A plating apparatus including a thief electrode that can be suitably maintained is provided. The plating apparatus includes a substrate holder holding a substrate, a thief electrode supporter supporting a thief electrode to be disposed outside the substrate, a plating tank configured to immerse the substrate in a plating solution for applying an electroplating treatment, a thief electrode maintenance tank configured to perform maintenance of the thief electrode, and a transport module configured to transport the thief electrode supporter to the plating tank and the thief electrode maintenance tank.

A plating apparatus including a thief electrode that can be suitably maintained is provided. The plating apparatus includes a substrate holder holding a substrate, a thief electrode supporter supporting a thief electrode to be disposed outside the substrate, a plating tank configured to immerse the substrate in a plating solution for applying an electroplating treatment, a thief electrode maintenance tank configured to perform maintenance of the thief electrode, and a transport module configured to transport the thief electrode supporter to the plating tank and the thief electrode maintenance tank.

The present disclosure illustrates a vertical electroplating module and an electroplating method for a fan-out panel level chip. The vertical electroplating module has an electroplating tank module, an exhaust tank module and a clamping module. A first box of the electroplating tank module has a first receiving chamber, a second receiving chamber and a third receiving chamber, the first receiving chamber is communicated with a bottom of the second receiving chamber, and a top of the second receiving chamber is communicated with the third receiving chamber. The exhaust tank module is communicated with the first receiving chamber and the third receiving chamber respectively via a first pump and a second pump. The clamping module is disposed around the opening on a wall of the second receiving chamber. The production made by the vertical electroplating module can meet a single-side production, without immersing the entire product in the chemical medicine.

The present disclosure illustrates a vertical electroplating module and an electroplating method for a fan-out panel level chip. The vertical electroplating module has an electroplating tank module, an exhaust tank module and a clamping module. A first box of the electroplating tank module has a first receiving chamber, a second receiving chamber and a third receiving chamber, the first receiving chamber is communicated with a bottom of the second receiving chamber, and a top of the second receiving chamber is communicated with the third receiving chamber. The exhaust tank module is communicated with the first receiving chamber and the third receiving chamber respectively via a first pump and a second pump. The clamping module is disposed around the opening on a wall of the second receiving chamber. The production made by the vertical electroplating module can meet a single-side production, without immersing the entire product in the chemical medicine.

Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.

Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

An electrodeposition system, for additive manufacturing of a three-dimensional structure, includes at least one electrochemical cell. The at least one electrochemical cell includes a receptacle containing an electrolytic bath. At least one nozzle opens from the receptacle toward and proximate a substrate, which is configured as a working electrode of the at least one electrochemical cell. The at least one electrochemical cell also includes a counter electrode disposed in the electrolytic bath. In a method for forming a three-dimensional structure, a metal salt, dissolved in the electrolytic salt, flows through the nozzle to deposit a metal of the metal salt on a surface of the substrate configured as the working electrode. The system may be configured for relative movement between the at least one nozzle and the substrate, enabling additive manufacturing of a three-dimensional structure by electrodeposition.

A film forming device that avoids a leakage of a liquid electrolyte and a method for forming a metal film using the film forming device are provided. The film forming device to form the metal film includes an anode, a cathode, a solid electrolyte membrane disposed between the anode and the cathode, a solution container that defines a solution containing space between the anode and the solid electrolyte membrane, and a power supply that applies a voltage between the anode and the cathode. The solid electrolyte membrane includes a first surface exposed to the solution containing space and a second surface opposed to the cathode, and is dividable along a division surface having no common point with the first surface or the second surface.

A decoupled plating system is provided for producing lithium. In a general embodiment, the present disclosure provides a feed tank configured to supply a lithium-rich aqueous electrolyte stream, a plating tank that is configured to receive an organic electrolyte and plate out lithium metal from that organic electrolyte, and one or more lithium replenishment cells configured to receive both electrolytes, keep them separated, and selectively move lithium ions from the aqueous electrolyte into the spent organic electrolyte stream. The present system and process can advantageously reduce operating costs and/or improve energy efficiency in production of lithium metal and associated products.