The present disclosure relates to an electroluminescent material ink, comprising a quantum dot material, an organic light emitting material, and an organic solvent. The organic solvent includes a first solvent shown in general formula (I): ##STR00001## wherein R0 is C.sub.mH.sub.2m+1; R1, R2, R3, and R4 are each independently C.sub.nH.sub.2n+1, 0≤m≤8 and 0<n≤8, or 0<m≤8 and 0≤n≤8. The electroluminescent material ink has good physical parameters and can effectively prevent nozzle blockage.

The present disclosure relates to an electroluminescent material ink, comprising a quantum dot material, an organic light emitting material, and an organic solvent. The organic solvent includes a first solvent shown in general formula (I): ##STR00001## wherein R0 is C.sub.mH.sub.2m+1; R1, R2, R3, and R4 are each independently C.sub.nH.sub.2n+1, 0≤m≤8 and 0<n≤8, or 0<m≤8 and 0≤n≤8. The electroluminescent material ink has good physical parameters and can effectively prevent nozzle blockage.

An embodiment includes a polymer composition comprising a thermoplastic polymer that: (a) is bonded to iodine, (b) includes a vinyl group, and (c) includes urethane linkages. Other embodiments are described herein.

An embodiment includes a polymer composition comprising a thermoplastic polymer that: (a) is bonded to iodine, (b) includes a vinyl group, and (c) includes urethane linkages. Other embodiments are described herein.

A resin composition includes a resin component including an ethylene-(meth)acrylate copolymer and at least either an ethylene-propylene-diene terpolymer or ethylene acrylate rubber. A content of the ethylene-(meth)acrylate copolymer with respect to a total content of the ethylene-(meth)acrylate copolymer and at least either the ethylene-propylene-diene terpolymer or the ethylene acrylate rubber is 35% by mass or greater and 90% by mass or less. A tensile stress at 19% strain of the resin composition is 2.0 MPa or less, and a tensile stress at break of the resin composition is 10.3 MPa or greater.

A resin composition includes a resin component including an ethylene-(meth)acrylate copolymer and at least either an ethylene-propylene-diene terpolymer or ethylene acrylate rubber. A content of the ethylene-(meth)acrylate copolymer with respect to a total content of the ethylene-(meth)acrylate copolymer and at least either the ethylene-propylene-diene terpolymer or the ethylene acrylate rubber is 35% by mass or greater and 90% by mass or less. A tensile stress at 19% strain of the resin composition is 2.0 MPa or less, and a tensile stress at break of the resin composition is 10.3 MPa or greater.

Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.

Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.