; adding a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator to the metal salt amine complex to form an ink. A process including providing an ink composition comprising a metal salt amine complex, wherein the metal salt amine complex is formed from a metal salt and an amine; a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator; and an optional solvent; depositing the ink composition onto a substrate to form deposited features; and treating the deposited features on the substrate to form conductive features on the substrate.

An ink composition including a metal salt amine complex; wherein the metal salt amine complex is formed from a metal salt and an amine; a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator; and an optional solvent. A process including forming a metal salt amine complex; adding a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator to the metal salt amine complex to form an ink. A process including providing an ink composition comprising a metal salt amine complex, wherein the metal salt amine complex is formed from a metal salt and an amine; a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator; and an optional solvent; depositing the ink composition onto a substrate to form deposited features; and treating the deposited features on the substrate to form conductive features on the substrate.

The present invention relates to a nanostructure formation device using microwaves and, more specifically, to a novel structure of a nanostructure formation device using microwaves, the device being capable of introducing a solution process factor to a conventional nanostructure formation device using microwaves, so as to stably manufacture a nanostructure by using a microwave while consistently maintaining the concentration of a formation solution and the process conditions for it when the nanostructure is formed through a solution process.

There is described a process for depositing carbon on a surface, comprising, while contacting a mixture of CO.sub.2 and Br.sub.2 with a polar substrate presenting apposed surfaces, exposing a sufficient area of said mixture in the region of said apposed surfaces to light of sufficient intensity and frequency to result in deposition of carbon on at least some of said apposed surfaces. Other embodiments are also described.

A conductive composition that comprises a branched metal carboxylate and one or more solvents. The solvents may be an aromatic hydrocarbon solvent. In embodiments, the branched metal carboxylate is a silver carboxylate. The conductive composition may be used in forming conductive features on a substrate, including by inkjet printing, screen printing or offset printing.