A manufacturing method including mounting a ceramic plate on a circuit board such that the ceramic plate can be prevented from falling over. An electronic circuit module manufacturing method includes mounting a ceramic plate including a resin layer on a principal surface of a circuit board in such a manner that a principal surface of the ceramic plate is perpendicular or substantially perpendicular to the principal surface of the circuit board, and removing the resin layer from the principal surface of the ceramic plate mounted on the circuit board. In the step of mounting, the ceramic plate is supported by the resin layer and is thus prevented from falling over.

A method of fabricating a composite component, includes forming a fibrous preform by forming a first ceramic particle layer over a first textile layer, the first ceramic particle layer having a first group of ceramic particles, disposing a second textile layer over the first ceramic particle layer, forming a second ceramic particle layer over the second textile layer, the second ceramic particle layer having a second group of ceramic particles, and disposing a third textile layer over the second ceramic particle layer. The method further includes densifying the fibrous preform.

A method of fabricating a composite component, includes forming a fibrous preform by forming a first ceramic particle layer over a first textile layer, the first ceramic particle layer having a first group of ceramic particles, disposing a second textile layer over the first ceramic particle layer, forming a second ceramic particle layer over the second textile layer, the second ceramic particle layer having a second group of ceramic particles, and disposing a third textile layer over the second ceramic particle layer. The method further includes densifying the fibrous preform.

Provided are a polycrystalline SiC compact capable of achieving uniform plasma etching when used as electrodes and a method for manufacturing the same. A polycrystalline SiC compact has a major surface in which Wa (0 to 10 mm) is 0.00 to 0.05 m or less, Wa (10 to 20 mm) is 0.13 m or less, and Wa (20 to 30 mm) is 0.20 m or less.

Disclosed are a bismuth sodium potassium titanate-barium titanate (BNKT-BT)-based composite ceramic material with high depolarization temperature and a preparation method thereof, belonging to the technical field of piezoelectric ceramics of electronic materials. The chemical general formula of the BNKT-BT based composite ceramic material is: 0.85(Bi.sub.0.5Na.sub.0.5)TiO.sub.3-0.11(Bi.sub.0.5K.sub.0.5)TiO.sub.3-0.04BaTiO.sub.3-xZnO, where 0.1x0.3. The composite ceramic material takes BNKT-BT ceramics as the substrate, and single-phase ZnO is embedded in the middle of the substrate to form a 0-3 composite structure.

Disclosed are a bismuth sodium potassium titanate-barium titanate (BNKT-BT)-based composite ceramic material with high depolarization temperature and a preparation method thereof, belonging to the technical field of piezoelectric ceramics of electronic materials. The chemical general formula of the BNKT-BT based composite ceramic material is: 0.85(Bi.sub.0.5Na.sub.0.5)TiO.sub.3-0.11(Bi.sub.0.5K.sub.0.5)TiO.sub.3-0.04BaTiO.sub.3-xZnO, where 0.1x0.3. The composite ceramic material takes BNKT-BT ceramics as the substrate, and single-phase ZnO is embedded in the middle of the substrate to form a 0-3 composite structure.

A method of forming a feature on an article includes applying a powder material stock to a surface of an article, the powder material stock being capable of being transformed into a solid feature by the application of energy; applying energy to a portion of the powder material stock within a footprint of a feature to form the feature within the footprint; and removing excess powder material stock from the surface of the article. A coated article is also disclosed.

A method of forming a feature on an article includes applying a powder material stock to a surface of an article, the powder material stock being capable of being transformed into a solid feature by the application of energy; applying energy to a portion of the powder material stock within a footprint of a feature to form the feature within the footprint; and removing excess powder material stock from the surface of the article. A coated article is also disclosed.

A method for removing a ceramic coating from a substrate is presented. The method includes contacting the ceramic coating with a composition including a fluoride source and nitric acid. A method of forming a component having a variation in saturation magnetization is presented. The method includes masking selected portions of a surface of a metallic component using a ceramic coating to form a masked metallic component; selectively diffusing nitrogen into the metallic component by exposing the masked metallic component to a nitrogen-rich atmosphere; and removing the ceramic coating from the surface of the metallic component by contacting the ceramic coating with a composition including the fluoride source and nitric acid.

A method of producing ceramic wafer includes a forming step and processing step. The processing step includes forming positioning notch or positioning, flat edge and edge profile, which avoids the ceramic wafers to have processing defect during cutting, grinding, and polishing, for increasing yield. The ceramic particles for producing ceramic wafer include nitride ceramic powder, oxide ceramic powder, and nitride ceramic powder. The ceramic wafer has low dielectric constant, insulation, and excellent heat dissipation, which can be applied for the need of semiconductor process, producing electric product and semiconductor equipment.