A hydrogel is formed by a reaction which is induced, in an electrolytic solution, by an electrode product electrochemically generated by electrodes installed in the electrolytic solution. An apparatus including an electrolytic tank with a bottom surface on which a two-dimensional array of working electrodes is provided and a counter electrode installed in the electrolytic tank is prepared. An electrolytic solution containing a dissolved substance that causes electrolytic deposition of a hydrogel is housed in the electrolytic tank. By applying a predetermined voltage to one or more selected working electrodes of the two-dimensional array, a hydrogel with a two-dimensional pattern corresponding to the arrangement of the selected working electrodes is formed.

Methods and processes are described that enable the manufacture of a superior thin-walled mold from which higher-quality, less-costly disposable gloves can be more efficiently produced. The method can include creating a glove form in a sacrificial material; electroforming an electroformed master from the glove form; removing sacrificial material from the electroformed master; creating a tertiary form from the electroformed master; forming an initial copper layering on the tertiary form; and developing the initial copper layering into a thick copper plating to create a copper mold for gloves.

A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

An apparatus and method for electrochemically depositing a layer using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data, and for outputting a signal causing an anode array pattern; in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array thereby causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit.

A hydrogel is formed by a reaction which is induced, in an electrolytic solution, by an electrode product electrochemically generated by electrodes installed in the electrolytic solution. An apparatus including an electrolytic tank with a bottom surface on which a two-dimensional array of working electrodes is provided and a counter electrode installed in the electrolytic tank is prepared. An electrolytic solution containing a dissolved substance that causes electrolytic deposition of a hydrogel is housed in the electrolytic tank. By applying a predetermined voltage to one or more selected working electrodes of the two-dimensional array, a hydrogel with a two-dimensional pattern corresponding to the arrangement of the selected working electrodes is formed.

A hydrogel is formed by a reaction which is induced, in an electrolytic solution, by an electrode product electrochemically generated by electrodes installed in the electrolytic solution. An apparatus including an electrolytic tank with a bottom surface on which a two-dimensional array of working electrodes is provided and a counter electrode installed in the electrolytic tank is prepared. An electrolytic solution containing a dissolved substance that causes electrolytic deposition of a hydrogel is housed in the electrolytic tank. By applying a predetermined voltage to one or more selected working electrodes of the two-dimensional array, a hydrogel with a two-dimensional pattern corresponding to the arrangement of the selected working electrodes is formed.

A continuous process for manufacturing electrical current collectors for primary and secondary batteries by electrochemical deposition, comprising i) providing a first roll and a second roll for winding a continuous electrically conductive substrate co-acting as a working electrode, wherein depending on polarity the working electrode can act as an anode or a cathode, wherein the substrate has first and second parallel sides, a first side whereat deposition or partial dissolution occur, and a second side acting as a counter electrode to close a circuit.

A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.

3D metal printhead assembly method of manufacture that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.