[Problem] To provide a radiation curable resin composition which is suitable as a primary material for optical fibers, while having a high curing rate by means of irradiation of radiation [Solution] A radiation polymerizable composition for forming an optical fiber primary coating layer, said composition containing: (A) a urethane oligomer containing a structure represented by formula (I) (in formula (I), R represents a vinyl group; and * represents a bonding hand); (B) one or more compounds selected from among (i) maleic acid anhydride, (ii) a compound represented by formula (II) (in formula (II), R.sup.I represents a single bond or an alkanediyl group having from 1 to 6 carbon atoms; and R.sup.2 represents a hydrogen atom, a hydroxy group or a specific group represented by formula (II-1) or formula (II-2)), and (iii) a compound represented by formula (III) (in formula (III), R.sup.5 represents an alkanediyl group having from 1 to 6 carbon atoms); and (C) a radiation polymerization initiator.

[Problem] To provide a radiation curable resin composition which is suitable as a primary material for optical fibers, while having a high curing rate by means of irradiation of radiation [Solution] A radiation polymerizable composition for forming an optical fiber primary coating layer, said composition containing: (A) a urethane oligomer containing a structure represented by formula (I) (in formula (I), R represents a vinyl group; and * represents a bonding hand); (B) one or more compounds selected from among (i) maleic acid anhydride, (ii) a compound represented by formula (II) (in formula (II), R.sup.I represents a single bond or an alkanediyl group having from 1 to 6 carbon atoms; and R.sup.2 represents a hydrogen atom, a hydroxy group or a specific group represented by formula (II-1) or formula (II-2)), and (iii) a compound represented by formula (III) (in formula (III), R.sup.5 represents an alkanediyl group having from 1 to 6 carbon atoms); and (C) a radiation polymerization initiator.

This invention relates a wax inhibitor for hydrocarbon oils comprising an esterified copolymer having repeating structural units derived from an esterified ethylenically unsaturated dicarboxylic acid and α-olefins having at least 18 carbon atoms, whereof at least 3 mol-% of the α-olefins have 30 or more carbon atoms, and wherein the ethylenically unsaturated dicarboxylic acid has been esterified with a mixture of alcohols comprising i) 70 to 97 mol-% of a saturated fatty alcohol having 18 to 24 carbon atoms and ii) 3 to 30 mol-% of an unsaturated alcohol having 16 to 24 carbon atoms.

This invention relates a wax inhibitor for hydrocarbon oils comprising an esterified copolymer having repeating structural units derived from an esterified ethylenically unsaturated dicarboxylic acid and α-olefins having at least 18 carbon atoms, whereof at least 3 mol-% of the α-olefins have 30 or more carbon atoms, and wherein the ethylenically unsaturated dicarboxylic acid has been esterified with a mixture of alcohols comprising i) 70 to 97 mol-% of a saturated fatty alcohol having 18 to 24 carbon atoms and ii) 3 to 30 mol-% of an unsaturated alcohol having 16 to 24 carbon atoms.

This invention relates a wax inhibitor for hydrocarbon oils comprising an esterified copolymer having repeating structural units derived from an esterified ethylenically unsaturated dicarboxylic acid and α-olefins having at least 18 carbon atoms, whereof at least 3 mol-% of the α-olefins have 30 or more carbon atoms, and wherein the ethylenically unsaturated dicarboxylic acid has been esterified with a mixture of alcohols comprising i) 70 to 97 mol-% of a saturated fatty alcohol having 18 to 24 carbon atoms and ii) 3 to 30 mol-% of an unsaturated alcohol having 16 to 24 carbon atoms.

An object of the present invention is to obtain a composition having, for example, improved anti-sagging properties, pigment dispersibility, and crack resistance, and the present invention relates to an ethylene/α-olefin copolymer composition including: an ethylene/α-olefin copolymer (A) satisfying requirements (a-1) to (a-3) described below; one or more selected from a color material (D), a resin (E) and an oil (F); and a solvent (C), (a-1) a methyl group index measured by .sup.1H-NMR is in a range of 40 to 60%, (a-2) a weight average molecular weight (Mw) determined by gel permeation chromatography (GPC) is in a range of 3,000 to 30,000, (a-3) no melting peak is observed at temperatures ranging from −100° C. to 150° C. in differential scanning calorimetry (DSC).

An object of the present invention is to obtain a composition having, for example, improved anti-sagging properties, pigment dispersibility, and crack resistance, and the present invention relates to an ethylene/α-olefin copolymer composition including: an ethylene/α-olefin copolymer (A) satisfying requirements (a-1) to (a-3) described below; one or more selected from a color material (D), a resin (E) and an oil (F); and a solvent (C), (a-1) a methyl group index measured by .sup.1H-NMR is in a range of 40 to 60%, (a-2) a weight average molecular weight (Mw) determined by gel permeation chromatography (GPC) is in a range of 3,000 to 30,000, (a-3) no melting peak is observed at temperatures ranging from −100° C. to 150° C. in differential scanning calorimetry (DSC).

Provided is an adhesive composition that exhibits good adhesion between a polyolefin resin substrate and a different type of material even when no curing agent is used, enables bonding at low temperatures, and has excellent storage stability. An adhesive composition comprising an acid-modified polyolefin (A) and an ethylene-α-olefin-diene rubber (B).

Provided is an adhesive composition that exhibits good adhesion between a polyolefin resin substrate and a different type of material even when no curing agent is used, enables bonding at low temperatures, and has excellent storage stability. An adhesive composition comprising an acid-modified polyolefin (A) and an ethylene-α-olefin-diene rubber (B).

To provide a semi-aromatic polyamide resin composition having excellent good plating properties, low water absorption properties, and solder reflow resistance. A semi-aromatic polyamide resin composition of the present invention comprises: 10 to 200 parts by mass of an inorganic filler (B) and 2 to 30 parts by mass of a toughness improver (C) based on 100 parts by mass of a semi-aromatic polyamide (A), wherein the semi-aromatic polyamide resin (A) satisfies the following (a) and (b): (a) a melting point (Tm) measured by differential scanning calorimetry (DSC) is 280° C. or higher; and (b) an equilibrium water absorption rate at 80° C. and 95% RH is 3.5% or less.