A method of manufacture can comprise: treating a surface of a polymeric substrate with a laser induced graphene; and bonding a metallic layer to the laser induced graphene.

Disclosed herein are a catalyst for a hydrogen evolution reaction, a water electrolysis electrode including the same, and a method of manufacturing the same, wherein the catalyst can be manufactured at room temperature, and catalyst diversity can be given through an alloy structure including ruthenium and two or more metals. According to the present disclosure, the catalyst can be manufactured at room temperature due to characteristics of an electroplating manufacturing method, and the catalyst diversity can be given through the alloy structure that includes ruthenium and two or more metals.

Disclosed herein are a catalyst for a hydrogen evolution reaction, a water electrolysis electrode including the same, and a method of manufacturing the same, wherein the catalyst can be manufactured at room temperature, and catalyst diversity can be given through an alloy structure including ruthenium and two or more metals. According to the present disclosure, the catalyst can be manufactured at room temperature due to characteristics of an electroplating manufacturing method, and the catalyst diversity can be given through the alloy structure that includes ruthenium and two or more metals.

The present disclosure relates to the technical field of copper material preparation, in particular, to a low-transmission-loss single-crystal copper material and a preparation method thereof, a PCB and a preparation method thereof and an electronic component. The preparation method of the low-transmission-loss single-crystal copper material includes: forming a single-crystal copper layer on a substrate with a graphene layer on the surface in a mixed gas atmosphere of argon and hydrogen and at a temperature of 800-1065 C., then peeling off the single-crystal copper layer from the substrate. The volume ratio of argon and hydrogen in the mixed gas is (10-20):1. The preparation method of the low-transmission-loss single-crystal copper material provided by the present disclosure can significantly reduce the surface roughness Rz of the formed copper material, which is beneficial to further reducing the transmission loss of the entire low-transmission-loss single-crystal copper material, and the preparation method is simple and easy to operate.

The present disclosure relates to the technical field of copper material preparation, in particular, to a low-transmission-loss single-crystal copper material and a preparation method thereof, a PCB and a preparation method thereof and an electronic component. The preparation method of the low-transmission-loss single-crystal copper material includes: forming a single-crystal copper layer on a substrate with a graphene layer on the surface in a mixed gas atmosphere of argon and hydrogen and at a temperature of 800-1065 C., then peeling off the single-crystal copper layer from the substrate. The volume ratio of argon and hydrogen in the mixed gas is (10-20):1. The preparation method of the low-transmission-loss single-crystal copper material provided by the present disclosure can significantly reduce the surface roughness Rz of the formed copper material, which is beneficial to further reducing the transmission loss of the entire low-transmission-loss single-crystal copper material, and the preparation method is simple and easy to operate.

A method for manufacturing metal-CNT composites is disclosed. The method comprises providing an agglomerate of CNTs, filling interstices of the CNT agglomerate in a plating solution, so as to form a metal phase, in which the CNTs are embedded. The CNT agglomerate is compressed with a clamping appliance when the metal phase is formed. A further aspect of the invention relates to metal-CNT composites with high CNT content.

A method for manufacturing metal-CNT composites is disclosed. The method comprises providing an agglomerate of CNTs, filling interstices of the CNT agglomerate in a plating solution, so as to form a metal phase, in which the CNTs are embedded. The CNT agglomerate is compressed with a clamping appliance when the metal phase is formed. A further aspect of the invention relates to metal-CNT composites with high CNT content.

Embodiments relate to a display device, a heat dissipation plate, and a method of fabricating the display device. The display device includes a display panel and a heat dissipation plate disposed under the display panel. The heat dissipation plate includes a plurality of carbon fibers arranged in one direction and at least one metal particle. The metal particle is provided on a surface of at least one first carbon fiber among the plurality of carbon fibers and in contact with at least one second carbon fiber adjacent to the at least one first carbon fiber. According to embodiments, heat dissipation efficiency of the display device may be improved.

Embodiments relate to a display device, a heat dissipation plate, and a method of fabricating the display device. The display device includes a display panel and a heat dissipation plate disposed under the display panel. The heat dissipation plate includes a plurality of carbon fibers arranged in one direction and at least one metal particle. The metal particle is provided on a surface of at least one first carbon fiber among the plurality of carbon fibers and in contact with at least one second carbon fiber adjacent to the at least one first carbon fiber. According to embodiments, heat dissipation efficiency of the display device may be improved.

Exemplary methods of electroplating include contacting a patterned substrate with a plating bath in an electroplating chamber, where the pattern substrate includes at least one opening having a bottom surface and one or more sidewall surfaces. The methods may further include forming a nanotwin-containing metal material in the at least one opening. The metal material may be formed by two or more cycles that include delivering a forward current from a power supply through the plating bath of the electroplating chamber for a first period of time, plating a first amount of the metal on the bottom surface of the opening on the patterned substrate and a second amount of the metal on the sidewall surfaces of the opening, and delivering a reverse current from the power supply through the plating bath of the electroplating chamber to remove some of the metal plated in the opening on the patterned substrate.