A composite plate having a thickness of no more than 2 mm, and having laminated therein a zirconia sintered body, an adhesive layer, and a base material, the elasticity of the base material being no more than 100 GPa, and the apparent density of the composite plate being no more than 4.3 g/cm.sup.3.

One aspect is a logic power module, with at least one logic component, at least one power component and a substrate. The logic element and the power component are provided in separate areas on the substrate. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.

In a semiconductor device, a first outer edge of a conductive pattern is located between the outermost edge of a first dimple and the innermost edge of a second dimple in a cross-sectional view of the device. When thermal stress due to temperature changes in the semiconductor device is applied to the ceramic circuit board, the first and second dimples suppress deformation of the ceramic circuit board that is caused due to the temperature changes. As a result, cracks in the ceramic circuit board and separation of the metal plate and the conductive pattern are prevented.

A material blend for deposition of an abrasion-resistant overlay onto a metal substrate comprising a first metal particle component, a second metal particle component, and a carbide particle component and a method for the application thereof, wherein the overlay process conditions and the homogeneity of tungsten carbide distribution in the overlay are improved.

A method for joining engine components includes positioning a first plurality of thermal protection structures across a thermal protection space between a first thermal protection surface and a second thermal protection surface. The first and second engine components are locally joined by forming a first plurality of transient liquid phase (TLP) or partial transient liquid phase (PTLP) bonds along corresponding ones of the first plurality of thermal protection structures between the first thermal protection surface and the second thermal protection surface. The second thermal protection surface is formed from a second surface material different from a first surface material of the first thermal protection surface.

An image generating device comprises a light source producing a light beam and a screen (5) traversed by the light beam and designed to modify the light beam so as to form an image. The screen (5) comprises a transparent element (150) traversed by the light beam and designed to evacuate the heat generated at the level of the screen (5). Said transparent element (150) is made of sintered transparent ceramic. Also described are a head-up display comprising such a device, and a method for manufacturing an image generating device.

A method of processing a CMC component includes preparing a fiber preform having a predetermined shape, and positioning the fiber preform with tooling having holes facing one or more surfaces of the fiber preform. After the positioning, a clamping pressure is applied to the tooling to force portions of the one or more surfaces of the fiber preform into the holes, thereby forming protruded regions of the fiber preform. During the application of the clamping pressure, the fiber preform is exposed to gaseous reagents at an elevated temperature, and a matrix material is deposited on the fiber preform to form a rigidized preform including surface protrusions. After removing the tooling, the rigidized preform is infiltrated with a melt for densification, and a CMC component having surface bumps is formed. When the CMC component is assembled with a metal component, the surface bumps may reduce diffusion at high temperatures.

A method of processing a ceramic matrix composite (CMC) component includes extracting silicon from a surface region of the CMC component such that free silicon is present in the surface region at a reduced amount of about 5 vol. % or less. The extraction comprises contacting the surface region with a wicking medium comprising an element reactive with silicon. The extraction is carried out at an elevated temperature prior to assembling the CMC component with a metal component.

An article comprises a plasma resistant ceramic material comprising 80-90 mol % of Y.sub.2O.sub.3, over 0 mol % to 20 mol % of ZrO.sub.2, and 10-20 mol % of Al.sub.2O.sub.3.

An article comprises a plasma resistant ceramic material comprising 40-60 mol % of Y.sub.2O.sub.3, 35-50 mol % of ZrO.sub.2, and 10-20 mol % of Al.sub.2O.sub.3.