A container structure having one or more sections and a method for manufacturing such a structure is provided. Using an additive manufacturing process, a mold material is applied to produce a shaped substrate in the form of the desired sections and/or structure. Multiple reinforcement members are disposed within the substrate and extend between and are at least partially exposed at the inner and outer substrate surfaces. A coating material is applied to the inner and outer substrate surfaces and bonds to the exposed portions of the reinforcement members. The mold material is removed and replaced with another material among the reinforcement members between the substrate coatings.

A container structure having one or more sections and a method for manufacturing such a structure is provided. Using an additive manufacturing process, a mold material is applied to produce a shaped substrate in the form of the desired sections and/or structure. Multiple reinforcement members are disposed within the substrate and extend between and are at least partially exposed at the inner and outer substrate surfaces. A coating material is applied to the inner and outer substrate surfaces and bonds to the exposed portions of the reinforcement members. The mold material is removed and replaced with another material among the reinforcement members between the substrate coatings.

A method for manufacturing an electroforming mold, the method including: forming a pattern including a soluble portion and an insoluble portion in a photoresist layer stacked on a substrate; removing the soluble portion to form a cavity; and when a corner portion is formed in the soluble portion, forming a soluble portion corner correction portion that is configured to suppress a decrease in sharpness of the corner portion of the soluble portion in a region facing the corner portion of the soluble portion across a vertex of the corner portion of the soluble portion.

A method for manufacturing an electroforming mold, the method including: forming a pattern including a soluble portion and an insoluble portion in a photoresist layer stacked on a substrate; removing the soluble portion to form a cavity; and when a corner portion is formed in the soluble portion, forming a soluble portion corner correction portion that is configured to suppress a decrease in sharpness of the corner portion of the soluble portion in a region facing the corner portion of the soluble portion across a vertex of the corner portion of the soluble portion.

Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

A structure includes a metal layer and a graphene sheet having at least one hole. The graphene sheet is contained at least partly within the metal layer.

The present invention relates to microneedles, as well as arrays and methods thereof. In particular, the microneedle is hollow and extends from a flexible substrate. Methods for making such microneedles include depositing electroplating materials within a cavity of a mold and removing an electroplated layer from that mold. In some instances, the mold is formed from an elastomer, which can be removed and reused to produce additional microneedles.

The present invention relates to microneedles, as well as arrays and methods thereof. In particular, the microneedle is hollow and extends from a flexible substrate. Methods for making such microneedles include depositing electroplating materials within a cavity of a mold and removing an electroplated layer from that mold. In some instances, the mold is formed from an elastomer, which can be removed and reused to produce additional microneedles.

Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.