A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.

An anode titanium basket and a continuous electroplating apparatus including the same are provided. The continuous electroplating apparatus includes an electroplating tank, an anode titanium basket, a rotating conductive roller set, and a power supply. The electroplating tank has an electroplating solution accommodation space. The anode titanium basket is disposed in the electroplating solution accommodation space and includes an accommodation space and a channel. The accommodation space consists of a first surface, a second surface, and a side surface. The channel includes a first channel opening penetrating through the first surface and a second channel opening corresponding to the first channel opening and penetrating through the second surface. The rotating conductive roller set corresponds to the first channel opening and the second channel opening. The power supply is disposed outside the electroplating tank and is electrically connected to the rotating conductive roller set and the anode titanium basket.

An anode titanium basket and a continuous electroplating apparatus including the same are provided. The continuous electroplating apparatus includes an electroplating tank, an anode titanium basket, a rotating conductive roller set, and a power supply. The electroplating tank has an electroplating solution accommodation space. The anode titanium basket is disposed in the electroplating solution accommodation space and includes an accommodation space and a channel. The accommodation space consists of a first surface, a second surface, and a side surface. The channel includes a first channel opening penetrating through the first surface and a second channel opening corresponding to the first channel opening and penetrating through the second surface. The rotating conductive roller set corresponds to the first channel opening and the second channel opening. The power supply is disposed outside the electroplating tank and is electrically connected to the rotating conductive roller set and the anode titanium basket.

A plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. The plating apparatus includes a plating tank 410 for housing a plating solution, an anode 430 arranged in the plating tank 410, a substrate holder 440 for holding a substrate Wf with a surface to be plated facing downward, a rotation mechanism 447 for rotating the substrate holder 440, and a shielding mechanism 460 moving a shielding member 482 between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.

A plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. The plating apparatus includes a plating tank 410 for housing a plating solution, an anode 430 arranged in the plating tank 410, a substrate holder 440 for holding a substrate Wf with a surface to be plated facing downward, a rotation mechanism 447 for rotating the substrate holder 440, and a shielding mechanism 460 moving a shielding member 482 between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.

A device, method, and equipment for improving the electroplating uniformity in wafer electroplating. The device includes an electroplating component and an electroplating rate adjustment component. The electroplating component includes an electroplating head, an electroplating tank, an anode metal and a power supply. The electroplating rate adjustment component includes an auxiliary electrode assembly, a switching device and a control module. The auxiliary electrode assembly consists of auxiliary electrodes, a circuit resistor assembly and a support ring structure. The auxiliary electrode is set on the support ring structure, and when the auxiliary electrode is connected to the circuit resistor assembly, the support ring body can be controlled to lift or rotate, bringing the auxiliary electrode closer to or farther from the wafer notch, thereby adjusting the electroplating rate at the notch.

A device, method, and equipment for improving the electroplating uniformity in wafer electroplating. The device includes an electroplating component and an electroplating rate adjustment component. The electroplating component includes an electroplating head, an electroplating tank, an anode metal and a power supply. The electroplating rate adjustment component includes an auxiliary electrode assembly, a switching device and a control module. The auxiliary electrode assembly consists of auxiliary electrodes, a circuit resistor assembly and a support ring structure. The auxiliary electrode is set on the support ring structure, and when the auxiliary electrode is connected to the circuit resistor assembly, the support ring body can be controlled to lift or rotate, bringing the auxiliary electrode closer to or farther from the wafer notch, thereby adjusting the electroplating rate at the notch.

An electroplating fluid disturbance device includes a first supporting plate, a linking member, a spout and a pivoting member. The first supporting plate has a pivoting portion. A first portion of the linking member is close to the pivoting portion of the first supporting plate. The spout is located on the linking member. The spout has a nozzle. The nozzle is configured to be immersed in the electroplating fluid. One end of the pivoting member is pivoted to the pivoting portion of the first supporting plate. The other end of the pivoting member connects to the spout and the first portion of the linking member. When the first portion of the linking member moves, the pivoting member rotates relative to the pivoting portion and the spout moves along with the first portion of the linking member, so that the nozzle of the spout rotates to disturb the electroplating fluid.

An electroplating fluid disturbance device includes a first supporting plate, a linking member, a spout and a pivoting member. The first supporting plate has a pivoting portion. A first portion of the linking member is close to the pivoting portion of the first supporting plate. The spout is located on the linking member. The spout has a nozzle. The nozzle is configured to be immersed in the electroplating fluid. One end of the pivoting member is pivoted to the pivoting portion of the first supporting plate. The other end of the pivoting member connects to the spout and the first portion of the linking member. When the first portion of the linking member moves, the pivoting member rotates relative to the pivoting portion and the spout moves along with the first portion of the linking member, so that the nozzle of the spout rotates to disturb the electroplating fluid.