Patent classifications
C30B15/36
Cylindrical silicon ingot manufacturing method
Provided is a cylindrical ingot manufacturing method including: an operation of supplying a silicon raw material to an inside of a crucible and heating the crucible to melt the silicon raw material; an operation of supplying a seed crystal having one end fastened to a seed shaft to the inside of the crucible; and an operation of moving the seed crystal from a lower portion of the crucible to an upper portion thereof by the crucible rotating in one direction relative to the seed shaft and the seed shaft rotating in the other direction and moving upward. According to the present disclosure, since a ring-shaped seed crystal is grown, a cylindrical silicon ingot can be manufactured, and since a cylindrical silicon ingot having an inner diameter is formed, a wafer retaining ring can be manufactured from the ingot without a coring task.
Cylindrical silicon ingot manufacturing method
Provided is a cylindrical ingot manufacturing method including: an operation of supplying a silicon raw material to an inside of a crucible and heating the crucible to melt the silicon raw material; an operation of supplying a seed crystal having one end fastened to a seed shaft to the inside of the crucible; and an operation of moving the seed crystal from a lower portion of the crucible to an upper portion thereof by the crucible rotating in one direction relative to the seed shaft and the seed shaft rotating in the other direction and moving upward. According to the present disclosure, since a ring-shaped seed crystal is grown, a cylindrical silicon ingot can be manufactured, and since a cylindrical silicon ingot having an inner diameter is formed, a wafer retaining ring can be manufactured from the ingot without a coring task.
SINGLE CRYSTAL SILICON INGOT AND METHOD OF GROWING THE SAME
Disclosed is a method of growing a single crystal silicon ingot, including dipping a seed in a silicon melt, and sequentially growing a neck, a shoulder, and a body from the seed by pulling the seed, growing the neck includes growing a first neck part configured to have a cross-sectional area decreased from the seed, and growing a second neck part configured to have a constant cross-sectional area from the first neck part, and, in growing the first neck part, the seed is pulled at a speed equal to or less than 2.0 mm/min.
APPARATUS AND METHOD FOR GROWTH OF GALLIUM OXIDE CRYSTAL WITH AN OFFCUT
Apparatuses and methods as described herein can be used to grow a Ga.sub.2O.sub.3 based single crystal using an Edge-defined film fed growth (EFG) method. The single gallium oxide crystal sheet can have a principal plane is offcut from a (100) crystallographic orientation. In one embodiment, the offcut is between 2 and 20 degrees. The single crystal can have a full width half mass of less than 50 arcsec.
APPARATUS AND METHOD FOR GROWTH OF GALLIUM OXIDE CRYSTAL WITH AN OFFCUT
Apparatuses and methods as described herein can be used to grow a Ga.sub.2O.sub.3 based single crystal using an Edge-defined film fed growth (EFG) method. The single gallium oxide crystal sheet can have a principal plane is offcut from a (100) crystallographic orientation. In one embodiment, the offcut is between 2 and 20 degrees. The single crystal can have a full width half mass of less than 50 arcsec.
CYLINDRICAL SILICON INGOT MANUFACTURING METHOD
Provided is a cylindrical ingot manufacturing method including: an operation of supplying a silicon raw material to an inside of a crucible and heating the crucible to melt the silicon raw material; an operation of supplying a seed crystal having one end fastened to a seed shaft to the inside of the crucible; and an operation of moving the seed crystal from a lower portion of the crucible to an upper portion thereof by the crucible rotating in one direction relative to the seed shaft and the seed shaft rotating in the other direction and moving upward. According to the present disclosure, since a ring-shaped seed crystal is grown, a cylindrical silicon ingot can be manufactured, and since a cylindrical silicon ingot having an inner diameter is formed, a wafer retaining ring can be manufactured from the ingot without a coring task.
CYLINDRICAL SILICON INGOT MANUFACTURING METHOD
Provided is a cylindrical ingot manufacturing method including: an operation of supplying a silicon raw material to an inside of a crucible and heating the crucible to melt the silicon raw material; an operation of supplying a seed crystal having one end fastened to a seed shaft to the inside of the crucible; and an operation of moving the seed crystal from a lower portion of the crucible to an upper portion thereof by the crucible rotating in one direction relative to the seed shaft and the seed shaft rotating in the other direction and moving upward. According to the present disclosure, since a ring-shaped seed crystal is grown, a cylindrical silicon ingot can be manufactured, and since a cylindrical silicon ingot having an inner diameter is formed, a wafer retaining ring can be manufactured from the ingot without a coring task.
Bismuth-substituted rare earth iron garnet single crystal, faraday rotator, optical isolator, and production method for bismuth-substituted rare earth iron garnet single crystal
A bismuth-substituted rare earth iron garnet single crystal suitable for Faraday rotators and optical isolators with reduced insertion loss due to suppressed valence fluctuation of Fe ions is provided. The bismuth-substituted rare earth iron garnet single crystal of the present invention is characterized by the composition formula (Gd.sub.aLn.sub.bBi.sub.cMg.sub.3(a+b+c))(Fe.sub.dGa.sub.eTi.sub.fPt.sub.5(d+e+f))O.sub.12. In the composition formula above, 0.02f0.05, 0.02{3(a+b+c)}0.08, and 0.01{3(a+b+c)}{f+5(d+e+f)}0.01. Ln is a rare earth element and may be selected from Eu, Dy, Gd, Ho, Tm, Yb, Lu, and Y.
Piezoelectric single crystal M.SUB.3.RE(PO.SUB.4.).SUB.3 .and the preparation method and application thereof
A crystal is of a non-centrosymmetric structure and belongs to the 43 m point group of the cubic crystal system. M denotes an alkaline earth metal, which can be Ba, Ca, or Sr, and RE denotes a rare earth element, which can be Y, La, Gd, or Yb. The growth method of the M.sub.3RE(PO.sub.4).sub.3 crystal comprises steps as follows: (1) polycrystalline material synthesis: MCO.sub.3, RE.sub.2O.sub.3, and phosphorous compound are used as raw materials and blended according to the stoichiometric proportions; then, the phosphorous compound is further added to be excessive; the raw materials are sintered twice to obtain the M.sub.3RE(PO.sub.4).sub.3 polycrystalline material; (2) polycrystalline material melting; (3) Czochralski crystal growth. The M.sub.3RE(PO.sub.4).sub.3 crystal prepared by the invention is a high-quality single crystal.
Piezoelectric single crystal M.SUB.3.RE(PO.SUB.4.).SUB.3 .and the preparation method and application thereof
A crystal is of a non-centrosymmetric structure and belongs to the 43 m point group of the cubic crystal system. M denotes an alkaline earth metal, which can be Ba, Ca, or Sr, and RE denotes a rare earth element, which can be Y, La, Gd, or Yb. The growth method of the M.sub.3RE(PO.sub.4).sub.3 crystal comprises steps as follows: (1) polycrystalline material synthesis: MCO.sub.3, RE.sub.2O.sub.3, and phosphorous compound are used as raw materials and blended according to the stoichiometric proportions; then, the phosphorous compound is further added to be excessive; the raw materials are sintered twice to obtain the M.sub.3RE(PO.sub.4).sub.3 polycrystalline material; (2) polycrystalline material melting; (3) Czochralski crystal growth. The M.sub.3RE(PO.sub.4).sub.3 crystal prepared by the invention is a high-quality single crystal.