Patent classifications
C25D9/02
Aqueous solution method for manufacturing palladium doped electrode
A method for manufacturing a palladium coated doped metal oxide conducting electrode including immersing a metal oxide conducting electrode into an aqueous solution having a palladium precursor salt to form the metal oxide conducting electrode having at least one surface coated with palladium precursor. To form a layer of palladium nanoparticles on the metal oxide conducting electrode the palladium precursor on the metal oxide conducting is reduced with a borohydride compound. The palladium nanoparticles on the metal oxide conducting electrode have an average diameter of 8 nm to 22 nm and are present on the surface of the metal oxide conducting electrode at a density from 1.510.sup.3 Pd.Math.nm.sup.2 to 3.510.sup.3 Pd.Math.nm.sup.2.
Method for making a Pd-doped zinc oxide conducting electrode
A method for manufacturing a palladium coated doped metal oxide conducting electrode including immersing a metal oxide conducting electrode into an aqueous solution having a palladium precursor salt to form the metal oxide conducting electrode having at least one surface coated with palladium precursor. To form a layer of palladium nanoparticles on the metal oxide conducting electrode the palladium precursor on the metal oxide conducting is reduced with a borohydride compound. The palladium nanoparticles on the metal oxide conducting electrode have an average diameter of 8 nm to 22 nm and are present on the surface of the metal oxide conducting electrode at a density from 1.510.sup.3 Pd.Math.nm.sup.2 to 3.510.sup.3 Pd.Math.nm.sup.2.
Method for preparing polyaniline/ruthenium oxide/tin dioxide composite electrode material
The present invention provides a method for preparing a polyaniline/RuO.sub.2/SnO.sub.2 composite electrode material, including: sputtering a SnO.sub.2 film onto a tantalum substrate by a magnetron sputtering method, to form a SnO.sub.2 layer; preparing porous-structured RuO.sub.2 nanoparticles with a uniform pore size distribution (10-15 nm) by a template method; and embedding polyaniline into the RuO.sub.2 nanoparticle matrix by a electrodeposition method, to finally obtain a multilayer-structured polyaniline/RuO.sub.2/SnO.sub.2 composite electrode material with a specific capacitance value of 680-702 F.Math.g1 and an excellent cycling charge-discharge performance after it is assembled into an electrochemical capacitor.
Method for preparing polyaniline/ruthenium oxide/tin dioxide composite electrode material
The present invention provides a method for preparing a polyaniline/RuO.sub.2/SnO.sub.2 composite electrode material, including: sputtering a SnO.sub.2 film onto a tantalum substrate by a magnetron sputtering method, to form a SnO.sub.2 layer; preparing porous-structured RuO.sub.2 nanoparticles with a uniform pore size distribution (10-15 nm) by a template method; and embedding polyaniline into the RuO.sub.2 nanoparticle matrix by a electrodeposition method, to finally obtain a multilayer-structured polyaniline/RuO.sub.2/SnO.sub.2 composite electrode material with a specific capacitance value of 680-702 F.Math.g1 and an excellent cycling charge-discharge performance after it is assembled into an electrochemical capacitor.
METAL OR METAL ALLOY DEPOSITION COMPOSITION AND PLATING COMPOUND
The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.
METAL OR METAL ALLOY DEPOSITION COMPOSITION AND PLATING COMPOUND
The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.
Systems and methods for electrodepositing manganese oxide with improved rate capabilities for electrical energy storage
Systems and methods that facilitate enhancing the energy storage capabilities of MnO.sub.2 in nanowire energy storage devices such as nanowire-based capacitors or batteries.
Systems and methods for electrodepositing manganese oxide with improved rate capabilities for electrical energy storage
Systems and methods that facilitate enhancing the energy storage capabilities of MnO.sub.2 in nanowire energy storage devices such as nanowire-based capacitors or batteries.
BATHLESS METAL-COMPOSITE ELECTROPLATING
A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.
BATHLESS METAL-COMPOSITE ELECTROPLATING
A bathless method for plating a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.