An object of the present invention is to provide ferrite particles having a high magnetic permeability in a frequency band of 1 MHz to 1 GHz. Another object is to provide a resin composition containing the ferrite particles and an electromagnetic wave shielding material composed of the resin composition. The ferrite particles are composed of a single crystalline body having an average particle size of 1 to 2000 nm and has a spherical particle shape, wherein the ferrite particles contain substantially no Zn, 3 to 25 wt % of Mn, and 43 to 65 wt % of Fe, and a real part μ′ of a complex magnetic permeability measured using a molding composed of the ferrite particles and a binder resin has a maximal value in a frequency band of 100 MHz to 1 GHz.

An object of the present invention is to provide ferrite particles having a high magnetic permeability in a frequency band of 1 MHz to 1 GHz. Another object is to provide a resin composition containing the ferrite particles and an electromagnetic wave shielding material composed of the resin composition. The ferrite particles are composed of a single crystalline body having an average particle size of 1 to 2000 nm and has a spherical particle shape, wherein the ferrite particles contain substantially no Zn, 3 to 25 wt % of Mn, and 43 to 65 wt % of Fe, and a real part μ′ of a complex magnetic permeability measured using a molding composed of the ferrite particles and a binder resin has a maximal value in a frequency band of 100 MHz to 1 GHz.

A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications.

A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications.

a fluororubber composition includes (a) a peroxide-crosslinkable fluorine-containing elastomer; (b) a spherical particle of a silica/cured melamine resin composite; (c) carbon black; (d) an organic peroxide as a crosslinking agent; and (e) a co-crosslinking agent.

a fluororubber composition includes (a) a peroxide-crosslinkable fluorine-containing elastomer; (b) a spherical particle of a silica/cured melamine resin composite; (c) carbon black; (d) an organic peroxide as a crosslinking agent; and (e) a co-crosslinking agent.

The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

A polyvinyl halide compound has thermal conductivity and includes polyvinyl halide resin, natural or synthetic graphite of flake or spheroid form, and at least 0.5 weight percent of epoxidized vegetable oil. Selection of types and amounts of graphite and epoxidized vegetable oil provide thermal conductivity while other desirable properties of the compound are suitably maintained. The compound can be used for making any end use article that needs flame retardance and good thermal management and is especially useful as a thermally conductive material to replace die cast or extruded aluminum heat sinks in industrial applications, such as LED lighting fixtures.

A polyvinyl halide compound has thermal conductivity and includes polyvinyl halide resin, natural or synthetic graphite of flake or spheroid form, and at least 0.5 weight percent of epoxidized vegetable oil. Selection of types and amounts of graphite and epoxidized vegetable oil provide thermal conductivity while other desirable properties of the compound are suitably maintained. The compound can be used for making any end use article that needs flame retardance and good thermal management and is especially useful as a thermally conductive material to replace die cast or extruded aluminum heat sinks in industrial applications, such as LED lighting fixtures.