This invention relates to compositions and methods for improving the adhesion of resin compositions to substrate materials. More particularly, the invention relates to compositions and methods for improving the adhesion of ROMP compositions to substrate materials using an adhesion promoter composition, where the adhesion promoter composition comprises a pre-reacted mixture comprising at least one compound containing at least two isocyanate groups and at least one compound comprising a heteroatom-containing functional group and a metathesis active olefin, where the adhesion promoter composition is storage stable and/or possesses in-resin storage stability when added to a resin composition, particularly a cyclic olefin resin composition, such as a ROMP composition. The polymer products produced via ROMP reactions of the invention may be utilized for a wide range of materials and composite applications. The invention has utility in the fields of polymer and materials chemistry and manufacture.

This invention relates to compositions and methods for improving the adhesion of resin compositions to substrate materials. More particularly, the invention relates to compositions and methods for improving the adhesion of ROMP compositions to substrate materials using an adhesion promoter composition, where the adhesion promoter composition comprises a pre-reacted mixture comprising at least one compound containing at least two isocyanate groups and at least one compound comprising a heteroatom-containing functional group and a metathesis active olefin, where the adhesion promoter composition is storage stable and/or possesses in-resin storage stability when added to a resin composition, particularly a cyclic olefin resin composition, such as a ROMP composition. The polymer products produced via ROMP reactions of the invention may be utilized for a wide range of materials and composite applications. The invention has utility in the fields of polymer and materials chemistry and manufacture.

The present invention is a low dielectric resin substrate, which is a composite including an annealed quartz glass cloth and an organic resin, where the annealed quartz glass cloth has a dielectric loss tangent of less than 0.0010 at 10 GHz, and tensile strength of 1.0 N/25 mm or more per cloth weight (g/m.sup.2). This provides a resin substrate that includes a quartz glass cloth which has a low dielectric loss tangent and which is also excellent in tensile strength.

A matrix resin composition for fiber reinforced composite materials is described. The resin is thermosetting and achieves a glass transition temperature of at least 177° C. (Tg), obtained by curing under anaerobic conditions at room temperature. The matrix resin will streamline composite fabrication processes by eliminating the need for heating during the cure process. The implications of this development are significant in terms of the ease of use and elimination of procedural steps. While the resin system was developed specifically for vacuum bagging, it is expected to be viable for other composite fabrication methods including resin transfer molding (RTM) and vacuum-assisted resin transfer molding (VARTM). The resin system is viable for use with carbon fiber reinforcements to fabricate laminates at least 0.20 inches thick. The resulting laminates have low porosity and mechanical properties equivalent to those prepared with common epoxy matrix resins.

A matrix resin composition for fiber reinforced composite materials is described. The resin is thermosetting and achieves a glass transition temperature of at least 177° C. (Tg), obtained by curing under anaerobic conditions at room temperature. The matrix resin will streamline composite fabrication processes by eliminating the need for heating during the cure process. The implications of this development are significant in terms of the ease of use and elimination of procedural steps. While the resin system was developed specifically for vacuum bagging, it is expected to be viable for other composite fabrication methods including resin transfer molding (RTM) and vacuum-assisted resin transfer molding (VARTM). The resin system is viable for use with carbon fiber reinforcements to fabricate laminates at least 0.20 inches thick. The resulting laminates have low porosity and mechanical properties equivalent to those prepared with common epoxy matrix resins.

The present invention relates to plastic films with improved laser engraving capability, chemical resistance and mechanical stress, special embodiments of such films in the form of co-extrusion films, layer structures comprising such films, use of such films, as well as security documents, preferably identification documents, containing such films.

The present invention provides a method for producing a molded article by pressing a composite material containing a resin composition and carbon fibers, wherein the resin composition contains a polyamide resin, a copper compound and potassium halide, and (1) the copper compound content is 0.1 parts by mass or more relative to 100 parts by mass of the polyamide resin.

The present invention provides a method for producing a molded article by pressing a composite material containing a resin composition and carbon fibers, wherein the resin composition contains a polyamide resin, a copper compound and potassium halide, and (1) the copper compound content is 0.1 parts by mass or more relative to 100 parts by mass of the polyamide resin.

A curable matrix resin composition containing a thermoset resin component and metastable thermoplastic particles, wherein the metastable thermoplastic particles are particles of semi-crystalline thermoplastic material with an amorphous polymer fraction that will undergo crystallization upon heating to a crystallization temperature T.sub.c. A fiber-reinforced polymeric composite material containing metastable thermoplastic particles is also disclosed.

A curable matrix resin composition containing a thermoset resin component and metastable thermoplastic particles, wherein the metastable thermoplastic particles are particles of semi-crystalline thermoplastic material with an amorphous polymer fraction that will undergo crystallization upon heating to a crystallization temperature T.sub.c. A fiber-reinforced polymeric composite material containing metastable thermoplastic particles is also disclosed.