The disclosure relates to a touch panel. The touch panel includes a substrate having a surface, a metal nanowire film, at least one electrode, and a conductive trace. The metal nanowire film includes a metal nanowire film. The metal nanowire film includes a number of first metal nanowire bundles parallel with and spaced from each other. Each of the number of first metal nanowire bundles includes a number of first metal nanowires parallel with each other. The first distance between adjacent two of the number of first metal nanowires is less than the second distance between adjacent two of the number of first metal nanowire bundles.

The multilayer wiring film which is provided with a wiring layer that is formed of Cu or a Cu alloy and has an electrical resistance of 10 cm or less and a CuX alloy layer that contains Cu and an element X and is arranged above and/or below the wiring layer, and wherein the element X is composed of at least one element selected from the group X consisting of Al, Mn, Zn and Ni, and the metals constituting the CuX alloy layer have a specific composition. The multilayer wiring film is able to provide a multilayer wiring film which has low electrical resistance and is free from film separation during the formation of a SiOx film by a CVD method, said SiOx film serving as an interlayer insulating film, and which is also free from an increase in the electrical resistance even if subjected to a high-temperature heat treatment that is carried out at 400 C. or higher.

The multilayer wiring film which is provided with a wiring layer that is formed of Cu or a Cu alloy and has an electrical resistance of 10 cm or less and a CuX alloy layer that contains Cu and an element X and is arranged above and/or below the wiring layer, and wherein the element X is composed of at least one element selected from the group X consisting of Al, Mn, Zn and Ni, and the metals constituting the CuX alloy layer have a specific composition. The multilayer wiring film is able to provide a multilayer wiring film which has low electrical resistance and is free from film separation during the formation of a SiOx film by a CVD method, said SiOx film serving as an interlayer insulating film, and which is also free from an increase in the electrical resistance even if subjected to a high-temperature heat treatment that is carried out at 400 C. or higher.

A synthetic quartz glass substrate having front and back surfaces is worked by lapping, etching, mirror polishing, and cleaning steps for thereby polishing the front surface of the substrate to a mirror-like surface. The etching step is carried out using a hydrofluoric acid solution at pH 4-7.

A synthetic quartz glass substrate having front and back surfaces is worked by lapping, etching, mirror polishing, and cleaning steps for thereby polishing the front surface of the substrate to a mirror-like surface. The etching step is carried out using a hydrofluoric acid solution at pH 4-7.

A method for producing a pane having an electrically conductive coating is described. The method includes applying an electrically conductive coating onto a substrate, identifying defects of the coating, focusing the radiation of a laser having an annular beam profile on the coating, wherein the annular beam profile surrounds the defect, and producing an annular de-coated region by simultaneously removing the coating in the region of the beam profile.

A method for producing a pane having an electrically conductive coating is described. The method includes applying an electrically conductive coating onto a substrate, identifying defects of the coating, focusing the radiation of a laser having an annular beam profile on the coating, wherein the annular beam profile surrounds the defect, and producing an annular de-coated region by simultaneously removing the coating in the region of the beam profile.

The glass panel unit includes a first glass substrate, a second glass substrate, a sealing member, an inside space, and a plurality of spacers. The inside space is hermetically enclosed by the first glass substrate, the second glass substrate, and the sealing member, and has reduced pressure. The plurality of spacers are placed in the inside space. At least one of the first glass substrate and the second glass substrate is a wire-embedded glass panel with a wire structure embedded therein. The plurality of spacers are arranged so as to overlap with part of the wire structure in a plan view.

The glass panel unit includes a first glass substrate, a second glass substrate, a sealing member, an inside space, and a plurality of spacers. The inside space is hermetically enclosed by the first glass substrate, the second glass substrate, and the sealing member, and has reduced pressure. The plurality of spacers are placed in the inside space. At least one of the first glass substrate and the second glass substrate is a wire-embedded glass panel with a wire structure embedded therein. The plurality of spacers are arranged so as to overlap with part of the wire structure in a plan view.

A glass-film laminate or article having a narrow failure distribution or a Weibull modulus of greater than 10. In embodiments, the glass-film laminate or article includes at least one first film disposed on a strengthened glass substrate. A first film or any additional films can exhibit an average strain-to-failure that is less than the strain-to-failure of the strengthened glass substrate. In embodiments, the first first film is adhered to the glass substrate such that the first film does not exhibit visible delamination from the glass substrate. Methods of forming glass-film laminates or articles with a desired strength level and narrow failure strength distrubution are also disclosed.