Provided is a GaAs wafer having suppressed carrier concentration and low dislocation density, as well as a large proportion of the area of a region with zero dislocation density to the GaAs wafer surface. The GaAs wafer has a silicon concentration of 1.010.sup.17 cm.sup.3 or more and less than 1.110.sup.18 cm.sup.3; an indium concentration of 3.010.sup.18 cm.sup.3 or more and less than 3.010.sup.19 cm.sup.3; a boron concentration of 2.510.sup.18 cm.sup.3 or more; a carrier concentration of 1.010.sup.16 cm.sup.3 or more and 4.010.sup.17 cm.sup.3 or less; and a proportion of the area of a region with zero dislocation density to the wafer surface of 91.0% or more.

The present invention relates to an orthogonal-phase compound and its nonlinear optical (NLO) crystal of BaGa.sub.7Se.sub.7, its producing method and uses thereof. Polycrystalline orthogonal-phase BaGa.sub.4Se.sub.7 was prepared by a high-temperature solid-phase reaction in a sealed silica tube. Large size single crystals of orthogonal-phase BaGa.sub.4Se.sub.7 could be prepared by the flux method or Bridgman method. BaGa.sub.4Se.sub.7 crystallizes in the point group mm2. Orthogonal-phase BaGa.sub.4Se.sub.7 has a powder second harmonic generation (SHG) efficiency of about 5 times that of AgGaS.sub.2 and is phase-matchable. The orthogonal-phase BaGa.sub.4Se.sub.7 is non-hygroscopic and has good mechanical properties, which makes it easy to cut, polish, and coat by normal processing. The orthogonal-phase BaGa.sub.4Se.sub.7 crystal has never been cracked during cutting and polishing. The orthogonal-phase compound and NLO crystal of BaGa.sub.4Se.sub.7 can be used as NLO devices.

The present invention relates to an orthogonal-phase compound and its nonlinear optical (NLO) crystal of BaGa.sub.7Se.sub.7, its producing method and uses thereof. Polycrystalline orthogonal-phase BaGa.sub.4Se.sub.7 was prepared by a high-temperature solid-phase reaction in a sealed silica tube. Large size single crystals of orthogonal-phase BaGa.sub.4Se.sub.7 could be prepared by the flux method or Bridgman method. BaGa.sub.4Se.sub.7 crystallizes in the point group mm2. Orthogonal-phase BaGa.sub.4Se.sub.7 has a powder second harmonic generation (SHG) efficiency of about 5 times that of AgGaS.sub.2 and is phase-matchable. The orthogonal-phase BaGa.sub.4Se.sub.7 is non-hygroscopic and has good mechanical properties, which makes it easy to cut, polish, and coat by normal processing. The orthogonal-phase BaGa.sub.4Se.sub.7 crystal has never been cracked during cutting and polishing. The orthogonal-phase compound and NLO crystal of BaGa.sub.4Se.sub.7 can be used as NLO devices.

Disclosed is a method for preparing polycrystalline silicon ingot. The preparation method comprises: coating inner wall of the crucible with a layer of silicon nitride, followed by laying a layer of crushed silicon and feeding silicon in the crucible; the crushed silicon is laid in random order, and the layer of crushed silicon forms a supporting structure having numerous holes; melting the silicon to form molten silicon by heating, when solid-liquid interface reach the surface of the layer of crushed silicon or when the layer of crushed silicon melt partially, regulating thermal field to achieve supercooled state to grow crystals;after the crystallization of molten silicon is completely finished, performing annealing and cooling to obtain polycrystalline silicon ingot. By adopting the preparation method, a desirable initial nucleus can be obtained for a polycrystalline silicon ingot, so as to reduce dislocation multiplication during the growth of the polycrystalline silicon ingot.

The present disclosure relates to a process for fabricating a crystalline scintillator material with a structure of elpasolite type of theoretical composition A.sub.2BC.sub.(1-y)M.sub.yX.sub.(6-y) wherein: A is chosen from among Cs, Rb, K, Na, B is chosen from among Li, K, Na, C is chosen from among the rare earths, Al, Ga, M is chosen from among the alkaline earths, X is chosen from among F, Cl, Br, I,
y representing the atomic fraction of substitution of C by M and being in the range extending from 0 to 0.05, comprising its crystallization by cooling from a melt bath comprising r moles of A and s moles of B, the melt bath in contact with the material containing A and B in such a way that 2s/r is above 1. The process shows an improved fabrication yield. Moreover, the crystals obtained can have compositions closer to stoichiometry and have improved scintillation properties.

The present disclosure relates to a process for fabricating a crystalline scintillator material with a structure of elpasolite type of theoretical composition A.sub.2BC.sub.(1-y)M.sub.yX.sub.(6-y) wherein: A is chosen from among Cs, Rb, K, Na, B is chosen from among Li, K, Na, C is chosen from among the rare earths, Al, Ga, M is chosen from among the alkaline earths, X is chosen from among F, Cl, Br, I,
y representing the atomic fraction of substitution of C by M and being in the range extending from 0 to 0.05, comprising its crystallization by cooling from a melt bath comprising r moles of A and s moles of B, the melt bath in contact with the material containing A and B in such a way that 2s/r is above 1. The process shows an improved fabrication yield. Moreover, the crystals obtained can have compositions closer to stoichiometry and have improved scintillation properties.

A process for fabricating a crystalline scintillator material with an elpasolite structure that has a theoretical composition of A.sub.2BC.sub.(1-y)M.sub.yX.sub.(6-y) can include conducting crystallization by cooling from a melt bath including r moles of A and s moles of B. A is chosen from Cs, Rb, K, and Na. B is chosen from Li, K, and Na. C is chosen from athe rare earth elements, Al, and Ga. M is chosen from the alkaline earth elements. X is chosen from F, Cl, Br, and I, and y represents the atomic fraction of substitution of C by M and is in the range extending from 0 to 0.05. The melt bath can be in contact with the material containing A and B in such a way that 2s/r is above 1. The process shows an improved fabrication yield. The crystals formed therefrom can have improved scintillation properties.

A process for fabricating a crystalline scintillator material with an elpasolite structure that has a theoretical composition of A.sub.2BC.sub.(1-y)M.sub.yX.sub.(6-y) can include conducting crystallization by cooling from a melt bath including r moles of A and s moles of B. A is chosen from Cs, Rb, K, and Na. B is chosen from Li, K, and Na. C is chosen from athe rare earth elements, Al, and Ga. M is chosen from the alkaline earth elements. X is chosen from F, Cl, Br, and I, and y represents the atomic fraction of substitution of C by M and is in the range extending from 0 to 0.05. The melt bath can be in contact with the material containing A and B in such a way that 2s/r is above 1. The process shows an improved fabrication yield. The crystals formed therefrom can have improved scintillation properties.

Disclosed is a method for preparing polycrystalline silicon ingot. The preparation method comprises: randomly laying seed crystals with unlimited crystal orientation at the bottom of crucible to form a layer of seed crystals and obtaining disordered crystalline orientations; providing molten silicon above the layer of seed crystals, controlling the temperature at the bottom of the crucible, making the layer of seed crystals not completely melted; controlling the temperature inside the crucible, making the molten silicon growing above the seed crystals, the molten silicon inheriting the structure of the seed crystals, then obtaining polycrystalline silicon ingot. By adopting the preparation method, a desirable initial nucleus can be obtained for a polycrystalline silicon ingot, so as to reduce dislocation multiplication during the growth of the polycrystalline silicon ingot.

Disclosed is a preparation method of a polycrystalline silicon ingot. The preparation method comprises: providing a silicon nucleation layer at the bottom of a crucible, and filling a silicon material above the silicon nucleation layer; heating the silicon material to melt same, adjusting the thermal field inside the crucible to make the melted silicon material to start crystallization on the basis of the silicon nucleation layer; and when the crystallization is finished, performing annealing and cooling to obtain a polycrystalline silicon ingot. By adopting the preparation method, a desirable initial nucleus can be obtained for a polycrystalline silicon ingot, so as to reduce dislocation multiplication during the growth of the polycrystalline silicon ingot. Further disclosed are a polycrystalline silicon ingot obtained through the preparation method and a polycrystalline silicon wafer made using the polycrystalline silicon ingot as a raw material.