A method of electropolishing an internal passageway of a component, wherein the passageway has an inlet and an outlet; including: providing an electrode assembly including a flexible electrode, a shuttle and a guide cable extending between the flexible electrode and the shuttle; inserting the shuttle into the inlet; causing fluid to flow through the passageway to transport the shuttle through the passageway from the inlet towards the outlet; pulling the guide cable through the passageway to position the electrode in the passageway adjacent to a region of the passageway to be polished; and electropolishing the passageway using the electrode while moving the electrode within the passageway. Also, an electrode assembly for electropolishing an internal passageway of a component, including: a flexible electrode, a shuttle, and a guide cable extending between the flexible electrode and the shuttle.

A method of electropolishing an internal passageway of a component, wherein the passageway has an inlet and an outlet; including: providing an electrode assembly including a flexible electrode, a shuttle and a guide cable extending between the flexible electrode and the shuttle; inserting the shuttle into the inlet; causing fluid to flow through the passageway to transport the shuttle through the passageway from the inlet towards the outlet; pulling the guide cable through the passageway to position the electrode in the passageway adjacent to a region of the passageway to be polished; and electropolishing the passageway using the electrode while moving the electrode within the passageway. Also, an electrode assembly for electropolishing an internal passageway of a component, including: a flexible electrode, a shuttle, and a guide cable extending between the flexible electrode and the shuttle.

Provided is a solid vaporization/supply system of metal halide for thin film deposition that reduces particle contamination. The system includes a vaporizable source material container for storing and vaporizing a metal halide and buffer tank coupled with the vaporizable source material container. The vaporizable source material container includes a container main body with a container wall; a lid body; fastening members; and joint members, wherein the container wall is configured to have a double-wall structure composed of an inner wall member and outer wall member, which allows a carrier gas to be led into the container main body via its space. The container wall is fabricated of 99 to 99.9999% copper, 99 to 99.9996% aluminum, or 99 to 99.9996% titanium, and wherein the container main body, the lid body, the fastening members, and the joint members are treated by fluorocarbon polymer coating and/or by electrolytic polishing.

A method for manufacture of a complex component includes construction of the component from a metal material in an additive manufacturing method with at least one cavity segment that has a cavity open on at least one side and defined by an interior surface of the component, formation of an auxiliary electrode during construction of the component, formation of one or a plurality of supporting structures that connect the auxiliary electrode to the interior surface of the component during the construction of the component, electrical insulation of the auxiliary electrode from the interior surface by separating the supporting structures from the interior surface or from the auxiliary electrode, and performance of an electro-polishing of the interior surface in an electrolyte bath by connecting the component and the auxiliary electrode to different poles of an electric voltage source.

A system and methods are provided for electrochemical grinding a workpiece. In one embodiment, a method includes controlling potentials to grinding tool and the workpiece, controlling applying electrolyte, and controlling grinding of the workpiece by the grinding tool. The method may also include determining screen replacement when there is sufficient metal plated.

A system and methods are provided for electrochemical grinding a workpiece. In one embodiment, a method includes controlling potentials to grinding tool and the workpiece, controlling applying electrolyte, and controlling grinding of the workpiece by the grinding tool. The method may also include determining screen replacement when there is sufficient metal plated.

A method of controlling a working gap between one or more cathodic tools and an anodic workpiece in an electrochemical material dissolution process, the method comprising: providing a cathodic tool and an anodic workpiece defining a working gap therebetween, the cathodic tool and the workpiece being at least partially immersed in a conductive electrolyte solution; providing a negative electrical potential to the cathodic tool; monitoring one or more of the electrical potential, current, current density and charge between the cathodic tool and the anode to determine the working gap between the cathodic tool and the anode; and, controlling one or more process parameters to maintain one or more of the working gap and electrochemical working conditions between the cathodic tool and anodic workpiece at a targeted value.

Provided are an electrode, an electrolysis cell, and an electrochemical analyzer that improve the long-term stability of analysis data. A working electrode, a counter electrode, and reference electrode are disposed in an electrolysis cell. The working electrode is obtained by forming a lead wire in a composite material having platinum or a platinum alloy as a base material, in which a metal oxide is dispersed, or in a laminated material obtained by laminating a valve metal and platinum such that the cross sectional crystal texture in the thickness direction of the platinum is formed in layers and the thickness of each layer of the platinum is 5 micrometers or less. The metal oxide is selected from among zirconium oxide, tantalum oxide, and niobium oxide, and the metal oxide content of the platinum or the platinum alloy is 0.005 to 1 wt % in terms of the zirconium, tantalum, or niobium metal.

Blood pump assemblies and methods of manufacturing and operating blood pump assemblies are provided. The blood pump assembly includes a pump and an impeller blade rotatably coupled to the pump. The blood pump assembly also includes a pump housing component sized for passage through a body lumen and coupled to the pump. The pump housing component includes a peripheral wall extending about a rotation axis of the impeller blade. The peripheral wall includes an inner peripheral wall surface and an outer peripheral wall surface. The peripheral wall also includes one or more blood exhaust apertures. Each blood exhaust aperture in the one or more blood exhaust apertures is defined by an inner aperture edge and an outer aperture edge. Each inner aperture edge is chamfered between the inner peripheral wall surface and the outer peripheral wall surface.

Blood pump assemblies and methods of manufacturing and operating blood pump assemblies are provided. The blood pump assembly includes a pump and an impeller blade rotatably coupled to the pump. The blood pump assembly also includes a pump housing component sized for passage through a body lumen and coupled to the pump. The pump housing component includes a peripheral wall extending about a rotation axis of the impeller blade. The peripheral wall includes an inner peripheral wall surface and an outer peripheral wall surface. The peripheral wall also includes one or more blood exhaust apertures. Each blood exhaust aperture in the one or more blood exhaust apertures is defined by an inner aperture edge and an outer aperture edge. Each inner aperture edge is chamfered between the inner peripheral wall surface and the outer peripheral wall surface.