An object of the present invention is to provide a sizing agent composition that gives a carbon fiber from which a carbon fiber-reinforced composite material having excellent adhesion between a resin and the carbon fiber and having excellent mechanical properties can be formed. The sizing agent composition of the invention is a sizing agent composition comprising (A) a blocked isocyanate, and (B) a compound containing at least one polar group and at least one unsaturated group per molecule. In the invention, the mixing ratio (mass ratio) of the blocked isocyanate (A) and the compound (B) containing at least one polar group and at least one unsaturated group per molecule (A/B) is preferably 95/5 to 5/95. In the invention, the blocked isocyanate (A) is preferably a compound having an aliphatic skeleton.

An object of the present invention is to provide a sizing agent composition that gives a carbon fiber from which a carbon fiber-reinforced composite material having excellent adhesion between a resin and the carbon fiber and having excellent mechanical properties can be formed. The sizing agent composition of the invention is a sizing agent composition comprising (A) a blocked isocyanate, and (B) a compound containing at least one polar group and at least one unsaturated group per molecule. In the invention, the mixing ratio (mass ratio) of the blocked isocyanate (A) and the compound (B) containing at least one polar group and at least one unsaturated group per molecule (A/B) is preferably 95/5 to 5/95. In the invention, the blocked isocyanate (A) is preferably a compound having an aliphatic skeleton.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm.sup.2, even when applied to an electronic device that is operated at elevated temperature.

Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm.sup.2, even when applied to an electronic device that is operated at elevated temperature.

The invention relates to hydrolysis-resistant compositions comprising polyethylene terephthalate (PET), production processes, and use of the said compositions.

The invention relates to hydrolysis-resistant compositions comprising polyethylene terephthalate (PET), production processes, and use of the said compositions.

The invention relates to hydrolysis-resistant compositions comprising polyethylene terephthalate (PET), production processes, and use of the said compositions.