C08G59/40

PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

A method for producing a prepreg, includes the steps of (1) an opening step of opening glass fiber bundles to form plural glass fiber filaments, and (2) a step of aligning the plural glass fiber filaments formed in the previous opening step, on a thermosetting resin composition-coated surface of a carrier material so as to make the filaments run nearly parallel to each other in one direction thereon to form a prepreg. A method for producing a laminate, includes a step of preparing two or more prepregs formed in the previous step (2), laminating them in such a manner that, in at least one pair of prepregs, the running direction of the plural glass fiber filaments in one prepreg differs from the running direction of the plural glass fiber filaments in the other prepreg, and heating and pressing them.

Multicomponent epoxide resin composition and curing agent component therefor

A curing agent component is useful for a multicomponent epoxide resin composition. An epoxide resin composition produced using the curing agent component, wherein the curing agent component includes, as a curing agent, at least one Mannich base and an amine that is reactive with respect to epoxide groups, as well as at least one polyphenol from the group of novolac resins as an accelerant. The Mannich base can he obtained by reacting a phenolic compound selected from phenol, styrenated phenol, catechol, resorcinol, hydroquinone, hydroxyhydroquinone, phloroglucinol, pyrogallol, o-cresol, m-cresol, p-cresol and bisphenols, with an aldehyde or an aldehyde precursor and an amine having at least two active hydrogen atoms in the molecule which are bonded to a nitrogen atom. The novolac resin is contained in the curing agent component in a proportion of 5-30 wt. %, based on the organic proportions of the curing agent component.

Esterified acids for use in polymeric materials
11535698 · 2022-12-27 · ·

The present teachings contemplate a method that includes a step of providing a first amount of esterified reaction product of an acid and an epoxy-based material. The esterified reaction product may be further reacted an epoxy resin to form a polymeric epoxy. The resulting material may have a generally linear backbone, foaming and curing capability and flame retardant properties.

Crosslinkable composition and crosslinked product

A crosslinkable composition containing: a liquid monocyclic olefin ring-opened polymer (A) having a reactive group at a polymer chain end thereof and a weight-average molecular weight (Mw) of 1,000 to 50,000; and a crosslinkable compound (B) having, in the molecule, two or more functional groups reactive with the reactive group at the polymer chain end of the monocyclic olefin ring-opened polymer (A).

Accelerator composition for the cure of polyfunctional isocyanates with epoxy resins

The present disclosure is related to an accelerator composition for the cure of polyfunctional isocyanates with epoxy resins comprising (a) a boron trihalide-amine complex, and (b) a quaternary ammonium or phosphonium halide as well as the use of such accelerator composition, cured isocyanate-epoxy resin products obtainable therefrom and a method of making a cured isocyanate-epoxy resin product.

CURABLE COMPOSITIONS

The present invention is directed to a curable composition including: an isocyanate-functional prepolymer; an epoxy-containing component present in an amount of at least 10 percent by weight of the composition; and a latent curing agent having an ability to react with at least one of the isocyanate-functional prepolymer and the epoxy-containing component upon exposure to an external energy source. The present invention is also directed to methods of making the compositions, methods of coating a substrate, methods of adhering substrates and coated substrates.

EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL
20220372209 · 2022-11-24 · ·

The purpose of the present invention is to provide: an epoxy resin composition which enables the achievement of a resin cured product that has high flame retardancy and excellent mechanical characteristics; and a prepreg and a fiber-reinforced composite material, each of which uses this epoxy resin composition. One embodiment of the epoxy resin composition according to the present invention, said epoxy resin composition having achieved the above-described purpose, contains the components (A) and (B) described below. (A): a bifunctional glycidyl amine type epoxy compound (B): an epoxy compound having a specific structure and/or an epoxy compound having another specific structure

Prepregs and production of composite material using prepregs
11505642 · 2022-11-22 · ·

A prepreg having at least one layer of fibres and a curable thermosetting resin system at least partly impregnating the at least one layer of fibres, wherein the curable thermosetting resin system includes a curable thermosetting resin including at least two epoxide groups, a curing agent that includes at least one amine group, and an accelerator that includes an azole group; wherein the curable thermosetting resin, the curing agent and the accelerator are provided in respective concentrations in the prepreg to provide that, after curing the thermosetting resin at a cure temperature of at least 140° C. for a period of from 1 to 6 minutes, (i) the cured thermosetting resin has a glass transition temperature Tg which is greater than the cure temperature and is within the range of from 150° C. to 180° C. and (ii) the cured thermosetting resin is at least 90% cured.

Prepreg and fiber-reinforced composite material

A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

SIDE-FILLING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR REMOVING SIDE-FILLING MEMBER

A side-filling resin composition is used to form a side-filling member to be interposed between a base member and a peripheral edge portion of a surface, facing the base member, of a mounted component that is surface-mounted on the base member. The side-filling resin composition has photocurability.