A side-filling resin composition is used to form a side-filling member to be interposed between a base member and a peripheral edge portion of a surface, facing the base member, of a mounted component that is surface-mounted on the base member. The side-filling resin composition has photocurability.

A pressure-sensitive structural adhesive film based on an epoxy resin composition, wherein the epoxy resin composition comprises a latent-reactive, thermally activatable curing agent for producing a structural bond after thermal curing and additionally a curing agent that cross-links at room temperature, wherein the not-cured adhesive film is compressible and therefore allows for tolerance compensation.

A method for recycling matrix residues includes steps of degrading a target epoxy to form matrix residues, collecting the matrix residues, and adding the matrix residues into a polymer-forming formulation. Characteristically, the polymer-forming formulation includes multifunctional anhydride monomers and polyfunctional co-reactant monomers.

A polyisocyanurate raw material composition containing a polyfunctional isocyanate, a compound (I) represented by general formula (I) shown below, and an epoxy compound. In general formula (I), each of R.sup.1 to R.sup.5 represents a hydrogen atom, an alkoxy group of 1 to 10 carbon atoms, an alkyl group of 2 to 10 carbon atoms (or an alkyl group of 1 to 10 carbon atoms in the case of R.sup.3 to R.sup.5), an aryl group of 6 to 12 carbon atoms, an amino group, a monoalkylamino group of 1 to 10 carbon atoms, a dialkylamino group of 2 to 20 carbon atoms, a carboxy group, a cyano group, a fluoroalkyl group of 1 to 10 carbon atoms, or a halogen atom (provide that R.sup.1 and R.sup.2 are not both hydrogen atoms). ##STR00001##

A one-component thermosetting epoxy resin composition includes at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at least one impact modifier D, at least one physical or chemical blowing agent E and fibrous anhydrous magnesium oxysulfate MOS. Thermally expandable epoxy resin compositions have improved adhesion, especially on metal substrates.

An object of the present invention is to provide a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. A curing catalyst for epoxy resin, which contains an epoxy imidazole adduct having structural formula (I) below, is prepared. Furthermore, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition are prepared. (In the formula, R.sup.1 is a group selected from hydrogen, phenyl, and C1-C17 alkyls, and R.sup.2 and R.sup.3 are each independently a group selected from hydrogen and C1-C6 alkyls.)

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A carbonate-containing epoxy resin and a manufacturing method for a carbonate-containing epoxy resin, an epoxy curable product and a method for degrading an epoxy curable product are provided. The carbonate-containing epoxy resin includes a structure represented by formula (I) or formula (II). Formula (I) and formula (II) are defined as in the specification.

Provided is a composition which is for forming a resist underlayer film and with which the amount of a sublimate derived from a low-molecular-weight component such as an oligomer can be reduced, the composition comprising, for example, an organic solvent and a polymer having a repeating unit represented by formula (1-1), wherein the content of a low-molecular-weight component having a weight average molecular weight of 1,000 or less is 10 mass % or less in the polymer.

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A resin composition for molding includes an epoxy resin, a curing agent, and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.

A resin composition for molding includes an epoxy resin, a curing agent, and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.