A semiconductor apparatus for pre-wetting a semiconductor workpiece includes a process chamber, a workpiece holder disposed within the process chamber to hold the semiconductor workpiece, a pre-wetting fluid tank disposed outside the process chamber and containing a pre-wetting fluid, and a conduit coupled to the pre-wetting fluid tank and extending into the process chamber. The conduit delivers the pre-wetting fluid from the pre-wetting fluid tank out through an outlet of the conduit to wet a major surface of the semiconductor workpiece, wherein the outlet of the conduit is positioned above the major surface of the semiconductor workpiece by a vertical distance.

A semiconductor apparatus for pre-wetting a semiconductor workpiece includes a process chamber, a workpiece holder disposed within the process chamber to hold the semiconductor workpiece, a pre-wetting fluid tank disposed outside the process chamber and containing a pre-wetting fluid, and a conduit coupled to the pre-wetting fluid tank and extending into the process chamber. The conduit delivers the pre-wetting fluid from the pre-wetting fluid tank out through an outlet of the conduit to wet a major surface of the semiconductor workpiece, wherein the outlet of the conduit is positioned above the major surface of the semiconductor workpiece by a vertical distance.

A plating device of the present invention includes a cell including a porous body surrounding a metal component and impregnated with a plating solution, and a plating electrode surrounding the porous body, in which a distance between the plating electrode and a surface of the metal component is substantially uniform.

A plating device of the present invention includes a cell including a porous body surrounding a metal component and impregnated with a plating solution, and a plating electrode surrounding the porous body, in which a distance between the plating electrode and a surface of the metal component is substantially uniform.

A plating apparatus (10) is disclosed including a plating tank (9), cathodes (1a to 1f), a holding mechanism (2), at least one anode (3), and a rotation mechanism (4). The plating tank (9) contains an annularly or helically wound substrate (90) together with a plating solution. The cathodes (1a to 1f) are placed inside the plating tank (9). The holding mechanism (2) holds the cathodes (1a to 1f) at positions electrically connected to the outer periphery of the substrate (90) and holds the substrate (90) via the cathodes (1a to 1f). The anode (3) is placed at least on the inner periphery side of the substrate (90) held by the holding mechanism (2). The rotation mechanism (4) rotates at least either the substrate (90) and cathodes (1a to 1f) held by the holding mechanism (2) or the anode (3), or both, around the axis of the wound substrate (90).

A plating apparatus (10) is disclosed including a plating tank (9), cathodes (1a to 1f), a holding mechanism (2), at least one anode (3), and a rotation mechanism (4). The plating tank (9) contains an annularly or helically wound substrate (90) together with a plating solution. The cathodes (1a to 1f) are placed inside the plating tank (9). The holding mechanism (2) holds the cathodes (1a to 1f) at positions electrically connected to the outer periphery of the substrate (90) and holds the substrate (90) via the cathodes (1a to 1f). The anode (3) is placed at least on the inner periphery side of the substrate (90) held by the holding mechanism (2). The rotation mechanism (4) rotates at least either the substrate (90) and cathodes (1a to 1f) held by the holding mechanism (2) or the anode (3), or both, around the axis of the wound substrate (90).

Provided are an anode holder capable of reducing consumption of an additive in a plating apparatus, and a plating apparatus. An anode holder for holding an anode for use in a plating apparatus is provided, and the anode holder includes an inner space formed in the anode holder, to house the anode, a mask including a plurality of holes, and configured to cover a front surface of the inner space, and a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space.

Provided are an anode holder capable of reducing consumption of an additive in a plating apparatus, and a plating apparatus. An anode holder for holding an anode for use in a plating apparatus is provided, and the anode holder includes an inner space formed in the anode holder, to house the anode, a mask including a plurality of holes, and configured to cover a front surface of the inner space, and a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space.

A semiconductor apparatus includes a process chamber, a workpiece holder and a pre-wetting fluid tank. The workpiece holder is disposed within the process chamber to hold a semiconductor workpiece. The pre-wetting fluid tank is disposed outside the process chamber, wherein the workpiece holder comprises an inner sidewall, an outer sidewall and a channel between the inner sidewall and the outer sidewall, the channel is coupled to the pre-wetting fluid tank, and the outer sidewall is higher than the inner sidewall relative to a major surface of the semiconductor workpiece.

A semiconductor apparatus includes a process chamber, a workpiece holder and a pre-wetting fluid tank. The workpiece holder is disposed within the process chamber to hold a semiconductor workpiece. The pre-wetting fluid tank is disposed outside the process chamber, wherein the workpiece holder comprises an inner sidewall, an outer sidewall and a channel between the inner sidewall and the outer sidewall, the channel is coupled to the pre-wetting fluid tank, and the outer sidewall is higher than the inner sidewall relative to a major surface of the semiconductor workpiece.