Patent classifications
C25D9/02
ELECTROCHEMICAL ATTACHMENT OF PHOSPHONIC ACIDS TO METALLIC SUBSTRATES AND OSTEOCONDUCTIVE MEDICAL DEVICES CONTAINING SAME
A method of preparing a modified-metal surface by attaching a phosphorous-based acid to a surface of a metal: preparing a solution of the phosphorous-based acid in a protic solvent; immersing a strip of a metal work piece into the solution of the phosphorous-based acid, immersing a strip of a reference metal into the solution of the phosphorous-based acid, supplying a voltage for a duration of time, removing the metal work piece, cleaning the metal work piece, and drying the cleaned metal work piece under an inert atmosphere to obtain a modified metal work piece.
ELECTROCHEMICAL ATTACHMENT OF PHOSPHONIC ACIDS TO METALLIC SUBSTRATES AND OSTEOCONDUCTIVE MEDICAL DEVICES CONTAINING SAME
A method of preparing a modified-metal surface by attaching a phosphorous-based acid to a surface of a metal: preparing a solution of the phosphorous-based acid in a protic solvent; immersing a strip of a metal work piece into the solution of the phosphorous-based acid, immersing a strip of a reference metal into the solution of the phosphorous-based acid, supplying a voltage for a duration of time, removing the metal work piece, cleaning the metal work piece, and drying the cleaned metal work piece under an inert atmosphere to obtain a modified metal work piece.
Passivating Fissures in Substrates
Provided in one example is a sensor having at least one fissure, the fissure being at least partially filled by at least one polymer formation extending vertically within a passivation layer. The polymer formation protects the underlying metal containing layer from corrosive solutions. Provided in another example is a method of forming the polymer formation in a fissure of a sensor.
Passivating Fissures in Substrates
Provided in one example is a sensor having at least one fissure, the fissure being at least partially filled by at least one polymer formation extending vertically within a passivation layer. The polymer formation protects the underlying metal containing layer from corrosive solutions. Provided in another example is a method of forming the polymer formation in a fissure of a sensor.
Electropolymerization onto flexible substrates for electronic applications
Electropolymerized polymer or copolymer films on a conducting substrate (e.g., graphene) and methods of making such films. The films may be part of multilayer structures. The films can be formed by anodic or cathodic electropolymerization of monomers. The films and structures (e.g., multilayer structures) can be used in devices such as, for example, electrochromic devices, electrical-energy storage devices, photo-voltaic devices, field-effect transistor devices, electrical devices, electronic devices, energy-generation devices, and microfluidic devices.
Electropolymerization onto flexible substrates for electronic applications
Electropolymerized polymer or copolymer films on a conducting substrate (e.g., graphene) and methods of making such films. The films may be part of multilayer structures. The films can be formed by anodic or cathodic electropolymerization of monomers. The films and structures (e.g., multilayer structures) can be used in devices such as, for example, electrochromic devices, electrical-energy storage devices, photo-voltaic devices, field-effect transistor devices, electrical devices, electronic devices, energy-generation devices, and microfluidic devices.
Multi-layered coating film formation method
A problem to be solved by the present invention is to provide a method for forming a multilayer coating film, the method being capable of achieving excellent finished appearance and excellent corrosion resistance without affecting electrodeposition coatability even when a part or all of the water-washing step is omitted after chemical conversion treatment, and to provide a coated article. The invention provides a method for forming a multilayer coating film, comprising forming a chemical conversion coating film and an electrodeposition coating film on a metal substrate by Step 1 of immersing a metal substrate in a chemical conversion treatment solution to form a chemical conversion coating film, and Step 2 of omitting a part or all of the water-washing step, and performing electrodeposition coating on the metal substrate using a cationic electrodeposition coating composition to form an electrodeposition coating film, wherein when the electrodeposition coating is performed in Step 2, the solution adhered to and/or deposited on the metal substrate has an electrical conductivity of less than 10,000 S/cm.
Multi-layered coating film formation method
A problem to be solved by the present invention is to provide a method for forming a multilayer coating film, the method being capable of achieving excellent finished appearance and excellent corrosion resistance without affecting electrodeposition coatability even when a part or all of the water-washing step is omitted after chemical conversion treatment, and to provide a coated article. The invention provides a method for forming a multilayer coating film, comprising forming a chemical conversion coating film and an electrodeposition coating film on a metal substrate by Step 1 of immersing a metal substrate in a chemical conversion treatment solution to form a chemical conversion coating film, and Step 2 of omitting a part or all of the water-washing step, and performing electrodeposition coating on the metal substrate using a cationic electrodeposition coating composition to form an electrodeposition coating film, wherein when the electrodeposition coating is performed in Step 2, the solution adhered to and/or deposited on the metal substrate has an electrical conductivity of less than 10,000 S/cm.
Solution composition and method for single-bath post treatment of substrate
Disclosed is a solution composition which may be used for a single-bath electrochemical passivation and a method using the same. The solution composition includes a metal cation, a metal-oxide anion; and an organic ligand, and optionally includes a non-metallic oxide anion or a polymer. The solution composition may prevent undesired precipitation of metal oxides before performing passivation. In addition, the method of passivation using the solution composition in a single-bath use is also provided.
Solution composition and method for single-bath post treatment of substrate
Disclosed is a solution composition which may be used for a single-bath electrochemical passivation and a method using the same. The solution composition includes a metal cation, a metal-oxide anion; and an organic ligand, and optionally includes a non-metallic oxide anion or a polymer. The solution composition may prevent undesired precipitation of metal oxides before performing passivation. In addition, the method of passivation using the solution composition in a single-bath use is also provided.