Thermosetting powder coating compositions and processes for making the thermosetting powder coating compositions and processes for coating an article with the thermosetting powder coating compositions are disclosed. Cured thermosetting powder coating compositions are obtained by curing of the thermosetting powder coating compositions of the invention. Articles are provided having coated thereon the thermosetting powder coating compositions as well as to articles having coated and cured thereon the thermosetting powder coating compositions. The thermosetting powder coating compositions exhibit a substantially lower T.sub.chalk-free, that is a ΔT.sub.chalk-free which is in the range of from and including 5 up to and not including 10° C., wherein ΔT.sub.chalk-free=T.sub.chalk-free.sup.REF−T.sub.chalk-free.sup.A where T.sub.chalk-free.sup.A is the T.sub.chalk-free of a thermosetting powder coating composition according to the invention (TPCC-A) and T.sub.chalk-free.sup.REF is the T.sub.chalk-free of a thermosetting powder coating composition not according to the invention (TPCC-REF) that is comparable to TPCC-A.

Thermosetting powder coating compositions and processes for making the thermosetting powder coating compositions and processes for coating an article with the thermosetting powder coating compositions are disclosed. Cured thermosetting powder coating compositions are obtained by curing of the thermosetting powder coating compositions of the invention. Articles are provided having coated thereon the thermosetting powder coating compositions as well as to articles having coated and cured thereon the thermosetting powder coating compositions. The thermosetting powder coating compositions exhibit a substantially lower T.sub.chalk-free, that is a ΔT.sub.chalk-free which is in the range of from and including 5 up to and not including 10° C., wherein ΔT.sub.chalk-free=T.sub.chalk-free.sup.REF−T.sub.chalk-free.sup.A where T.sub.chalk-free.sup.A is the T.sub.chalk-free of a thermosetting powder coating composition according to the invention (TPCC-A) and T.sub.chalk-free.sup.REF is the T.sub.chalk-free of a thermosetting powder coating composition not according to the invention (TPCC-REF) that is comparable to TPCC-A.

A binder has at least one isocyanate and at least one biopolymer mixed with water. The biopolymer may be a biopolymer nanoparticle or cooked and chemically modified starch. Optionally, the binder may also include urea. The biopolymer and water are mixed, and the isocyanate is added to the mixture. The binder may have a viscosity that is suitable for being sprayed on a substrate to make a composite material, for example a viscosity of 700 cP or less or 500 cP or less at 40° C. The substrate may be wood, another lignocellulosic material, or synthetic or natural fibers. In particular examples, the binder is used to make no added formaldehyde wood composites including particle board and fiberboard. Alternatively, the binder may have a higher viscosity and be used to make plywood.

A binder has at least one isocyanate and at least one biopolymer mixed with water. The biopolymer may be a biopolymer nanoparticle or cooked and chemically modified starch. Optionally, the binder may also include urea. The biopolymer and water are mixed, and the isocyanate is added to the mixture. The binder may have a viscosity that is suitable for being sprayed on a substrate to make a composite material, for example a viscosity of 700 cP or less or 500 cP or less at 40° C. The substrate may be wood, another lignocellulosic material, or synthetic or natural fibers. In particular examples, the binder is used to make no added formaldehyde wood composites including particle board and fiberboard. Alternatively, the binder may have a higher viscosity and be used to make plywood.

There is provided a compatibilizer for polyester resin which can produce better compatibility than conventional counterparts, and a polyester resin composition using the compatibilizer. The compatibilizer comprises a polycarbodiimide compound represented by the formula (1) describe below wherein the carbodiimide equivalent of the polycarbodiimide compound is 280 or higher; and in the formula (1), R.sup.1 and R.sup.2 are residues formed by eliminating a functional group from an organic compound having the one functional group reactive with an isocyanate group; R.sup.3 is a divalent residue formed by eliminating two isocyanate groups from a diisocyanate compound; R.sup.4 is a divalent residue formed by eliminating two hydroxyl groups from a diol compound; X.sup.1 and X.sup.2 are bonds formed by reaction of the functional group of the organic compound with one of the two isocyanate groups of the diisocyanate compound; and m and n=1 to 20, m+n≤25, and p=0 to 39, provided that the number of carbodiimide groups in one molecule is 2 to 40.

##STR00001##

There is provided a compatibilizer for polyester resin which can produce better compatibility than conventional counterparts, and a polyester resin composition using the compatibilizer. The compatibilizer comprises a polycarbodiimide compound represented by the formula (1) describe below wherein the carbodiimide equivalent of the polycarbodiimide compound is 280 or higher; and in the formula (1), R.sup.1 and R.sup.2 are residues formed by eliminating a functional group from an organic compound having the one functional group reactive with an isocyanate group; R.sup.3 is a divalent residue formed by eliminating two isocyanate groups from a diisocyanate compound; R.sup.4 is a divalent residue formed by eliminating two hydroxyl groups from a diol compound; X.sup.1 and X.sup.2 are bonds formed by reaction of the functional group of the organic compound with one of the two isocyanate groups of the diisocyanate compound; and m and n=1 to 20, m+n≤25, and p=0 to 39, provided that the number of carbodiimide groups in one molecule is 2 to 40.

##STR00001##

Provided are an adhesive sheet, an adhesive composition therefor, an optical member comprising same, and an optical display device comprising same, wherein the adhesive sheet comprises an adhesive layer formed of an adhesive composition containing a hydroxyl group-containing (meth)acrylic copolymer, a photo-initiator, a photo-curable crosslinking agent, and a heat-curable crosslinking agent; the heat-curable crosslinking agent contains an isocyanate-type crosslinking agent and carboxyl group-containing (meth)acrylate; the adhesive layer has a peeling strength of about 600 gf/in or more relative to a glass substrate at 25° C. and has a surface energy of about 70 mN/m or more at 25° C.

A biocide-free, germ-repellent, crosslinked thermoset elastomer is provided. The elastomer base is a thermoset elastomer base selected from natural rubber, synthetic rubber, solid or liquid silicone rubber, or mixtures thereof. At least one germ-repelling modifier is selected from one or more of polyethylene glycol, a polyethylene glycol derivative, alcohol ethoxylate, a polymer including an isocyanate group, a polymer including an allyloxy group, siloxane, polyether modified silicone, polysorbates and copolymers or mixtures thereof. The germ-repelling modifier is permanently bonded to the thermoset elastomer base through a chemical reaction during extrusion, molding, or curing. This chemical reaction also crosslinks the thermoset elastomer base.

The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. ##STR00001##
(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)

The present invention provides an acrylic damping adhesive. The acrylic damping adhesive comprises a crosslinked structure of a carboxy-containing acrylic polymer with a glass transition temperature less than or equal to −20° C. and a carboxy-containing acrylic polymer with a glass transition temperature ranging from 20° C. to 50° C. The acrylic damping adhesive according to technical solutions of the present invention exhibits double damping peaks in a rheological curve, and thus has a wider damping temperature range (the damping temperature range is greater than or equal to 50° C., and preferably greater than or equal to 90° C.), a higher frequency response of damping, and higher system stability.