The present invention is a resin composition, including: an addition polymerization resin α having a glass transition temperature of 150° C. or more; and a resin β having an aromatic dicarboxylic acid monomer unit A having a hydrophilic group and a dicarboxylic acid monomer unit B having no hydrophilic group. According to the present invention, a resin composition that can be easily removed with water while maintaining the heat resistance can be provided.

The present invention is a resin composition, including: an addition polymerization resin α having a glass transition temperature of 150° C. or more; and a resin β having an aromatic dicarboxylic acid monomer unit A having a hydrophilic group and a dicarboxylic acid monomer unit B having no hydrophilic group. According to the present invention, a resin composition that can be easily removed with water while maintaining the heat resistance can be provided.

The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent.

##STR00001##

In Formula (1), R.sub.1 represents a hydrogen atom or an alkyl group.

A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent.

##STR00001##

In Formula (1), R.sub.1 represents a hydrogen atom or an alkyl group.

Disclosed are styrenic polymers made by a mass or solution process, where the amount of trimer consisting of styrene and/or acrylonitrile is less than about 0.50 weight percent. Also disclosed is a method of minimizing the amount of trimer consisting of styrene and/or acrylonitrile in styrenic polymers made by a mass or solution process. The method includes the steps of lowering the temperature of the polymerization reaction mixture and including more than one initiator in the polymerization reaction mixture.

Disclosed are styrenic polymers made by a mass or solution process, where the amount of trimer consisting of styrene and/or acrylonitrile is less than about 0.50 weight percent. Also disclosed is a method of minimizing the amount of trimer consisting of styrene and/or acrylonitrile in styrenic polymers made by a mass or solution process. The method includes the steps of lowering the temperature of the polymerization reaction mixture and including more than one initiator in the polymerization reaction mixture.

The present invention provides a maleimide-based copolymer, a method for producing same, and a resin composition obtained using same. This maleimide-based copolymer contains 40-60 mass % of aromatic vinyl monomer units, 5-20 mass % of vinyl cyanide monomer units, and 35-50 mass % of maleimide monomer units, and is such that a 4 mass % tetrahydrofuran solution of the copolymer has a transmittance of 90% or more for light having a wavelength of 450 nm at an optical path length of 10 mm, and the residual maleimide-based monomer amount is less than 300 ppm. This maleimide-based copolymer preferably further contains 0-10 mass % of unsaturated dicarboxylic acid anhydride monomer units, and preferably has a glass transition temperature of 165° C. or higher.

The present invention provides a maleimide-based copolymer, a method for producing same, and a resin composition obtained using same. This maleimide-based copolymer contains 40-60 mass % of aromatic vinyl monomer units, 5-20 mass % of vinyl cyanide monomer units, and 35-50 mass % of maleimide monomer units, and is such that a 4 mass % tetrahydrofuran solution of the copolymer has a transmittance of 90% or more for light having a wavelength of 450 nm at an optical path length of 10 mm, and the residual maleimide-based monomer amount is less than 300 ppm. This maleimide-based copolymer preferably further contains 0-10 mass % of unsaturated dicarboxylic acid anhydride monomer units, and preferably has a glass transition temperature of 165° C. or higher.