Patent classifications
C25D1/04
COPPER ALLOY FILM WITH HIGH STRENGTH AND HIGH CONDUCTIVITY
A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.
Manufacturing apparatus of electrolytic copper foil
An apparatus for manufacturing an electrolytic copper foil includes an electrolytic bath defining a cavity for receiving an electrolyte; an internal drum partially disposed in the cavity; an outer drum in contact with a surface of the internal drum; a counter electrode positioned in the cavity of the electrolytic bath and positioned to be spaced apart from the internal drum by a predetermined distance; and a power supply unit electrically connecting the internal drum and the counter electrode.
Manufacturing apparatus of electrolytic copper foil
An apparatus for manufacturing an electrolytic copper foil includes an electrolytic bath defining a cavity for receiving an electrolyte; an internal drum partially disposed in the cavity; an outer drum in contact with a surface of the internal drum; a counter electrode positioned in the cavity of the electrolytic bath and positioned to be spaced apart from the internal drum by a predetermined distance; and a power supply unit electrically connecting the internal drum and the counter electrode.
METHOD FOR BLACKENING AN ELECTRICAL CONDUIT
A method of removing a plurality of portions of a black layer of an electrical conduit for a photovoltaic cell is disclosed. The method includes providing a mandrel having the electrical conduit electroformed in the mandrel. The electrical conduit is formed in a preformed pattern on an outer surface of the mandrel. The electrical conduit has the black layer with a black layer thickness on a side opposite of the outer surface of the mandrel. A beam of a laser is controlled toward the black layer of the electrical conduit. The beam is characterized by laser parameters. The beam of the laser removes the plurality of portions of the black layer on the electrical conduit. Each removed portion of the plurality of portions of the black layer has a thickness equal to the black layer thickness, and a portion area of 5 mm.sup.2 to 20 mm.sup.2.
ELECTROFORMING PROCESS
Process of electroforming a metal structure, in particular a structure with a tip protruding from adjacent outer layers. The process comprises the following steps; a first layer is deposited on a substrate followed by one or more next layers partially overlapping the first layer to form an intermediate structure having a substrate surface facing the substrate; in a next step, the intermediate structure is removed from the substrate and one or more further layers are deposited on said substrate surface of the intermediate structure.
Electrodeposited copper foil and copper clad laminate
An electrodeposited copper foil includes a bulk copper foil. When a weight of the electrodeposited copper foil is increased to 105.0 wt % during a thermogravimetric analysis (TGA) performed on the electrodeposited copper foil at a heating rate of 5° C./min and an air flow rate of 95 mL/min, a heating temperature of the TGA is defined as T.sub.105.0 wt % and in a range of 550° C. to 750° C.
Electrodeposited copper foil and copper clad laminate
An electrodeposited copper foil includes a bulk copper foil. When a weight of the electrodeposited copper foil is increased to 105.0 wt % during a thermogravimetric analysis (TGA) performed on the electrodeposited copper foil at a heating rate of 5° C./min and an air flow rate of 95 mL/min, a heating temperature of the TGA is defined as T.sub.105.0 wt % and in a range of 550° C. to 750° C.
METAL FOIL AND PREPARATION METHOD THEREOF, CURRENT COLLECTOR, ELECTRODE, BATTERY, AND ELECTRICAL DEVICE
This application provides a metal foil. The metal foil may include a first metal layer and a metal base layer that are stacked up. A roughness Rz of a surface that is of the metal base layer and that is oriented toward the first metal layer is α.sub.1 μm, a roughness Rz of a surface that is of the first metal layer and that is oriented back from the metal base layer is β.sub.1 μm, α.sub.1 may be in a range of 1.8 to 2.9, and β.sub.1 may be in a range of 1 to 1.4.
ZINC FOIL, BATTERY NEGATIVE ELECTRODE ACTIVE MATERIAL USING SAME, AND ZINC FOIL PRODUCTION METHOD
A zinc foil has a zinc crystal grain size of 0.2 μm or more and 50 μm or less. The zinc foil preferably includes: a base metal containing zinc; and a metal element other than zinc. The metal element preferably includes at least one selected from the group consisting of bismuth, indium, magnesium, calcium, gallium, tin, barium, strontium, silver, and manganese. It is also preferable that the content of the metal element is 10 ppm or more and 10000 ppm or less in terms of mass. It is also preferable that the zinc foil has an apparent density of 3 g/cm.sup.3 or more and 7 g/cm.sup.3 or less. The apparent density is based on contour measurement.
SACRIFICIAL NANOTRANSFER LITHOGRAPHY FOR THE METALIZATION OF PLASTICS
Processes for producing layered components that may include depositing a strike layer on a substrate; forming a nanomaterial layer on the strike layer, the nanomaterial layer having a nanotextured surface comprising a plurality of nanofeatures; embedding a polymeric material at least partially within the nanotextured surface; and separating the strike layer from the substrate to obtain the layered component. Layered components that may include a nanomaterial layer having a nanotextured surface comprising a plurality of nanofeatures; and a polymeric material at least partially embedded within the nanotextured surface. Nanotextured polymeric materials and layered components produced by various processes.