Metastable alloys have recently emerged as high-performance catalysts, extending the toolbox of binary alloy materials that can be utilized to mediate electrocatalytic reactions. In particular, nanostructured metastable ordered intermetallic compounds are particularly challenging to synthesize. Here the present invention is directed to a method for synthesizing sub-15 nm metastable ordered intermetallic Pd31Bi12 nanoparticles at room temperature, in a single step, by pulsed electrochemical deposition onto high surface area carbon supports. The resulting Pd31Bi12 nanoparticles displays a 7 enhancement of the mass activity relative to Pt/C and a 4 enhancement relative to Pd/C for the oxygen reduction reaction (ORR). The high performance of Pd31Bi12 nanoparticles is demonstrated to arise from reduced oxygen binding caused by alloying of Pd with Bi. The isolation of Pd-sites from each other facilitate methanol tolerant ORR behavior.

Metastable alloys have recently emerged as high-performance catalysts, extending the toolbox of binary alloy materials that can be utilized to mediate electrocatalytic reactions. In particular, nanostructured metastable ordered intermetallic compounds are particularly challenging to synthesize. Here the present invention is directed to a method for synthesizing sub-15 nm metastable ordered intermetallic Pd31Bi12 nanoparticles at room temperature, in a single step, by pulsed electrochemical deposition onto high surface area carbon supports. The resulting Pd31Bi12 nanoparticles displays a 7 enhancement of the mass activity relative to Pt/C and a 4 enhancement relative to Pd/C for the oxygen reduction reaction (ORR). The high performance of Pd31Bi12 nanoparticles is demonstrated to arise from reduced oxygen binding caused by alloying of Pd with Bi. The isolation of Pd-sites from each other facilitate methanol tolerant ORR behavior.

A method of making a microelectronic article includes depositing at least one redistribution layer on a glass-based substrate, wherein the depositing the at least one redistribution layer includes at least one cycle of electroplating the glass-based substrate with a metal material to form an electroplated metal material, annealing the glass-based substrate and the electroplated metal material at a ramp rate greater than or equal to 0.5 C./min and less than or equal to 10 C./min to a peak temperature greater than or equal to 200 C. and less than or equal to 400 C., and disposing a dielectric material at least one of on or between the electroplated metal material. The electroplated metal material includes a hysteresis loop greater than or equal to 10,000 MPa.Math. C.

A method of making a microelectronic article includes depositing at least one redistribution layer on a glass-based substrate, wherein the depositing the at least one redistribution layer includes at least one cycle of electroplating the glass-based substrate with a metal material to form an electroplated metal material, annealing the glass-based substrate and the electroplated metal material at a ramp rate greater than or equal to 0.5 C./min and less than or equal to 10 C./min to a peak temperature greater than or equal to 200 C. and less than or equal to 400 C., and disposing a dielectric material at least one of on or between the electroplated metal material. The electroplated metal material includes a hysteresis loop greater than or equal to 10,000 MPa.Math. C.