An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

A nickel film is formed on the surface of a metal substrate with a solid electrolyte membrane in contact with a metal substrate while suppressing the corrosion taking place on the metal substrate by a method of forming a nickel film comprising: disposing an anode, a metal substrate that functions as a cathode, and a solid electrolyte membrane comprising a solution that contains nickel ions and chloride ions, such that the solid electrolyte membrane is disposed between the anode and the metal substrate and in contact with the surface of the metal substrate; and applying a voltage between the anode and the metal substrate, so as to form a nickel film on the surface of the metal substrate that is in contact with the solid electrolyte membrane, wherein the concentration of the chloride ions is 0.002 to 0.1 mol/l.

Provided is a film forming apparatus for forming a metal film, capable of uniformly pressurizing a substrate surface with an electrolyte membrane subjected to the fluid pressure of an electrolytic solution containing metal ions during film formation even when an insoluble anode is used. A housing of the apparatus includes a partition member between the anode and the electrolyte membrane, for partitioning a housing chamber into first and second housing chambers. The partition member includes a porous body impregnated with cation exchange resin. The first housing chamber houses the anode insoluble in a first electrolytic solution. The second housing chamber has formed therein a hermetically sealed space in which a second electrolytic solution containing metal ions is enclosed within the housing, by the electrolyte membrane and the partition member. The apparatus is also provided with a pump (pressure unit) that pressurizes the second electrolytic solution in the second housing chamber.

A plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode (3001); step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value P.sub.11 and continue with a period T.sub.11 (3002); step 3: when the period T.sub.11 ends, adjusting the first plating power supply applied on the first anode to output a power value P.sub.12 and continue with a period T.sub.12, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value P.sub.21 and continue with a period T.sub.21 (3003); and step 4: when the period T.sub.21 ends, adjusting the second plating power supply applied on the second anode to output a power value P.sub.22 and continue with a period T.sub.22; wherein step 2 to step 4 are performed periodically.

An electrochemical deposition system configured for electrochemical plating of a substrate includes a chamber, an electrode, a plating cup and a controller. The chamber holds a plating bath. The electrode is disposed in the plating bath. The plating cup includes a contact ring. The contact ring includes contacts. The contacts are immersed in the plating bath. The controller is configured to apply a voltage signal across the contact ring and the electrode to remove residual from the contacts. The voltage signal includes a plating-de-plating waveform. The plating-de-plating waveform includes multiple cycles. Each of the cycles includes a pair of pulses with different polarity.

Embodiments of the present technology include electroplating methods that include providing a first portion of an electrolyte feedstock to a first compartment of an electrochemical cell. The first portion of an electrolyte feedstock may be characterized by an initial metal ion concentration and an initial acid concentration. The methods may include providing a second portion of an electrolyte feedstock to a second compartment of the electrochemical cell. The second compartment and first compartment may be separated by a first membrane. The methods may include providing an acidic solution to a third compartment of the electrochemical cell. The third compartment and second compartment may be separated by a second membrane. The acidic solution may be characterized by an initial acid concentration. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the first membrane.

Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemical cell. The first compartment and second compartment may be separated by a membrane. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the membrane. The methods may include forming an anolyte and catholyte precursor.

An apparatus, system and redox membrane for efficient lithium-ion extraction from natural salt waters or geothermal brines or manmade sources such as from lithium battery recycling are provided. The redox membrane is selective for lithium ions over other spectator ions making the system capable of selectively extracting lithium-ions from multiple-ion source solutions. The system uses the redox membrane as an electrochemically active material acting as a Li-selective membrane for direct lithium extraction from a lithium-ion source. The redox membrane is also not porous to solvents and is stable in caustic and high temperature environments. The features of the redox membrane and system allow the recovery of lithium from low purity sources and the production of higher purity products at reduced costs and process steps over conventional processes.

A plating membrane includes a support structure extending radially outward from a nozzle that is to direct a flow of a plating solution toward a wafer. The plating membrane also includes a frame, supported by the support structure, having an inner wall that is angled outward from the nozzle. The outward angle of the inner wall relative to the nozzle directs a flow of plating solution from the nozzle in a manner that increases uniformity of the flow of the plating solution toward the wafer, reduces the amount of plating solution that is redirected inward toward the center of the plating membrane, reduces plating material voids in trenches of the wafer (e.g., high aspect ratio trenches), and/or the like.

A film that contains Ni.sub.2O.sub.3H as a main component.