Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

The present invention is directed to a new class of thermoplastic elastomers (TPEs) and processes for making them. In some embodiments of the present invention, the end groups of the multi-arm PIB copolymer is a conjugated diene, whereas the other component is a multi-functional dienophile. The components of the TPE of the present invention are chemically connected via the well-known Diels-Alder reaction which is thermally reversible (by the retro-Diels-Alder reaction) at moderately elevated temperatures. The reversibility of the Diels-Alder retro-Diels-Alder reactions allows the recovery of the original components of the TPE and thus its recyclability and also gives the TPE the ability to be reshaped or reformed.

The present invention is directed to a new class of thermoplastic elastomers (TPEs) and processes for making them. In some embodiments of the present invention, the end groups of the multi-arm PIB copolymer is a conjugated diene, whereas the other component is a multi-functional dienophile. The components of the TPE of the present invention are chemically connected via the well-known Diels-Alder reaction which is thermally reversible (by the retro-Diels-Alder reaction) at moderately elevated temperatures. The reversibility of the Diels-Alder retro-Diels-Alder reactions allows the recovery of the original components of the TPE and thus its recyclability and also gives the TPE the ability to be reshaped or reformed.

An object of the present invention is to provide a coating agent giving a coating film that has good adhesion and stability over time, a decorative film having at least one layer formed from the coating agent; and an article decorated with the decorative film. The coating agent of the present invention contains, in a specific ratio, an olefin polymer (A) having a heat of fusion of in the range of 0 to 50 J/g and having a weight average molecular weight (Mw) as measured by GPC of 1×10.sup.4 to 1000×10.sup.4, a hydrocarbon-based synthetic oil (B) having a 40° C. kinematic viscosity of 30 to 500,000 cSt, and a tackifier (C) having an acid value of 10 or more and having a weight average molecular weight (Mw) of 0.9×10.sup.3 to 3×10.sup.3.

An object of the present invention is to provide a coating agent giving a coating film that has good adhesion and stability over time, a decorative film having at least one layer formed from the coating agent; and an article decorated with the decorative film. The coating agent of the present invention contains, in a specific ratio, an olefin polymer (A) having a heat of fusion of in the range of 0 to 50 J/g and having a weight average molecular weight (Mw) as measured by GPC of 1×10.sup.4 to 1000×10.sup.4, a hydrocarbon-based synthetic oil (B) having a 40° C. kinematic viscosity of 30 to 500,000 cSt, and a tackifier (C) having an acid value of 10 or more and having a weight average molecular weight (Mw) of 0.9×10.sup.3 to 3×10.sup.3.

This invention provides an aqueous resin composition mixture of polyolefin and acrylic for paints, inks, adhesives, sealing agents, or primers, the aqueous resin composition exhibiting high peel strength even when baked at 80° C. on polyolefin substrates, and maintaining adhesion although an acrylic component is contained. Provided is an aqueous resin composition comprising an acid-modified polyolefin resin (A) and a (meth)acrylic acid ester copolymer (B), wherein the acid-modified polyolefin resin (A) contains an unsaturated carboxylic acid or an anhydride thereof in an amount of 0.5 to 10 mass %, and wherein the (meth)acrylic acid ester copolymer (B) contains as copolymerization components a (meth)acrylic acid ester (B1), whose ester moiety is a hydrocarbon group with 12 or more carbon atoms, and a (meth)acrylic acid ester (B2), whose ester moiety is a hydrocarbon group with 11 or less carbon atoms.

This invention provides an aqueous resin composition mixture of polyolefin and acrylic for paints, inks, adhesives, sealing agents, or primers, the aqueous resin composition exhibiting high peel strength even when baked at 80° C. on polyolefin substrates, and maintaining adhesion although an acrylic component is contained. Provided is an aqueous resin composition comprising an acid-modified polyolefin resin (A) and a (meth)acrylic acid ester copolymer (B), wherein the acid-modified polyolefin resin (A) contains an unsaturated carboxylic acid or an anhydride thereof in an amount of 0.5 to 10 mass %, and wherein the (meth)acrylic acid ester copolymer (B) contains as copolymerization components a (meth)acrylic acid ester (B1), whose ester moiety is a hydrocarbon group with 12 or more carbon atoms, and a (meth)acrylic acid ester (B2), whose ester moiety is a hydrocarbon group with 11 or less carbon atoms.

The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.

The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.