A three-dimensional shaped article production method for producing a three-dimensional shaped article by stacking layers to form a stacked body includes a constituent layer formation step of forming a constituent layer which corresponds to a constituent region of the three-dimensional shaped article, a support layer formation step of forming a support layer which is in contact with the constituent layer and supports the constituent layer, and a sintering step of sintering the constituent layer, wherein the support layer is configured such that as compared with the volume decrement accompanying the sintering step of a space surrounded by the constituent layer from at least two directions, the volume decrement accompanying the sintering step of the support layer which supports the constituent layer in the space is larger.

A ceramic structure including a first conductive structure embedded therein and a second conductive structure embedded at a different depth from the first conductive structure is disclosed. In the ceramic structure, the first conductive structure and the second conductive structure are electrically connected to each other by an electrically conductive connection member capable of compensating for a vertical shrinkage rate of a ceramic sheet shape while being embedded therein when sintering the ceramic structure.

A second mold is placed on a planar surface of a first mold to form a first mold cavity, which is filled with a first material slurry containing a first material powder and the molded slurry is caused to set, thereby forming a first molded part on the planar surface of the first mold. A third mold is placed on the planar surface of the first mold from which the second mold is removed and on which the first molded part is formed, thereby forming a second mold cavity. The second mold cavity is filled with a second material slurry which contains a second material powder different from the first material powder so as to mold the slurry in contact with the first molded part. The molded slurry is caused to set, thereby forming a second molded part on the planar surface of the first mold.

The invention relates to a method for producing a component from ceramic materials in which a plurality of layers are applied to a base body by means of screen printing or template printing, said layers being formed from a ceramic material, in each case in a defined geometry above one another in the form of a paste or suspension in which powdery ceramic material and at least one binder are included. At least one region is formed here within at least one layer having a defined thickness and geometry composed of a further material that can be removed in a thermal treatment and that is likewise applied in the form of a paste or suspension by means of screen printing or template printing. Electrically functional structures composed of an electrically conductive or semiconductive material are applied to and/or formed on and/or in at least of the ceramic layers prior to the application of a further ceramic layer. The layer structure is then sintered in a thermal heat treatment, with the further material being removed and at least one hollow space being formed with defined dimensions of width, length, and height.

An oxide ceramic having a principal component formed of a ferrite compound containing at least Sr, Co, and Fe, and zirconium in an amount of 0.05 to 1.0 wt. % on an oxide equivalent basis, and a ceramic electronic component using the oxide ceramic.

A multilayer ceramic electronic component includes a ceramic body including a plurality of dielectric layers stacked on each other and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, parallel to a stacking direction and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other in a third direction and connected to the first to fourth surfaces, first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, first and second conductive thin films disposed on at least one of the third and fourth surfaces, connected to the first and second external electrodes, respectively, and having a thickness lower than that of the first and second external electrodes, and first and second solder preventing films disposed on the first and second external electrodes, respectively.

An electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C. The top surface may be sapphire. The top surface is attached to the lower portion of the electrostatic chuck using a braze layer able to withstand corrosive processing chemistries. A method of manufacturing an electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C.

A wafer mounting table includes a first electrode and a second electrode buried inside of a ceramic substrate having a wafer mounting surface so as to be parallel to the wafer mounting surface with the first electrode closer to the wafer mounting surface than the second electrode. The wafer mounting table includes a conductive section that electrically conducts the first electrode and the second electrode. The conductive section is such that a plurality of circular members comprised of plate-shaped metal meshes parallel to the wafer mounting surface are stacked between the first electrode and the second electrode.

A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated with the dielectric layers interposed therebetween, and an external electrode disposed externally on the body and connected to one or more of the plurality of internal electrodes. One of the plurality of dielectric layers includes a barium titanate composition including a Sn component. One of the plurality of internal electrodes includes a Sn component. The one of the plurality of dielectric layers has a Sn content equal to at least twice a Sn content of the one of the plurality of internal electrodes adjacent to the one of the plurality of dielectric layers.

One aspect relates to a process for producing a sintered workpiece, which includes sintering of a ceramic material at a temperature of at least 1000° C. and in an atmosphere, in the case of which the partial pressure of atmospheric air is reduced to less than 10.sup.−6-times, based on the ambient air at the same temperature under equilibrium conditions.