C03C27/10

SPANDREL

A spandrel including a first substrate, an intermediate film made of polymer material, and a second, opaque substrate, such that the first substrate is coated with at most two layers which are deposited on the surface located on the side facing the intermediate film made of polymer material and which include at least one upper dielectric layer.

Carrier substrate, laminate, and method for manufacturing electronic device

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Carrier substrate, laminate, and method for manufacturing electronic device

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

METHOD FOR MANUFACTURING A SET OF OPTICAL GUIDE MICROSTRUCTURES
20220357503 · 2022-11-10 · ·

A diamond turning station having a drum able to be rotated about an axis C and a diamond tip. A piece to be machined P is installed on the drum as follows: the piece to be machined P is offset by a distance D from the rotation axis of the drum; the piece to be machined P is placed so that there is a mean angle Theta between the axis C and a cutting profile corresponding to the active surfaces, the angle Theta being as follows: Theta=arccos (D/Ry), where Ry is a radius of curvature required in the long direction of the microstructures. Next, the diamond tip is moved along the cutting profile of the microstructures, while actuating the rotation of the drum, so as to machine all the microstructures on the surface of the piece to be machined P.

METHOD FOR MANUFACTURING A SET OF OPTICAL GUIDE MICROSTRUCTURES
20220357503 · 2022-11-10 · ·

A diamond turning station having a drum able to be rotated about an axis C and a diamond tip. A piece to be machined P is installed on the drum as follows: the piece to be machined P is offset by a distance D from the rotation axis of the drum; the piece to be machined P is placed so that there is a mean angle Theta between the axis C and a cutting profile corresponding to the active surfaces, the angle Theta being as follows: Theta=arccos (D/Ry), where Ry is a radius of curvature required in the long direction of the microstructures. Next, the diamond tip is moved along the cutting profile of the microstructures, while actuating the rotation of the drum, so as to machine all the microstructures on the surface of the piece to be machined P.

INTERMEDIATE FILM FOR LAMINATED GLASS, LAMINATED GLASS, AND IMAGE DISPLAY SYSTEM

An interlayer film for laminated glass of the present invention is an interlayer film for laminated glass comprising two or more resin layers, and comprising a first resin layer comprising a resin and a light diffusion particle and having a thickness of 150 μm or less, in which a total light transmittance is less than 70%.

LOW-TEMPERATURE FIRED, LEAD-FREE GLASS FRIT, PASTE, AND VACUUM GLASS ASSEMBLY USING SAME
20230101150 · 2023-03-30 ·

A glass frit according to this application may include a composition of P.sub.2O.sub.5, V.sub.2O.sub.5, TeO.sub.2, CuO, ZnO, and BaO configured to replace a conventional lead glass composition and enable a low temperature calcination. A coefficient of thermal expansion (CTE) of the glass frit may be matched with that of a glass substrate. The composition may not include an inorganic filler or at least reduce a content of an inorganic filler to reduce or prevent separation and breakage and to improve durability. The glass frit may be used as a paste for a vacuum glass assembly.

Laminated film for bonding and light-transmitting laminate including same
11571882 · 2023-02-07 · ·

The laminated film for bonding comprises: a first layer; a second layer disposed opposite to the first layer; and a third layer interposed between the first layer and the second layer, wherein the laminated film comprises a first end having a first thickness and a second end having a second thickness different from the first thickness, and a measuring area disposed between the first end and the second end and having a center thickness, wherein the center thickness is less than or equal to a middle value of the first thickness and the second thickness, wherein a penetration coefficient (F.sub.pe) at the measuring area is 1.35 kgf/mm.sup.2*mm or more, and wherein, a ratio of a sum of a thickness of the first layer and a thickness of the second layer to a thickness of the third layer is 100:12 to 24.

Interlayer for laminated glass, method for producing interlayer for laminated glass, and laminated glass
11613105 · 2023-03-28 · ·

The present invention aims to provide an interlayer film for a laminated glass that enables production of a laminated glass having high visible light transmittance even when deaeration for preliminary pressure bonding and heating for final pressure bonding are performed in parallel in a vacuum deaeration method. The present invention also aims to provide a method for producing the interlayer film for a laminated glass, and a laminated glass including the interlayer film for a laminated glass. Provided is an interlayer film for a laminated glass having a multitude of recesses on at least one surface, the surface with the recesses having a texture aspect ratio Str of 0.04 or lower as measured in conformity with ISO 25178.

Electronic device having a curved surface
11614646 · 2023-03-28 · ·

An electronic device is provided. The electronic device includes a back frame, a panel disposed on the back frame, a protective substrate disposed on the panel, and an adhesive element disposed on a portion of the back frame. The back frame and the protective substrate adhere to each other via the adhesive element.