A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board. ##STR00001##

Film-forming polymers that contain covalently-attached or non-covalently bound light-filtering, e.g., UV-absorbing, compounds and their use as a skin-protectant coating, such as a sunscreen, are disclosed.

Film-forming polymers that contain covalently-attached or non-covalently bound light-filtering, e.g., UV-absorbing, compounds and their use as a skin-protectant coating, such as a sunscreen, are disclosed.

A coating agent is capable of forming a coating film that has enhanced adhesion and adherence to a substrate, and enhanced water resistance as well and composed mainly of an aqueous material. A process of forming a coating agent uses the coating agent, a primer treatment process uses the coating agent, a process of doing repairs to concretes uses the coating agent, and a process of laying down roads uses the coating agent. The coating agent is composed mainly of a polyphenol derivative and containing a polymerizing agent, and has a pH of 9 or less. The polymerizing agent contains a compound having two or more functional groups selected from the group of an amino group and a mercapto group per molecule. In the process of forming a coating film, the coating agent is applied onto a substrate in an alkaline environment having a pH of greater than 9.

An anti-fog material comprising a zwitterionic-doped hydrogel made up of charged monomers, at least a portion of which comprise zwitterionic monomers, uncharged hydrophilic monomers, and at least one crosslinking agent is disclosed. A composition for forming the hydrogel and a transparent, removable article comprising the anti-fog material are also disclosed. The article, which may be in the form of a film or decal, may comprise an active layer attached to a backing layer, the active layer comprising an anti-fog material described herein. A method of making a surface of a substrate resistant to fogging by applying the transparent and removable article thereto is also disclosed.

An anti-fog material comprising a zwitterionic-doped hydrogel made up of charged monomers, at least a portion of which comprise zwitterionic monomers, uncharged hydrophilic monomers, and at least one crosslinking agent is disclosed. A composition for forming the hydrogel and a transparent, removable article comprising the anti-fog material are also disclosed. The article, which may be in the form of a film or decal, may comprise an active layer attached to a backing layer, the active layer comprising an anti-fog material described herein. A method of making a surface of a substrate resistant to fogging by applying the transparent and removable article thereto is also disclosed.

In the composition according to the embodiment, the content of an unreacted diisocyanate monomer in a urethane-based prepolymer may be controlled to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.

In the composition according to the embodiment, the content of an unreacted diisocyanate monomer in a urethane-based prepolymer may be controlled to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.

Composites made of a cross-linked acrylic polymer and an inorganic aggregate and/or mineral, with the cross-linked acrylic polymer being present at a concentration of 5% to 17%, by weight, are disclosed. Processes of preparing the composites are also disclosed.

Composites made of a cross-linked acrylic polymer and an inorganic aggregate and/or mineral, with the cross-linked acrylic polymer being present at a concentration of 5% to 17%, by weight, are disclosed. Processes of preparing the composites are also disclosed.