The present invention relates to a flame-retardant polycarbonate composition comprising the following components, relative to the total weight of the composition: A) 40-60 wt. % of at least one aromatic polycarbonate, B) 30-50 wt. % of at least one polysiloxane-polycarbonate condensate, C) 0.5-5 wt. % of at least one cyclic phosphazene, D) 1-5 wt. % of at least one silicone-acrylate rubber based impact modifier, E) 0.3-3 wt % of aluminium hydroxide oxide, F) 0.1-1 wt. % of at least one anti-dripping agent, and G) 0.1-1 wt. % of at least one UV absorber.

The present invention also relates to a shaped article produced from the composition. The polycarbonate composition according to the present invention has a good combination of low-temperature impact performance, flame-retardancy, hydrolytic stability, anti-UV performance, and heat resistance.

The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.

The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.

An example of a build material composition for three-dimensional (3D) printing includes a polyamide material and an antioxidant. The antioxidant consists of an aromatic multihydrazide; or an aromatic sulfonomonohydrazide; or a hydrazide having formula (I) disclosed herein, wherein: R is null, a C1 to C12 unbranched alkyl, a C3 to C8 branched alkyl, a C2 to C8 unbranched alkylene, a C4 to C8 branched alkylene, an alicyclic compound, a polyethylene glycol, or a combination thereof; A is C═O, O═S═O, P═O, or C═S; and n is an integer ranging from 1 to 4; or formula (II) disclosed herein wherein A is C═O, O═S═O, P═O, or C═S.

An example of a build material composition for three-dimensional (3D) printing includes a polyamide material and an antioxidant. The antioxidant consists of an aromatic multihydrazide; or an aromatic sulfonomonohydrazide; or a hydrazide having formula (I) disclosed herein, wherein: R is null, a C1 to C12 unbranched alkyl, a C3 to C8 branched alkyl, a C2 to C8 unbranched alkylene, a C4 to C8 branched alkylene, an alicyclic compound, a polyethylene glycol, or a combination thereof; A is C═O, O═S═O, P═O, or C═S; and n is an integer ranging from 1 to 4; or formula (II) disclosed herein wherein A is C═O, O═S═O, P═O, or C═S.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

An example of a build material composition for three-dimensional (3D) printing includes a polyamide material and an antioxidant. The antioxidant includes an aromatic multihydrazide; or an aromatic sulfonomonohydrazide; or a hydrazide having formula (I) disclosed herein, wherein: R is null, a C1 to C12 unbranched alkyl, a C3 to C8 branched alkyl, a C2 to C8 unbranched alkylene, a C4 to C8 branched alkylene, an alicyclic compound, a polyethylene glycol, or a combination thereof; A is C═O, O=S═O, P═O, or C═S; and n is an integer ranging from 1 to 4; or formula (II) disclosed herein wherein A is C═O, O═S=O, P═O, or C═S.

##STR00001##

An example of a build material composition for three-dimensional (3D) printing includes a polyamide material and an antioxidant. The antioxidant includes an aromatic multihydrazide; or an aromatic sulfonomonohydrazide; or a hydrazide having formula (I) disclosed herein, wherein: R is null, a C1 to C12 unbranched alkyl, a C3 to C8 branched alkyl, a C2 to C8 unbranched alkylene, a C4 to C8 branched alkylene, an alicyclic compound, a polyethylene glycol, or a combination thereof; A is C═O, O=S═O, P═O, or C═S; and n is an integer ranging from 1 to 4; or formula (II) disclosed herein wherein A is C═O, O═S=O, P═O, or C═S.

##STR00001##

Reprocessable materials are provided that include a product of cross-linking a glycidyl methacrylate grafted high-density polyethylene (HDPE-g-GMA) with a polymacrolactone of formula (II) to form a cross-linked polymer exhibiting vitrimer characteristics. Methods for preparing the cross-linked polymer materials include reacting the glycidyl methacrylate grafted high-density polyethylene of with the polymacrolactone in the presence of a first catalyst under conditions that initiate cross-linking of HDPE-g-GMA with the polymacrolactone. Mechanically reprocessable articles include a structural element that is or includes the cross-linked polymer material. Examples of the mechanically reprocessable articles include pallets or molded structures formed from the material and configured to support a load of at least 1000 kg without bending.