Disclosed herein are thermal interface materials comprising thermoset binder component and a mixture of spherically shaped and thermally conductive fillers and the use thereof in battery powered vehicles.

The present disclosure relates to an epoxy resin composition having a thermal conductivity of at least 5 W/m.Math.k, which has a sufficient thermal emission effect when implementing a multilayer circuit and can replace a ceramic substrate used in automobiles, home appliances, electric vehicles and the like, and to a heat dissipation circuit board using the same. The epoxy resin composition according to one embodiment of the present disclosure, the epoxy resin composition includes an epoxy resin, a curing agent and an inorganic filler. The inorganic filler may include alumina having a maximum particle diameter of less than 32 μm and aluminum nitride having a mean particle diameter of 0.5 to 1.0 μm, in an amount of 85 wt % or more. The epoxy resin composition includes an inorganic filler having a mean particle diameter of 1.0 μm to form an insulating layer having excellent thermal conductivity and withstand voltage properties, thereby providing a high heat dissipation circuit board that is superior compared to existing single layer circuit boards.

The present disclosure relates to an epoxy resin composition having a thermal conductivity of at least 5 W/m.Math.k, which has a sufficient thermal emission effect when implementing a multilayer circuit and can replace a ceramic substrate used in automobiles, home appliances, electric vehicles and the like, and to a heat dissipation circuit board using the same. The epoxy resin composition according to one embodiment of the present disclosure, the epoxy resin composition includes an epoxy resin, a curing agent and an inorganic filler. The inorganic filler may include alumina having a maximum particle diameter of less than 32 μm and aluminum nitride having a mean particle diameter of 0.5 to 1.0 μm, in an amount of 85 wt % or more. The epoxy resin composition includes an inorganic filler having a mean particle diameter of 1.0 μm to form an insulating layer having excellent thermal conductivity and withstand voltage properties, thereby providing a high heat dissipation circuit board that is superior compared to existing single layer circuit boards.

The present disclosure relates to an epoxy resin composition having a thermal conductivity of at least 5 W/m.Math.k, which has a sufficient thermal emission effect when implementing a multilayer circuit and can replace a ceramic substrate used in automobiles, home appliances, electric vehicles and the like, and to a heat dissipation circuit board using the same. The epoxy resin composition according to one embodiment of the present disclosure, the epoxy resin composition includes an epoxy resin, a curing agent and an inorganic filler. The inorganic filler may include alumina having a maximum particle diameter of less than 32 μm and aluminum nitride having a mean particle diameter of 0.5 to 1.0 μm, in an amount of 85 wt % or more. The epoxy resin composition includes an inorganic filler having a mean particle diameter of 1.0 μm to form an insulating layer having excellent thermal conductivity and withstand voltage properties, thereby providing a high heat dissipation circuit board that is superior compared to existing single layer circuit boards.

A thermal interface material (TIM) composition comprising a polymeric binder component and about 50-90 wt% of spherical magnesium hydroxide particles having a particle size distribution D50 ranging from about 20-100 .Math.m, with the total weight of the composition totaling to 100 wt%.

A thermal interface material (TIM) composition comprising a polymeric binder component and about 50-90 wt% of spherical magnesium hydroxide particles having a particle size distribution D50 ranging from about 20-100 .Math.m, with the total weight of the composition totaling to 100 wt%.

Powder particulates comprising a water-soluble polymer may be formed by melt emulsification. Compositions comprising powder particulates may comprise a plurality of particulates comprising a water-soluble polymer and a plurality of nanoparticles, the water-soluble polymer defining at least an outer surface of the particulates and at least a majority of the plurality of nanoparticles being disposed upon the outer surface.

Powder particulates comprising a water-soluble polymer may be formed by melt emulsification. Compositions comprising powder particulates may comprise a plurality of particulates comprising a water-soluble polymer and a plurality of nanoparticles, the water-soluble polymer defining at least an outer surface of the particulates and at least a majority of the plurality of nanoparticles being disposed upon the outer surface.

The invention relates to a paper coating slip composition comprising a copolymer of thickening acrylic acid, a mineral material in the form of particles, a binding agent, and water. The invention also relates to the use of said composition for the production of paper or cardboard, improving the water retention of the paper coating slip.

The invention relates to a paper coating slip composition comprising a copolymer of thickening acrylic acid, a mineral material in the form of particles, a binding agent, and water. The invention also relates to the use of said composition for the production of paper or cardboard, improving the water retention of the paper coating slip.