The present disclosure provides for aqueous, curable binder compositions, as well as articles and products comprising assemblies of matter comprising mineral fibers, synthetic fibers, natural fibers, cellulosic particles and sheet materials comprising the binder compositions disclosed herein.

Provided is a novel resin composition for a metal-clad laminate, with which a metal-clad laminate having excellent adhesion with a metal foil, solder heat resistance, insulation and the like can be produced. A terminally modified polybutadiene contained in the resin composition for a metal-clad laminate according to the present invention has a structure of formula (III) on each of both terminals of a polybutadiene comprising a repeating unit of formula (I) and a repeating unit of formula (II), wherein a proportion of the repeating unit of formula (I) in all the repeating units is 70 to 99% by mol.

##STR00001##

A prepreg includes composition elements [A], [B], and [C] described below,

[A] a reinforcing fiber,

[B] a thermosetting resin, and

[C] a thermoplastic resin.

[B] contains a thermoplastic resin having an aromatic ring with an amount of 10% or more by mass, a resin region containing [B] is present on one surface of the prepreg, a resin region containing [C] is present on another surface of the prepreg, and [A] that crosses over a boundary surface between the resin region containing [B] and the resin region containing [C] and that is in contact with both resin regions is present.

A resin composition includes a polyphenylene ether resin of Formula (1) and an additive. The additive may include maleimide resin, unsaturated C═C double bond-containing crosslinking agent, polyolefin, flame retardant, filler, curing accelerator, or a combination thereof. An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including comparative tracking index, breakdown voltage, dissipation factor and copper foil peeling strength.

##STR00001##

A composite material having at least two layers of reinforcing fibers impregnated with a curable resin; an interlaminar region formed between adjacent layers of reinforcing fibers; and a combination of polymeric toughening particles and fire-retardant particles in the interlaminar region.

A laminate body is provided which contains a thin prepreg having a component (A) containing a matrix of reinforcing fiber, a component (B) containing a thermosetting resin, and a component (C) containing particles of a thermoplastic resin. When molded and cured out of autoclave, the laminate body achieves a fiber-reinforced composite having a low void ratio and providing excellent mechanical performance.

A resin composition having favorable heat stability while capable of primary curing at 140° C or lower, and having excellent heat resistance after curing, and a pre-preg having excellent heat resistance while a molded product after molding maintains mechanical characteristics are provided. The resin composition of the present invention comprises a constituent element (A): a cyanate ester resin, a constituent element (B): an imidazole compound, and a constituent element (C): silica, in which an average particle size of the silica is 0.4 μm or less. The pre-preg of the present invention comprises carbon fibers, and the resin composition of the present invention.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C.sub.6-C.sub.20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.

A fibre-reinforced polymer composite comprising fibres bound within a solid polymer matrix, wherein at least some of the fibres are in contact with graphene, and wherein the composite changes electrical resistance when deformed.