A hose is provided capable of meeting fireproof requirements per AS1055 under no flow condition. The hose has multiple layers including a yttria-stabilized zirconia (YSZ) flexible ceramic substrate layer disposed between first and second silicone rubber layers.

A hose is provided capable of meeting fireproof requirements per AS1055 under no flow condition. The hose has multiple layers including a yttria-stabilized zirconia (YSZ) flexible ceramic substrate layer disposed between first and second silicone rubber layers.

According to an aspect of the invention, there is provided a plasma-resistant member including: a base member; and a layer structural component formed at a surface of the base member, the layer structural component including an yttria polycrystalline body and being plasma resistant, the layer structural component including a first uneven structure, and a second uneven structure formed to be superimposed onto the first uneven structure, the second uneven structure having an unevenness finer than an unevenness of the first uneven structure.

According to an aspect of the invention, there is provided a plasma-resistant member including: a base member; and a layer structural component formed at a surface of the base member, the layer structural component including an yttria polycrystalline body and being plasma resistant, the layer structural component including a first uneven structure, and a second uneven structure formed to be superimposed onto the first uneven structure, the second uneven structure having an unevenness finer than an unevenness of the first uneven structure.

In example implementations, a method for extracting layers of build material into a carrier. The method includes providing a layer of build material onto a bed. Portions of the layer of build material on the bed are digitally printed with a liquid functional material (LFM). The method repeats providing the layer of build material and digitally printing without applying energy to the LFM to define a structure in layers of build material on the bed. The layers of build material are extracted into a carrier and the carrier is removed.

In example implementations, a method for extracting layers of build material into a carrier. The method includes providing a layer of build material onto a bed. Portions of the layer of build material on the bed are digitally printed with a liquid functional material (LFM). The method repeats providing the layer of build material and digitally printing without applying energy to the LFM to define a structure in layers of build material on the bed. The layers of build material are extracted into a carrier and the carrier is removed.

The invention concerns a method for coating a core (1) for producing a turbomachine part (2) by isostatic compacting, for example a leading-edge shield of a blade, the coating method comprising the steps of:—S1: covering the core (1) by means of a first solution comprising a first refractory component configured to oppose the diffusion of species, the first component comprising a metal oxide,—S2: covering the core (1) by means of a second solution comprising a second component designed to bind the first component in such a way as to form a homogeneous layer, the second component comprising a mineral binder;—S3: applying a heat treatment to the covered core (1) in such a way as to dry the solution and solidify the coating.

The invention concerns a method for coating a core (1) for producing a turbomachine part (2) by isostatic compacting, for example a leading-edge shield of a blade, the coating method comprising the steps of:—S1: covering the core (1) by means of a first solution comprising a first refractory component configured to oppose the diffusion of species, the first component comprising a metal oxide,—S2: covering the core (1) by means of a second solution comprising a second component designed to bind the first component in such a way as to form a homogeneous layer, the second component comprising a mineral binder;—S3: applying a heat treatment to the covered core (1) in such a way as to dry the solution and solidify the coating.

A substrate support structure includes a substrate support structure body formed from a ceramic composite and having a first surface, a second surface spaced apart from the first surface, and a periphery spanning the first surface and the second surface of the substrate support structure body. The first surface, the second surface, and the periphery of the substrate support structure body are defined by the ceramic composite. The ceramic composite includes two or more of a (a) an aluminum nitride (AlN) constituent, (b) an aluminum oxynitride (Al.sub.2.81O.sub.3.56N.sub.0.44, AlON) constituent, (c) an alpha-alumina (α-Al.sub.2O.sub.3) constituent, (d) a yttrium alumina garnet (Y.sub.3Al.sub.5O.sub.12, YAG) constituent, (e) a yttrium alumina monoclinic (Y.sub.4Al.sub.2O.sub.9, YAM) constituent, (f) a yttrium alumina perovskite (YAlO.sub.3, YAP) constituent, and (g) a yttrium oxide (Y.sub.2O.sub.3) constituent. Semiconductor processing systems and methods of making substrate support structures are also described.

A substrate support structure includes a substrate support structure body formed from a ceramic composite and having a first surface, a second surface spaced apart from the first surface, and a periphery spanning the first surface and the second surface of the substrate support structure body. The first surface, the second surface, and the periphery of the substrate support structure body are defined by the ceramic composite. The ceramic composite includes two or more of a (a) an aluminum nitride (AlN) constituent, (b) an aluminum oxynitride (Al.sub.2.81O.sub.3.56N.sub.0.44, AlON) constituent, (c) an alpha-alumina (α-Al.sub.2O.sub.3) constituent, (d) a yttrium alumina garnet (Y.sub.3Al.sub.5O.sub.12, YAG) constituent, (e) a yttrium alumina monoclinic (Y.sub.4Al.sub.2O.sub.9, YAM) constituent, (f) a yttrium alumina perovskite (YAlO.sub.3, YAP) constituent, and (g) a yttrium oxide (Y.sub.2O.sub.3) constituent. Semiconductor processing systems and methods of making substrate support structures are also described.