Provided is a resin composition containing polymethallyl alcohol (A) having a repeating structural unit represented by the following formula (1) in an amount of greater than or equal to 30 mol %, and a metal ion (B), a content of the metal ion (B) being greater than or equal to 0.05 μmol per 1 g of the polymethallyl alcohol (A); a method of producing the resin composition; and a molding containing the resin composition.

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Provided is a resin composition containing polymethallyl alcohol (A) having a repeating structural unit represented by the following formula (1) in an amount of greater than or equal to 30 mol %, and a component (B) that is at least one of an acid component having a pKa of 3.5 to 7.5 and an anion of the acid component, the pKa being a logarithmic value of a reciprocal of an acid dissociation constant at 25° C., a content of the component (B) being greater than or equal to 0.01 μmol per 1 g of the polymethallyl alcohol (A); a method of producing the resin composition; and a molding containing the resin composition.

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Provided is a resin composition containing polymethallyl alcohol (A) having a repeating structural unit represented by the following formula (1) in an amount of greater than or equal to 30 mol %, and a component (B) that is at least one of an acid component having a pKa of 3.5 to 7.5 and an anion of the acid component, the pKa being a logarithmic value of a reciprocal of an acid dissociation constant at 25° C., a content of the component (B) being greater than or equal to 0.01 μmol per 1 g of the polymethallyl alcohol (A); a method of producing the resin composition; and a molding containing the resin composition.

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Provided is a resin composition containing polymethallyl alcohol (A) having a repeating structural unit represented by the following formula (1) in an amount of greater than or equal to 30 mol %, and a component (B) that is at least one of an acid component having a pKa of 3.5 to 7.5 and an anion of the acid component, the pKa being a logarithmic value of a reciprocal of an acid dissociation constant at 25° C., a content of the component (B) being greater than or equal to 0.01 μmol per 1 g of the polymethallyl alcohol (A); a method of producing the resin composition; and a molding containing the resin composition.

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Methods of compounding nanoparticles with a resin, e.g., a curable resin and one or more surface modifying agents are described. The methods use wet milling technology, including both continuous and batch milling processes, and can be used to functionalize the nanoparticles and disperse the functionalized nanoparticles into the resin system in a single process. Methods of compounding curable resin systems containing reactive diluents are also disclosed.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

One embodiment of the present invention provides: a thermoplastic resin composition which contains a polycarbonate resin and a polyester resin that contains a diol unit having a cyclic acetal skeleton, and wherein the polyester resin contains specific amounts of phosphorus atoms and titanium atoms and the weight ratio of the phosphorus atoms to the titanium atoms is within a specific range; and a molded body which uses this thermoplastic resin composition.

One embodiment of the present invention provides: a thermoplastic resin composition which contains a polycarbonate resin and a polyester resin that contains a diol unit having a cyclic acetal skeleton, and wherein the polyester resin contains specific amounts of phosphorus atoms and titanium atoms and the weight ratio of the phosphorus atoms to the titanium atoms is within a specific range; and a molded body which uses this thermoplastic resin composition.

The invention relates to a method for producing polyether carbonate polyols, (i) one or more alkylene oxide(s) and carbon dioxide being added to one or more H-functional starter substance(s) in the presence of a double metal cyanide catalyst or in the presence of a metal complex catalyst based on the metals zinc and/or cobalt, a reaction mixture containing the polyether carbonate polyol being obtained, characterized in that (ii) at least one component K is added to the obtained reaction mixture containing the polyether carbonate polyol, wherein component K is selected from at least one compound that contains a phosphorus-oxygen bond or a compound of phosphorus that can form one or more P—O bonds by reaction with OH-functional compounds.