A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

One aspect is a logic power module, with at least one logic component, at least one power component and a substrate. The logic element and the power component are provided in separate areas on the substrate. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.

In a semiconductor device, a first outer edge of a conductive pattern is located between the outermost edge of a first dimple and the innermost edge of a second dimple in a cross-sectional view of the device. When thermal stress due to temperature changes in the semiconductor device is applied to the ceramic circuit board, the first and second dimples suppress deformation of the ceramic circuit board that is caused due to the temperature changes. As a result, cracks in the ceramic circuit board and separation of the metal plate and the conductive pattern are prevented.

A technical object of the present invention is to devise a method by which bonding strength between an element base and a sealing material layer can be increased without thermal degradation of a member to be housed inside, to thereby improve long-term reliability of a hermetic package. A method of producing a hermetic package of the present invention includes the steps of: preparing a ceramic base and forming a sealing material layer on the ceramic base; preparing a glass substrate and arranging the ceramic base and the glass substrate so that the glass substrate is brought into contact with the sealing material layer on the ceramic base; and irradiating the sealing material layer with laser light from a glass substrate side to seal the ceramic base and the glass substrate with each other through intermediation of the sealing material layer, to thereby provide a hermetic packages.

A ceramic composite article includes a substrate including a matrix of ceramic material defining a network of interstitial regions and a transparent material occupying at least some of the interstitial regions of the substrate. The transparent material can have a melting point lower than a melting point of the ceramic material. The matrix of ceramic material can be formed by a 3D printing process.

A product according to one embodiment includes a first layer having a first composition, a first microstructure, and a first density; and a second layer above the first layer, the second layer having: a second composition, a second microstructure, and/or a second density. A gradient in composition, microstructure, and/or density exists between the first layer and the second layer, and either or both of the first layer and the second layer comprise non-spherical particles aligned along a longitudinal axis thereof.

The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380 C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 m.sup.2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 m.sup.2 of a second surface 10b thereof is measured by an atomic force microscope.

A thermal protection system is provided for a vehicle substructure. The thermal protection system comprises an outer layer for protecting the vehicle substructure. The thermal protection system further comprises an inner layer for conforming to the vehicle substructure. The thermal protection system also comprises an insulation layer sandwiched between the inner and outer layers. The insulation layer includes a porous low-density ceramic insulating material having a densified portion that covers an inner surface of the outer layer to strengthen adhesion.

A product according to one embodiment includes a first layer comprising a first material, the first layer having a gradient in composition, microstructure and/or density in an x-y plane, and the x-y plane being oriented parallel to a plane of deposition of the first layer. The first material includes non-spherical particles; and the product is optically transparent. A ceramic according to another embodiment includes a plurality of layers comprising non-spherical particles of a non-cubic material. Each layer is individually characterized by the non-spherical particles thereof being aligned in a common direction. A product in another embodiment includes a first layer having a first composition, a first microstructure, and a first density; and a second layer above the first layer, the second layer having: a second composition, a second microstructure, and/or a second density. A gradient in composition, microstructure, and/or density exists between the first layer and the second layer.

A method for producing a ceramic matrix composite (CMC) material includes impregnating a set of ceramic fibers with a non-fibrous ceramic material, resulting in a precursor matrix, stabilizing the precursor matrix, resulting in a stabilized matrix, and densifying the stabilized matrix using a frequency assisted sintering technology (FAST) process, resulting in a densified CMC material. The resulting densified CMC exhibits superior strength and toughness, relative to prior CMCs.