A silver mirror film includes a plurality of silver particles arranged in a film surface direction, a plurality of interparticle silicon particles between the silver particles, and a plurality of surface silicon particles on surfaces of the silver particles so as to at least partially cover the surfaces. The interparticle silicon particles and the surface silicon particles are present as (Si.sub.xO.sub.2y).sub.n{x≥1, y≥1, and n≥1}.

An aluminum alloy sheet for a magnetic disk, a method for manufacturing same, and a magnetic disk using same. The aluminum alloy sheet is made of an aluminum alloy comprising 0.10 to 3.00 mass % of Fe, 0.003 to 1.000 mass % of Cu, and 0.005 to 1.000 mass % of Zn, with a balance of Al and unavoidable impurities, wherein a value obtained by dividing a difference in an area ratio (%) of second phase particles between a region (A) and a region (B) by an average value of area ratios (%) of second phase particles in the regions (A) and (B) is 0.05 or less, the region (A) being a region from a sheet thickness center plane to a front surface of the sheet, and the region (B) being a region from the sheet thickness center plane to a rear surface of the plate.

A substrate liquid processing apparatus includes a substrate holder 52 configured to attract, hold and rotate a substrate W; a heating device configured to heat the substrate holder 52 from an outside thereof; a plating liquid supply 53 configured to supply a plating liquid L1 onto the substrate W being rotated while being held by the substrate holder 52; and a controller 3 configured to control operations of the substrate holder 52, the heating device and the plating liquid supply 53. The controller 3 controls the heating device to heat the substrate holder 52 to equal to or higher than 50° C. before the substrate W is held by the substrate holder 52.

A substrate liquid processing apparatus includes a substrate holder 52 configured to attract, hold and rotate a substrate W; a heating device configured to heat the substrate holder 52 from an outside thereof; a plating liquid supply 53 configured to supply a plating liquid L1 onto the substrate W being rotated while being held by the substrate holder 52; and a controller 3 configured to control operations of the substrate holder 52, the heating device and the plating liquid supply 53. The controller 3 controls the heating device to heat the substrate holder 52 to equal to or higher than 50° C. before the substrate W is held by the substrate holder 52.

A substitution gold plating solution for performing uniform gold plating directly on copper wiring of a printed circuit board is provided and a gold plating method using the same is provided, the solution comprising a purine-based compound or a pyrimidine-based compound having a carbonyl oxygen used as a localized corrosion inhibitor, a water-soluble gold compound, an aminocarboxylic acid as a complexing agent, a dicarboxylic acid as a conductivity improving agent, an α-hydroxycarboxylic acid and heteroaryl carboxylic acid as a base metal elution and reprecipitation preventing agent, a sulfite compound as a gold ion stabilizer, an axole compound as a surface corrosion inhibitor, other surfactants, crystal regulators, pH adjuster, and buffers. The substitution-type electroless gold plating solution according to the present invention prevents the localized corrosion of the copper surface, which is the base metal, and thus the gold plating film produced is excellent in solder mounting reliability.

A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.

A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.

Disclosed herein are articles having an edge that is partially, or entirely sealed with one or more coatings including a polymeric material. The article may include a coating selected so that one surface (e.g., a face surface) has a desired property (e.g., an appearance, such as a chrome appearance), and a second surface (e.g., a different face surface, or an edge surface) is covered with a different material, where the different coatings provide protection to at least the edge surface. Also disclosed are coating materials including a tracer component. Also disclosed are methods for coating a substrate. Also disclosed are methods for confirming the presence of a coating, particularly on an edge surface.

Disclosed herein are articles having an edge that is partially, or entirely sealed with one or more coatings including a polymeric material. The article may include a coating selected so that one surface (e.g., a face surface) has a desired property (e.g., an appearance, such as a chrome appearance), and a second surface (e.g., a different face surface, or an edge surface) is covered with a different material, where the different coatings provide protection to at least the edge surface. Also disclosed are coating materials including a tracer component. Also disclosed are methods for coating a substrate. Also disclosed are methods for confirming the presence of a coating, particularly on an edge surface.

Provided is a method of making a fiber comprising metal nanoparticles. The method includes steps of: Step (A): providing a fiber and a metal salt aqueous solution comprising first metal ions; Step (B): making the metal salt aqueous solution contact the fiber to form a fiber containing the first metal ions; and Step (C): contacting the fiber containing the first metal ions with a second metal, and performing a reduction reaction of the first metal ions to obtain the fiber comprising metal nanoparticles, wherein the fiber comprising metal nanoparticles comprises first metal nanoparticles from a reduction of the first metal ions; wherein a standard reduction potential of the first metal ions is greater than a standard reduction potential of an ionic state of the second metal, and a difference therebetween ranges from 0.4 V to 4.0 V.