A technical object of the present invention is to devise a glass sheet that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and has high end surface strength, and a method of manufacturing the glass sheet, to thereby contribute to an increase in density of a semiconductor package. The glass sheet of the present invention has a total thickness variation of less than 2.0 μm, all or part of an end surface of the glass sheet including a melt-solidified surface.

Methods of fabricating a glass ribbon comprise the step of bending a glass ribbon in a cutting zone to provide a bent target segment with a bent orientation in the cutting zone. The methods further include the step of severing at least one of the edge portions from the central portion of the bent target segment within the cutting zone. Further methods are provided including the step of bending a glass ribbon in a bending zone downstream from a downward zone, wherein the glass ribbon includes an upwardly concave surface through the bending zone. The methods further include the step of severing at least one of the edge portions from the central portion of a target segment within the bending zone.

Methods of processing a glass ribbon are provided. The method includes the step of traversing the glass ribbon through a travel path at a predetermined velocity and severing the glass ribbon to create an upstream web and a downstream web. The method further includes the step of increasing a relative velocity of a downstream edge portion with respect to an upstream edge portion to create a gap between an upstream severed edge and a downstream severed edge. In other example methods, a segment of the glass ribbon is removed to create a gap between an upstream severed edge and a downstream severed edge. In still further example methods, an upstream severed edge is directed along a second travel path to create a gap between the upstream severed edge and a downstream severed edge.

Methods and devices for producing a composite pane having a functional coating are presented. The functional coating is applied to part of a surface of a base pane, and a first pane is cut out from the base pane while introducing a frame-shaped peripheral coating-free region into the functional coating having an inner region that is not adjacent a side edge of the first pane. The surface of the first pane with the functional coating is then bonded via a thermoplastic intermediate layer to a surface of a second pane.

A method of cutting a glass sheet is disclosed. The method comprises heating a heating element to a heat temperature, which in turn heats a glass sheet along a desired cutting line, to a separation temperature. The glass sheet is subjected to non-destructive pressure at an edge on the cutting line. The non-destructive pressure may be applied by a tool with opposed sharp edges so long as the edges do not nick or otherwise score the glass sheet. A diagonal cutter may be utilized as the sharp-edged tool. After an adequate amount of heating time, the glass sheet will achieve the separation temperature and spontaneously separate along the heated cutting line.

An internal feature can be laser machined in strengthened glass sheets or panels by first laser machining a first scribe in a first surface proximate to the internal feature to be laser machined. The internal feature can be then laser machined by positioning a beam waist of a laser beam proximate to an opposite second surface by focusing the laser beam through the strengthened glass panel from the first surface. The internal feature is laser machined by repositioning the beam waist from the second surface to the first surface while removing material from a kerf surrounding the internal feature. When the laser beam waist is finally positioned proximate to the first surface material, the internal shape formed by the laser machining is easily and cleanly removed from the surrounding glass.

Cutting a desired final shape in a glass sheet, wherein the glass sheet is about 0.3 mm or less in thickness by applying a laser beam to the glass and continuously moving the laser relative to the glass along the cutting line. The laser is of a circular shape, and cooling fluid is applied simultaneously with the application of the laser, such that the cooling fluid at least reduces the temperature of the glass in order to propagate a fracture in the glass. The method includes controlling at least one of: (i) an energy density of the laser, (ii) a velocity of the laser relative to the glass along the cutting line, (iii) a fluid flow of the cooling fluid, and (iv) a minimum radius of curvature of the cutting line, such that a B10 edge strength of a cut edge of the glass is at least about 300 MPa.

Electrochromic device laminates and their method of manufacture are disclosed.

An invisible laser system and an optical path visualization method thereof are disclosed. The invisible laser system comprises an invisible laser light generator for generating invisible laser light; a visible light generator for generating visible light; and an optical path visualization component arranged in optical paths of the invisible and visible light, and comprising a first and second incident end and a first outgoing end. The invisible laser light is incident on the first incident end, and the visible light is incident on the second incident end. All of the invisible laser light and at least part of the visible light are emitted in parallel with each other at the first outgoing end. All of the invisible laser light is present in a direction parallel with the optical path of the visible light, and no invisible laser light is present in other directions, so radiation risks are eliminated.

Welding-apparatus configured to weld base-material through wire-material melted by welding-laser, includes: laser-applicator configured to apply welding-laser to welding-area; wire-feeder configured to feed wire-material to welding-area; detector provided on wire-feeder and configured to detect feed-amount of wire-material or reaction-force from wire-material; moving-unit configured to move welding-area or wire-material; controller configured to respectively control laser-applicator, wire-feeder, and moving-unit. Controller is configured to perform: controlling wire-feeder to stop feeding wire-material to welding-area; then controlling laser-applicator to stop applying welding-laser to welding-area; then controlling moving-unit so that welding-area and wire-material are separated from each other; determining whether wire-material has been welded to base-material based on feed-amount of wire-material or reaction-force from wire-material detected by detector; and controlling laser-applicator to apply cutting-laser when it is determined that wire-material has been welded to base-material.