One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass, (B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2, (C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass, (D) a catalytic amount of an addition reaction catalyst, and (E) an addition-reaction controlling agent in an amount of 0.01 to 1 part by mass, wherein the thermally conductive filler (C) comprises magnesium oxide having a specific surface area of 0.4 m.sup.2/g or less in an amount of 20 to 50 wt % and aluminum hydroxide in an amount of 10 to 30 wt %, relative to a total weight of component (C).

A curable composition which comprises (A) an organopolysiloxane represented by formula (1)

##STR00001##

(wherein R.sup.1 represents an alkyl group, R.sup.2 represents an alkyl or aryl group, R.sup.3 represents a hydrogen atom or methyl group, Me represents a methyl group, m is an integer of 1-10, and a and b are integers of 1 or larger, a+b being an integer of 3-120), (B) a photopolymerization initiator, and (C) a hydrosilylation catalyst and which has a surface tension at 23° C. of 23-30 mN/m and a viscosity at 23° C. of 5-80 mPa.Math.s.

A curable composition which comprises (A) an organopolysiloxane represented by formula (1)

##STR00001##

(wherein R.sup.1 represents an alkyl group, R.sup.2 represents an alkyl or aryl group, R.sup.3 represents a hydrogen atom or methyl group, Me represents a methyl group, m is an integer of 1-10, and a and b are integers of 1 or larger, a+b being an integer of 3-120), (B) a photopolymerization initiator, and (C) a hydrosilylation catalyst and which has a surface tension at 23° C. of 23-30 mN/m and a viscosity at 23° C. of 5-80 mPa.Math.s.

Described is a silicone hydrogel contact lens having non-uniform morphology. The contact lens may be made from a reactive mixture comprising: a silicone-containing component; a hydrophilic component; a non-reactive polymeric internal wetting agent; and a polymerization initiator, the contact lens having an oxygen permeability of at least about 60 barrers, and wherein the molar ratio in the lens of the polymeric non-reactive internal wetting agent to silicone, without a surface treatment, is greater in the lens's surface than in its bulk.

A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

The invention relates to a laminate comprising a first layer and a second layer directly covering the first layer, the first layer being a layer of a silicone rubber composition comprising a micrometric silicone powder and a mixture of crosslinkable organopolysiloxanes, the second layer being a layer of a silicone rubber composition comprising a hydrophobic silica and a mixture of crosslinkable organopolysiloxanes, the first layer and the second layer being crosslinked. The laminate, in particular when it is used as a coating for the outer surface of an expandable bladder for a tyre curing mould, makes it possible to eliminate moulding defects on the inner liner of the tyre.

The invention relates to a laminate comprising a first layer and a second layer directly covering the first layer, the first layer being a layer of a silicone rubber composition comprising a micrometric silicone powder and a mixture of crosslinkable organopolysiloxanes, the second layer being a layer of a silicone rubber composition comprising a hydrophobic silica and a mixture of crosslinkable organopolysiloxanes, the first layer and the second layer being crosslinked. The laminate, in particular when it is used as a coating for the outer surface of an expandable bladder for a tyre curing mould, makes it possible to eliminate moulding defects on the inner liner of the tyre.

The disclosure relates to sidechain functionalized organosiloxane compounds comprising polyalkyleneoxide (POA) and/or polyalkyleneoxide coupled zwitterionic moieties with various other modular side chains including reactive and or non-reactive groups. The present disclosure further also pertains to ice-phobic polymer formulations capable of curing on a substrate to form a surface that is ice-phobic, resistant to ice formation, and/or resistant to ice adhesion. The disclosed ice-phobic polymer formulations comprise one or more disclosed sidechain functionalized organosiloxane compound, one or more binder resin, and/or one or more lubricating liquid. The present disclosure further relates to articles comprising the disclosed ice-phobic polymer compositions, thereby providing articles having ice-phobic properties. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.