Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof

Abstract

Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.

Claims

1. A boron nitride agglomerate, which is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder; wherein the boron nitride agglomerate having a multi-stage structure is of a secondary structure or/and a tertiary structure, wherein the secondary structure is a flower-like structure, staircase structure or arched structure composed of flaky hexagonal boron nitride primary particles radiating outward from the same center; the tertiary structure is a macro-agglomerate stacked by flower-like structure, staircase structure or arched structure.

2. The boron nitride agglomerate according to claim 1, wherein the three-dimensional directions of the boron nitride agglomerate are mainly composed of any one or at least two of face-to-face connection, face-to-end connection or end-to-end connection manner of the flaky hexagonal boron nitride primary particles.

3. The boron nitride agglomerate according to claim 1, wherein the boron nitride agglomerate having a multi-stage structure is of a tertiary structure.

4. The boron nitride agglomerate according to claim 1, wherein the flaky hexagonal boron nitride primary particle has a particle size of 0.5 μm to 200 μm.

5. The boron nitride agglomerate according to claim 1, wherein the inorganic binder is in a mass of 0.02% to 20% of the mass of the flaky hexagonal boron nitride primary particles.

6. The boron nitride agglomerate according to claim 1, wherein the inorganic binder is an inorganic filler with a dielectric constant D.sub.k≤9.0.

7. The boron nitride agglomerate according to claim 6, wherein the inorganic filler is any one or a mixture of at least two selected from the group consisting of silica, borosilicate glass, boron trioxide, bismuth oxide, hollow glass microspheres and ceramics.

8. A thermosetting resin composition, comprising: (A) a thermosetting resin; (B) a boron nitride agglomerate according to claim 1.

9. The thermosetting resin composition according to claim 8, wherein the thermosetting resin is any one or a mixture of at least two selected from the group consisting of epoxy resin, polyphenylene ether resin, polybutadiene, polystyrene-butadiene block polymer, cyanate resin, bismaleimide-triazine resin, polytetrafluoroethylene, polyimide, multifunctional epoxy, liquid crystal epoxy and bismaleimide.

10. The thermosetting resin composition according to claim 8, wherein the thermosetting resin is in a mass of 5% to 85% of the total mass of the thermosetting resin composition.

11. The thermosetting resin composition according to claim 8, wherein the boron nitride agglomerate is in a mass of 5% to 90%.

12. The thermosetting resin composition according to claim 8, wherein the thermosetting resin composition further comprises (C) a curing agent.

13. The thermosetting resin composition according to claim 8, wherein the thermosetting resin composition further comprises (D) an accelerator and/or (E) an initiator.

14. The thermosetting resin composition according to claim 8, wherein the thermosetting resin composition further comprises (F) a filler.

15. The thermosetting resin composition according to claim 8, wherein the thermosetting resin composition further comprises (G) a flame retardant.

16. A laminate, comprising at least one prepreg, wherein the prepreg comprises a reinforcing material and the thermosetting resin composition according to claim 8 attached thereon after impregnation and drying.

17. A method for preparing the boron nitride agglomerate according to claim 1, which is: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate having a multi-stage structure.

18. The method according to claim 17, wherein the inorganic binder is an inorganic filler with a dielectric constant D.sub.k≤9.0.

19. The method according to claim 18, wherein the inorganic filler is any one or a mixture of at least two selected from the group consisting of silica, borosilicate glass, boron trioxide, bismuth oxide and hollow glass microspheres.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows the basic structure of a general flake-shaped boron nitride in the prior art.

(2) FIG. 2 shows the structure of the boron nitride agglomerate disclosed in CN103249695A.

(3) FIG. 3 shows a scanning electron microscope (SEM) image of a boron nitride agglomerate having a multi-stage structure (flower-like) prepared according to an embodiment of the present invention, with a magnification of 1,000.

(4) FIG. 4 shows a schematic diagram of a boron nitride agglomerate having a multi-stage structure (stair-like) prepared according to an embodiment of the present invention.

(5) The present invention will be described in further detail below. However, the following examples are only simple examples of the present invention and do not represent or limit the protection scope of the present invention. The protection scope of the present invention is subject to the claims.

DETAILED DESCRIPTION

(6) The technical solutions of the present invention will be further described below with reference to the drawings and through specific implementations.

(7) In order to better illustrate the present invention and facilitate understanding of the technical solutions of the present invention, the present invention provides the typical but non-limiting embodiments as follows.

Preparation Example 1

(8) A method for preparing boron nitride agglomerates includes the following steps:

(9) flaky hexagonal boron nitride primary particles were mixed with boron trioxide, wherein boron trioxide was in a mass of 5% of the flaky hexagonal boron nitride primary particles and the flaky hexagonal boron nitride primary particles had an average particle size of 10 μm, to obtain boron nitride agglomerate I.

(10) As shown in FIG. 3 (FIG. 3 shows an SEM spectrum of the boron nitride agglomerates prepared in this example), the resulted product was a boron nitride agglomerate.

(11) The resulted product had the morphology as shown in FIG. 3. It was formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions, and contained a three-dimensional structure which was mainly in a flower shape and formed by radiating flaky hexagonal boron nitride primary particles outward from the same center.

Preparation Example 2

(12) As compared with Preparation Example 1, the mass of boron trioxide was controlled to be 1% of the mass of the flaky hexagonal boron nitride primary particles, to obtain boron nitride agglomerate II.

(13) The resulted product was formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions, and contained a three-dimensional structure which was mainly in a flower shape and formed by radiating flaky hexagonal boron nitride primary particles outward from the same center.

Preparation Example 3

(14) As compared with Preparation Example 1, the mass of boron trioxide was controlled to be 10% of the mass of the flaky hexagonal boron nitride primary particles, and the average particle size of the flaky hexagonal boron nitride primary particles was 50 μm, to obtain boron nitride agglomerate III.

(15) The resulted product was formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions, and contained a three-dimensional structure which was mainly in a staircase shape and formed by radiating flaky hexagonal boron nitride primary particles outward from the same center (as shown in FIG. 4).

Preparation Example 4

(16) As compared with Preparation Example 1, the mass of boron trioxide was controlled to be 15% of the mass of the flaky hexagonal boron nitride primary particles, and the average particle size of the flaky hexagonal boron nitride primary particles was 5 μm, to obtain boron nitride agglomerate IV.

(17) The resulted product was formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions, and contained a three-dimensional structure which was mainly in an arch shape and formed by radiating flaky hexagonal boron nitride primary particles outward from the same center.

Preparation Example 5

(18) As compared with Preparation Example 1, boron trioxide was replaced with a mixture of silica and borosilicate glass, wherein the silica was in a mass of 5% of the mass of the flaky hexagonal boron nitride primary particles and the borosilicate glass was in a mass of 15% of the mass of the flaky hexagonal boron nitride primary particles, to obtain boron nitride agglomerate V.

(19) The resulted product was formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions, and contained a three-dimensional structure which was mainly in a staircase shape and formed by radiating flaky hexagonal boron nitride primary particles outward from the same center.

Preparation Example 6

(20) As compared with Preparation Example 1, boron trioxide was replaced with silica, i.e. the mass of silica was controlled to be 5% of the mass of the flaky hexagonal boron nitride primary particles, to obtain boron nitride agglomerate VI.

(21) The resulted product was formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions, and contained a three-dimensional structure which was mainly in a flower shape and formed by radiating flaky hexagonal boron nitride primary particles outward from the same center.

Preparation Example 7

(22) As compared with Preparation Example 1, boron trioxide was replaced with bismuth oxide and hollow glass microspheres, wherein the bismuth oxide was in a mass of 3% of the mass of the flaky hexagonal boron nitride primary particles and the hollow glass microspheres were in a mass of 16% of the mass of the flaky hexagonal boron nitride primary particles, to obtain boron nitride agglomerate VII.

(23) The resulted product was formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions, and contained a three-dimensional structure which was mainly in a staircase shape and formed by radiating flaky hexagonal boron nitride primary particles outward from the same center.

Comparative Preparation Example 1

(24) As compared with Preparation Example 1, no binder was added and flaky boron nitride was obtained.

Comparative Preparation Example 2

(25) As compared with Preparation Example 1, the mass of boron trioxide was controlled to be 0.01% of the mass of flaky hexagonal boron nitride primary particles. The others were the same as those in Preparation Example 1.

(26) The resulted product was an irregular flocculent agglomerate with a shape similar to the structure in FIG. 1.

Comparative Preparation Example 3

(27) As compared with Preparation Example 1, the mass of boron trioxide was controlled to be 21% of the mass of flaky hexagonal boron nitride primary particles. The others were the same as those in Preparation Example 1.

(28) The resulted product was dominated by a layered structure supported by boron trioxide as a binder.

Comparative Preparation Example 4

(29) As compared with Preparation Example 1, boron trioxide was replaced with calcium carbonate. Others were the same as Preparation Example 1.

Comparative Preparation Example 5

(30) As Compared with Preparation Example 1, boron trioxide was replaced with titanium dioxide. Others were the same as Preparation Example 1.

(31) The obtained product was similar to that in Preparation Example 1 in the shape. But, because of its very high D.sub.k, it could not be used in the low dielectric field.

(32) The following examples and comparative examples are thermosetting resin compositions containing the above boron nitride agglomerates.

Example 1

(33) 21 parts of SA9000 polyphenylene ether, 5 parts of styrene-butadiene block copolymer, 50 parts of boron nitride agglomerate I prepared in Preparation Example 1, 3 parts of silica, 3 parts of dicumyl peroxide, and 18 parts of decabromodiphenylethane were dissolved in toluene to prepare a glue solution having an appropriate viscosity. 2116 electronic grade glass cloth was impregnated in such glue solution. Then the solvent was removed in an oven at 115° C. to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of the SA9000, styrene-butadiene block copolymer, boron nitride agglomerates, silica, dicumyl peroxide and decabromodiphenylethane was 100 parts.

(34) Eight sheets of the above prepared prepregs and two sheets of one-ounce electrolytic copper foil were superimposed together and laminated by a hot press to obtain a double-sided copper-clad laminate under the lamination conditions of: 1. the heating rate controlled at 0.5° C.-4.0° C./min when the prepregs were at 80° C.-120° C.; 2. the pressure designed to be 20 kg/cm.sup.2; and 3. the curing temperature of 190° C. which was maintained for 90 minutes. The obtained double-sided copper-clad laminate was tested for performance, and the corresponding performance is shown in Table 1.

Example 2

(35) 23 parts of SA9000 polyphenylene ether, 8 parts of styrene-butadiene block copolymer, 45 parts of boron nitride agglomerate II prepared in Preparation Example 2, 3 parts of silica, 3 parts of dicumyl peroxide, and 18 parts of decabromodiphenylethane were dissolved in toluene to prepare a glue solution having an appropriate viscosity. 2116 electronic grade glass cloth was impregnated in such glue solution. Then the solvent was removed in an oven at 115° C. to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of the SA9000, styrene-butadiene block copolymer, boron nitride agglomerates, silica, dicumyl peroxide and decabromodiphenylethane was 100 parts.

(36) Eight sheets of the above prepared prepregs and two sheets of one-ounce electrolytic copper foil were superimposed together and laminated by a hot press to obtain a double-sided copper-clad laminate under the lamination conditions of: 1. the heating rate controlled at 0.5° C.-4.0° C./min when the prepregs were at 80° C.-120° C.; 2. the pressure designed to be 20 kg/cm.sup.2; and 3. the curing temperature of 190° C. which was maintained for 90 minutes. The obtained double-sided copper-clad laminate was tested for performance, and the corresponding performance is shown in Table 1.

Example 3

(37) 15 parts of SA9000 polyphenylene ether, 3 parts of styrene-butadiene block copolymer, 53 parts of boron nitride agglomerate III prepared in Preparation Example 3, 3 parts of silica, 3 parts of dicumyl peroxide, and 23 parts of SPB100 were dissolved in toluene to prepare a glue solution having an appropriate viscosity. 2116 electronic grade glass cloth was impregnated in such glue solution. Then the solvent was removed in an oven at 115° C. to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of the SA9000, styrene-butadiene block copolymer, boron nitride agglomerates, silica, dicumyl peroxide and SPB100 was 100 parts.

(38) Eight sheets of the above prepared prepregs and two sheets of one-ounce electrolytic copper foil were superimposed together and laminated by a hot press to obtain a double-sided copper-clad laminate under the lamination conditions of: 1. the heating rate controlled at 0.5° C.-4.0° C./min when the prepregs were at 80° C.-120° C.; 2. the pressure designed to be 20 kg/cm.sup.2; and 3. the curing temperature of 190° C. which was maintained for 90 minutes. The obtained double-sided copper-clad laminate was tested for performance, and the corresponding performance is shown in Table 1.

Example 4

(39) 40 parts of EPIKOTE828EL, 37.7 parts of boron nitride agglomerate IV prepared in Preparation Example 4, 3 parts of silica, 4.26 parts of dicyandiamide, 0.04 part of 2-methylimidazole and 15 parts of decabromodiphenylethane were dissolved in N,N-dimethylformamide to prepare a glue solution having an appropriate viscosity. 2116 electronic grade glass cloth was impregnated in such glue solution. Then the solvent was removed in an oven at 115° C. to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of the EPIKOTE828EL, boron nitride agglomerates, silica, dicyandiamide, 2-methylimidazole and decabromodiphenylethane was 100 parts.

(40) Eight sheets of the above prepared prepregs and two sheets of one-ounce electrolytic copper foil were superimposed together and laminated by a hot press to obtain a double-sided copper-clad laminate under the lamination conditions of: 1. the heating rate controlled at 0.5° C.-4.0° C./min when the prepregs were at 80° C.-120° C.; 2. the pressure designed to be 20 kg/cm.sup.2; and 3. the curing temperature of 190° C. which was maintained for 90 minutes. The obtained double-sided copper-clad laminate was tested for performance, and the corresponding performance is shown in Table 1.

Comparative Example 1

(41) 21 parts of SA9000 polyphenylene ether, 5 parts of styrene-butadiene block copolymer, 50 parts of the flaky boron nitride agglomerate prepared in Comparative Preparation Example 1, 3 parts of silica, 3 parts of dicumyl peroxide, and 18 parts of decabromodiphenylethane were dissolved in toluene to prepare a glue solution having an appropriate viscosity. 2116 electronic grade glass cloth was impregnated in such glue solution. Then the solvent was removed in an oven at 115° C. to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of the SA9000, styrene-butadiene block copolymer, flaky boron nitride agglomerates, silica, dicumyl peroxide and decabromodiphenylethane was 100 parts.

(42) Eight sheets of the above prepared prepregs and two sheets of one-ounce electrolytic copper foil were superimposed together and laminated by a hot press to obtain a double-sided copper-clad laminate under the lamination conditions of: 1. the heating rate controlled at 0.5° C.-4.0° C./min when the prepregs were at 80° C.-120° C.; 2. the pressure designed to be 20 kg/cm.sup.2; and 3. the curing temperature of 190° C. which was maintained for 90 minutes. The obtained double-sided copper-clad laminate was tested for performance, and the corresponding performance is shown in Table 1.

Comparative Example 2

(43) 23 parts of SA9000 polyphenylene ether, 8 parts of styrene-butadiene block copolymer, 45 parts of the flaky boron nitride prepared in Comparative Preparation Example 1, 3 parts of silica, 3 parts of dicumyl peroxide, and 18 parts of decabromodiphenylethane were dissolved in toluene to prepare a glue solution having an appropriate viscosity. 2116 electronic grade glass cloth was impregnated in such glue solution. Then the solvent was removed in an oven at 115° C. to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of the SA9000, styrene-butadiene block copolymer, flaky boron nitride agglomerates, silica, dicumyl peroxide and decabromodiphenylethane was 100 parts.

(44) Eight sheets of the above prepared prepregs and two sheets of one-ounce electrolytic copper foil were superimposed together and laminated by a hot press to obtain a double-sided copper-clad laminate under the lamination conditions of: 1. the heating rate controlled at 0.5° C.-4.0° C./min when the prepregs were at 80° C.-120° C.; 2. the pressure designed to be 20 kg/cm.sup.2; and 3. the curing temperature of 190° C. which was maintained for 90 minutes. The obtained double-sided copper-clad laminate was tested for performance, and the corresponding performance is shown in Table 1.

Comparative Example 3

(45) 15 parts of SA9000 polyphenylene ether, 3 parts of styrene-butadiene block copolymer, 53 parts of the flaky boron nitride prepared in Comparative Preparation Example 1, 3 parts of silica, 3 parts of dicumyl peroxide, and 23 parts of SPB100 were dissolved in toluene to prepare a glue solution having an appropriate viscosity. 2116 electronic grade glass cloth was impregnated in such glue solution. Then the solvent was removed in an oven at 115° C. to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of the SA9000, styrene-butadiene block copolymer, flaky boron nitride agglomerates, silica, dicumyl peroxide and SPB100 was 100 parts.

(46) Eight sheets of the above prepared prepregs and two sheets of one-ounce electrolytic copper foil were superimposed together and laminated by a hot press to obtain a double-sided copper-clad laminate under the lamination conditions of: 1. the heating rate controlled at 0.5° C.-4.0° C./min when the prepregs were at 80° C.-120° C.; 2. the pressure designed to be 20 kg/cm.sup.2; and 3. the curing temperature of 190° C. which was maintained for 90 minutes. The obtained double-sided copper-clad laminate was tested for performance, and the corresponding performance is shown in Table 1.

Comparative Example 4

(47) 40 parts of EPIKOTE828EL, 37.7 parts of the flaky boron nitride agglomerate prepared in Comparative Preparation Example 1, 3 parts of silica, 4.26 parts of dicyandiamide, 0.04 part of 2-methylimidazole and 15 parts of decabromodiphenylethane were dissolved in N,N-dimethylformamide to prepare a glue solution having an appropriate viscosity. 2116 electronic grade glass cloth was impregnated in such glue solution. Then the solvent was removed in an oven at 115° C. to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of the EPIKOTE828EL, boron nitride agglomerates, silica, dicyandiamide, 2-methylimidazole and decabromodiphenylethane was 100 parts.

(48) Eight sheets of the above prepared prepregs and two sheets of one-ounce electrolytic copper foil were superimposed together and laminated by a hot press to obtain a double-sided copper-clad laminate under the lamination conditions of: 1. the heating rate controlled at 0.5° C.-4.0° C./min when the prepregs were at 80° C.-120° C.; 2. the pressure designed to be 20 kg/cm.sup.2; and 3. the curing temperature of 190° C. which was maintained for 90 minutes. The obtained double-sided copper-clad laminate was tested for performance, and the corresponding performance is shown in Table 1.

Comparative Example 5

(49) As compared with Example 1, boron nitride agglomerate I was replaced with the boron nitride agglomerate prepared in Preparation Example 2.

Comparative Example 6

(50) As compared with Example 1, boron nitride agglomerate I was replaced with the boron nitride agglomerate prepared in Preparation Example 3.

Comparative Example 7

(51) As compared with Example 1, boron nitride agglomerate I was replaced with the boron nitride agglomerate prepared in Preparation Example 4.

Comparative Example 8

(52) As compared with Example 1, boron nitride agglomerate I was replaced with the boron nitride agglomerate prepared in Preparation Example 5.

Comparative Example 9

(53) As compared with Example 1, boron nitride agglomerate I was replaced with the boron nitride agglomerate in CN103249695A.

Comparative Example 10

(54) As compared with Example 1, boron nitride agglomerate I was replaced with the boron nitride agglomerate in CN106255721A.

(55) TABLE-US-00001 TABLE 1 Performance test results of copper-clad laminates obtained from thermosetting resin compositions Com- Com- Com- Com- Com- Com- Com- Com- Com- Com- para- para- para- para- para- para- para- para- para- para- tive tive tive tive tive tive tive tive tive tive Ex- Ex- Ex- Ex- Ex- Ex- Ex- Ex- Ex- Ex- Ex- Ex- Ex- Ex- ample ample ample ample ample ample ample ample ample ample ample ample ample ample 1 2 3 4 1 2 3 4 5 6 7 8 9 10 SA9000 21    23    15    21    23    15    21    21    21    21    21    21    EPIKOTE828EL 40    40    Styrene- 5   8   3   5   8   3   5   5   5   5   5   5   butadiene block copolymer Boron nitride 50    agglomerate I Boron nitride 45    agglomerate II Boron nitride 53    agglomerate III Boron nitride 37.7  agglomerate IV Flaky boron 50    45    53    37.7  nitride Comparative .sup. 50.sup.2    .sup. 50.sup.3    .sup. 50.sup.4    .sup. 50.sup.5    .sup. 50.sup.6    .sup. 50.sup.7    boron nitride agglomerate Silica 3   3   3   3   3  3   3   3   3   3   3   3   3   3   Dicumyl 3   3   3   3  3   3   3   3   3   3   3   3   peroxide Dicyandiamide  4.26  4.26 2-methyl-  0.04  0.04 imidazole Decabromo- 18    18    15    18    18    15    18    18    18    18    18    18    diphenylethane SPB100 23    23    N,N-dimethyl- q.s. q.s. formamide Toluene q.s. q.s. q.s. q.s. q.s. q.s. q.s. q.s. q.s. q.s. q.s. q.s. D.sub.k (10 GHz)  3.83  3.75  3.91  4.37  3.92  3.83  4.02  4.35  3.87  3.72  5.68  6.98  3.76  3.72 Peel strength  1.16  1.21  1.09  1.32  0.87  0.92  0.79  1.01  0.76  1.25  1.08  1.10  0.75  0.67 (N/mm) Thermal  1.48  1.33  1.52  1.01  1.03  0.86  1.18  0.97  1.12  1.02  0.98  1.14  1.36  1.09 conductivity of insulating layer (w/(m .Math. k))

(56) The superscripts 2, 3, 4, 5, 6, and 7 used in the row of “Comparative boron nitride agglomerate” in the table represent boron nitride agglomerates prepared in Comparative Examples 5, 6, 7, 8, 9, and 10, respectively.

(57) The above performance test methods are as follows:

(58) (1) Dielectric constant (Dk), dielectric loss (Df): measured by using the IPC-TM-650 2.5.5.9 method;

(59) (2) Peel strength: measured in accordance with the “post-stress” treatment conditions specified in IPC-TM-650 2.4.8;

(60) (3) Method for testing thermal conductivity of an insulating layer: tested in accordance with ASTM D5470 standard.

(61) The following points can be seen from Table 1.

(62) (1) By comparing Example 1 with Comparative Example 1, it can be seen that the laminate prepared in Example 1 has the D.sub.k value of 3.83 which is lower than the D.sub.k value in Comparative Example 1 (3.92), the thermal conductivity of the insulating layer of 1.48 w/(m.Math.k) which is higher than that in Comparative Example 1 (1.03 w/(m.Math.k)), and the peel strength of 1.16 N/mm which is higher than that in Comparative Example 1 (0.87 N/mm). The same conclusion can be obtained by comparing Examples 2-4 with Comparative Examples 2-4.

(63) It can be seen therefrom that the resin composition containing the boron nitride agglomerates prepared by the present invention, compared to the resin composition containing flaky boron nitride without an added binder, can make the laminates have more excellent dielectric properties (lower D.sub.k value), better thermal conductivity (higher thermal conductivity of insulating layer) and higher peel strength level between insulating layer and copper foil.

(64) (2) By comparing Example 1 with Comparative Example 5, it can be seen that the laminate prepared in Example 1 has the D.sub.k value of 3.83 which is lower than the D.sub.k value in Comparative Example 5 (3.87), the thermal conductivity of the insulating layer of 1.48 w/(m.Math.k) which is higher than that in Comparative Example 5 (1.12 w/(m.Math.k)), and the peel strength of 1.16 N/mm which is higher than that in Comparative Example 5 (0.76 N/mm).

(65) It can be seen by comparing Example 1 with Comparative Example 6 that, although the laminate made in Comparative Example 6 has a lower D.sub.k value and higher peel strength, its thermal conductivity of the insulating layer is much lower than that in Example 1.

(66) It can be seen therefrom that the resin composition containing the boron nitride agglomerates prepared by the present invention, compared to the resin composition containing a boron nitride agglomerate prepared by using a binder in a mass that is not within the scope of the present invention, can make the laminates have better overall performance, including more excellent dielectric properties (lower D.sub.k value), better thermal conductivity (higher thermal conductivity of insulating layer) and higher peel strength between insulating layer and copper foil.

(67) (3) It can be seen by comparing Example 1 with Comparative Example 7 that the laminate prepared in Example 1 has the D.sub.k value of 3.83 which is much lower than the D.sub.k value in Comparative Example 7 (5.68), the thermal conductivity of the insulating layer of 1.48 w/(m.Math.k) which is higher than that in Comparative Example 7 (0.98 w/(m.Math.k)), and the peel strength of 1.16 N/mm which is higher than that in Comparative Example 7 (1.08 N/mm). The same conclusion can be obtained by comparing Example 1 with Comparative Example 8.

(68) It can be seen therefrom that the resin composition containing the boron nitride agglomerates prepared by the present invention, compared to the resin composition containing a boron nitride agglomerate prepared by using a binder type that is not within the scope of the present invention, can make the laminates have better overall performance, including more excellent dielectric properties (lower D.sub.k value), better thermal conductivity (higher thermal conductivity of insulating layer) and higher peel strength between insulating layer and copper foil.

(69) (4) By comparing Example 1 with Comparative Example 9, it can be seen that Comparative Example 9 is inferior to Example 1 in thermal conductivity of the insulating layer and peel strength although it has a lower D.sub.k value. The same conclusion can be obtained by comparing Example 1 with Comparative Example 10.

(70) It can be seen therefrom that the resin composition containing the boron nitride agglomerates prepared by the present invention, compared to resin compositions containing the boron nitride agglomerates disclosed in CN103249695A and CN106255721A, can make the laminates have better overall performance, especially better thermal conductivity (higher thermal conductivity of insulating layer) and higher peel strength between insulating layer and copper foil.

(71) From the test results of the examples and Comparative examples in the above table, it can be concluded that the resin composition containing boron nitride agglomerates according to the present invention can provide laminates with more excellent dielectric properties (lower D.sub.k value), better thermal conductivity (higher thermal conductivity of the insulating layer), higher peel strength level between the insulating layer and copper foil, and relatively excellent overall performance of the board for customers.

(72) Certainly, the above-mentioned embodiments are only preferred examples of the present invention and are not intended to limit the scope of implementation of the present invention. Therefore, any equivalent changes or modifications made according to the structure, features and principles described in the scope of the patent application are included in the scope of the patent application of the present invention.

(73) Since the thermosetting composition with high thermal conductivity and low dielectric constant provided by the present invention can also effectively control the thickness of the copper clad laminate under mild conditions, it is of great significance in terms of production and economic effects.

(74) The applicant claims that the detailed structural features the present invention are described by the above embodiments. However, the present invention is not limited to the detailed structural features above, i.e. it does not mean that the present invention cannot be carried out unless the above embodiments are applied. Those skilled in the art shall know that any modifications of the present invention, equivalent substitutions of the materials selected for use in the present invention, and addition of the auxiliary ingredients, and specific manner in which they are selected, all are within the protection scope and disclosure of the present invention.