The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, fluid enters the cross flow manifold through channels in the channeled plate, and through a cross flow inlet, then exits at the cross flow exit, positioned opposite the cross flow inlet. The apparatus may switch between a sealed state and an unsealed state during electroplating, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal.

A smart electrochemical processing apparatus includes a reaction container, an electrode unit and a surface feature scanner. The reaction container has an electrolytic tank. The electrode unit has a first electrode fixed to the electrolytic tank and a second electrode rotatably positioned at the electrolytic tank. The surface feature scanner is positioned at the electrolytic tank. Before being put in the electrolytic tank for processing, a workpiece positioned at the second electrode is scanned with the surface feature scanner while being rotated by the second electrode. After surface feature data of the workpiece have been collected, various process parameters can be adjusted to thereby achieve satisfactory surface treatment of the workpiece.

A method of metal plating components includes placing a component and a spacer on a brochette, placing the brochette with the component and the spacer on a structure, and placing the structure with the brochette into a metal plating tank having a metal plating solution such that the component is submersed in the metal plating solution. The spacer is configured to mask a portion of the least one component and the component and the spacer are arranged on the brochette such that the spacer prevents the portion of the component from being contacted by the metal plating solution. The method also includes metal plating a surface of the component submersed in the metal plating solution, removing the structure with the brochette from the metal plating solution, drying the component on the brochette, and removing the dried component and the spacer from the brochette. Metal plating systems are also provided.

A method of metal plating components includes placing a component and a spacer on a brochette, placing the brochette with the component and the spacer on a structure, and placing the structure with the brochette into a metal plating tank having a metal plating solution such that the component is submersed in the metal plating solution. The spacer is configured to mask a portion of the least one component and the component and the spacer are arranged on the brochette such that the spacer prevents the portion of the component from being contacted by the metal plating solution. The method also includes metal plating a surface of the component submersed in the metal plating solution, removing the structure with the brochette from the metal plating solution, drying the component on the brochette, and removing the dried component and the spacer from the brochette. Metal plating systems are also provided.

A process for the continuous application of metallic layers on a body comprising providing an electrically conductive body having a surface with an outer surface area; providing a plating apparatus comprising a cylindrical, hollow anode having an internal volume and an inner surface area, an electrolyte having metal ions dissolved therein, a cathode; imparting a charge on said body using said cathode, generating an electrical field by applying an electrical current to said anode, feeding said electrolyte into said internal volume of said anode, feeding said body through said anode, such that said body contacts said electrolyte, whereby said ions plate onto said body, forming a metallic layer on the surface of said body, and withdrawing said body from the anode; wherein a ratio of said anode inner surface area to said body outer surface area is in the range between 2.6:1 to 26:1.

A process for the continuous application of metallic layers on a body comprising providing an electrically conductive body having a surface with an outer surface area; providing a plating apparatus comprising a cylindrical, hollow anode having an internal volume and an inner surface area, an electrolyte having metal ions dissolved therein, a cathode; imparting a charge on said body using said cathode, generating an electrical field by applying an electrical current to said anode, feeding said electrolyte into said internal volume of said anode, feeding said body through said anode, such that said body contacts said electrolyte, whereby said ions plate onto said body, forming a metallic layer on the surface of said body, and withdrawing said body from the anode; wherein a ratio of said anode inner surface area to said body outer surface area is in the range between 2.6:1 to 26:1.

An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate by using a processing liquid supplied to the processing target substrate includes a base body having a flat plate shape; and a direct electrode provided on a front surface of the base body and configured to be brought into contact with the processing liquid to apply a voltage between the processing target substrate and the direct electrode. An irregularity pattern is formed on a front surface of the electrolytic processing jig at a processing target substrate side.

An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate by using a processing liquid supplied to the processing target substrate includes a base body having a flat plate shape; and a direct electrode provided on a front surface of the base body and configured to be brought into contact with the processing liquid to apply a voltage between the processing target substrate and the direct electrode. An irregularity pattern is formed on a front surface of the electrolytic processing jig at a processing target substrate side.

The uniformity of electroplating a metal (e.g., copper) on a semiconductor wafer is improved by using an electroplating apparatus having a flow-shaping element positioned in the proximity of the semiconductor wafer, wherein the flow-shaping element is made of a resistive material and has two types of non-communicating channels made through the resistive material, such that the electrolyte is transported towards the substrate through both types of channels. The first type of channels is not perpendicular to the plane defined by a plating face of the substrate. The second type of channels is perpendicular to the plane defined by the plating face of the substrate. The channels of the first and second type are substantially spatially segregated. In one embodiment a plurality of channels of the first type are located in the central portion of the flow-shaping element and are surrounded by a plurality of channels of the second type.

The uniformity of electroplating a metal (e.g., copper) on a semiconductor wafer is improved by using an electroplating apparatus having a flow-shaping element positioned in the proximity of the semiconductor wafer, wherein the flow-shaping element is made of a resistive material and has two types of non-communicating channels made through the resistive material, such that the electrolyte is transported towards the substrate through both types of channels. The first type of channels is not perpendicular to the plane defined by a plating face of the substrate. The second type of channels is perpendicular to the plane defined by the plating face of the substrate. The channels of the first and second type are substantially spatially segregated. In one embodiment a plurality of channels of the first type are located in the central portion of the flow-shaping element and are surrounded by a plurality of channels of the second type.