A method for producing a structural material stack includes forming a composite panel that includes a carbon fiber reinforced polymer (CFRP) material, and applying an interface film on an exterior composite surface of the composite panel. The interface film is electrically conductive. The method includes performing an electroplating process to form a metallic coating on the interface film such that the interface film is sandwiched between the composite panel and the metallic coating. The metallic coating has a different material composition than the interface film.

Disclosed is a substrate processing method, which comprises the following steps: S1: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S2: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S3: electroplating a second metal layer on the first metal layer. By means of a step of forming a water film layer before electroplating in a plating chamber, the present invention has advantages of preventing delamination between two metal layers and solving product recess abnormality.

Disclosed is a substrate processing method, which comprises the following steps: S1: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S2: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S3: electroplating a second metal layer on the first metal layer. By means of a step of forming a water film layer before electroplating in a plating chamber, the present invention has advantages of preventing delamination between two metal layers and solving product recess abnormality.

A conductive substrate having high thermal conductivity includes a heat spreader, an insulating layer, and a conductive layer. The insulating layer is formed on a surface of the heat spreader, and the conductive layer is formed on the insulating layer. The heat spreader includes a porous carrier and a metal surface layer coated on an outside of the porous carrier. The porous carrier is made of a ceramic material and/or a hard carbon material. The metal surface layer is made of a highly thermally conductive metal material, and pores of the porous carrier are filled with the highly thermally conductive metal material.

A conductive substrate having high thermal conductivity includes a heat spreader, an insulating layer, and a conductive layer. The insulating layer is formed on a surface of the heat spreader, and the conductive layer is formed on the insulating layer. The heat spreader includes a porous carrier and a metal surface layer coated on an outside of the porous carrier. The porous carrier is made of a ceramic material and/or a hard carbon material. The metal surface layer is made of a highly thermally conductive metal material, and pores of the porous carrier are filled with the highly thermally conductive metal material.

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.

A method of preparing 2-hydroxyadpic acid and adipic acid is provided. The method of preparing 2-hydroxyadpic acid and adipic acid comprises a step of the electrolysis of 2,5-furandicarboxylic acid using a metal electrode at a constant current in a sulfuric acid solution containing a quaternary ammonium salt. The metal electrode is a bismuth electrode or a lead electrode. The quaternary ammonium salt is represented by formula (I):

##STR00001## wherein R.sub.1 to R.sub.4 are independently a C.sub.2-5 hydrocarbon group, and X.sup. is ClO.sub.4.sup., H.sub.2PO.sub.4.sup., or Br.sup..

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.