A filler for resinous composition is contained and used in resinous composition, and includes: a crystalline siliceous particulate material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA and type MFI, and/or type MWW; and a surface treatment agent including an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material; the filler including the surface treatment agent in an amount falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.

The present application disclose a method for preparing an oriented heat conducting sheet, which includes the following steps: Step S1, preparing a fluid composition for the heat conducting sheet; Step S2, placing the fluid composition obtained in the step S1 in an orientation molding device, applying a circumferential high-speed shear force to the fluid composition layer by layer to enable thermal conducting fillers in the fluid composition to be oriented along a shear direction to form an oriented thin-layer composition, and collecting the thin-layer composition layer by layer in a die to form a continuous multi-layer aggregate; Step S3, heat curing the multi-layer aggregate to obtain an oriented composition block; and S4, slicing the oriented composition block along the direction perpendicular to an orienting direction of the oriented composition block to obtain an oriented heat conducting sheet.

Described herein is a process of preparing a structural colored coating film including steps of i) applying colloidal particles dispersed in a solvent mixture including at least two organic solvents onto a substrate to form a colloidal particles layer; ii) drying the colloidal particles layer to form a photonic crystal structure layer; iii) applying a coating composition including at least one thermally crosslinkable resin and at least one crosslinking agent onto the photonic crystal structure layer to form a coating; and iv) heat curing. Also described herein is an article having at least one structural colored coating film obtainable or obtained from the process.

Described herein is a process of preparing a structural colored coating film including steps of i) applying colloidal particles dispersed in a solvent mixture including at least two organic solvents onto a substrate to form a colloidal particles layer; ii) drying the colloidal particles layer to form a photonic crystal structure layer; iii) applying a coating composition including at least one thermally crosslinkable resin and at least one crosslinking agent onto the photonic crystal structure layer to form a coating; and iv) heat curing. Also described herein is an article having at least one structural colored coating film obtainable or obtained from the process.

A laminate containing: an adhesion layer-applied substrate containing a substrate and an adhesion layer disposed on the substrate, the adhesion layer containing an adhesive emulsion particle (F), an inorganic oxide (G) and a light-shielding agent (S1); and a hard coating layer (C) disposed on the adhesion layer-applied substrate and containing a matrix component (B) containing an inorganic oxide (D), wherein a haze value H1 of the adhesion layer-applied substrate is larger than a haze value H2 of the laminate.

An acrylic conductive paste is provided, based on 100 parts by weight, including: 30-84 parts of conductive particles, 15˜45 parts of acrylate, 0.5˜2.5 parts of adhesion promoter, 0.5˜3 parts of initiator. The conductive particles include three-dimensional dendritic conductive particles; and the adhesion promoter is a mixture of a silane coupling agent and a phosphate ester. The conductive paste of the present disclosure has good electrical conductivity, short curing time, strong adhesion, and can be used for a long-time room temperature operation. The present disclosure also provides a method for preparing the above-mentioned acrylic conductive paste, which is convenient for operation and industrial application; at the same time, it shows that the acrylic conductive paste of the present disclosure can be applied to semiconductor components for packaging a semiconductor device.

An acrylic conductive paste is provided, based on 100 parts by weight, including: 30-84 parts of conductive particles, 15˜45 parts of acrylate, 0.5˜2.5 parts of adhesion promoter, 0.5˜3 parts of initiator. The conductive particles include three-dimensional dendritic conductive particles; and the adhesion promoter is a mixture of a silane coupling agent and a phosphate ester. The conductive paste of the present disclosure has good electrical conductivity, short curing time, strong adhesion, and can be used for a long-time room temperature operation. The present disclosure also provides a method for preparing the above-mentioned acrylic conductive paste, which is convenient for operation and industrial application; at the same time, it shows that the acrylic conductive paste of the present disclosure can be applied to semiconductor components for packaging a semiconductor device.

Provided is a thermally conductive liquid composition containing a matrix resin (A) and thermally conductive inorganic particles (B). The matrix resin (A) accounts for 2 mass % or more and 8 mass % or less and the thermally conductive inorganic particles (B) account for 92 mass % or more and 98 mass % or less relative to 100 mass % of the thermally conductive liquid composition. The thermally conductive inorganic particles (B) include thermally conductive inorganic particles (B1) of 100 μm or more and 500 μm or less and thermally conductive inorganic particles (B2) of 0.01 μm or more and less than 100 μm. In the volume-based cumulative distribution curve, the thermally conductive inorganic particles (B1) account for 25 vol % or more and 50 vol % or less and the thermally conductive inorganic particles (B2) account for 50 vol % or more and 75 vol % or less relative to 100 vol % of the thermally conductive inorganic particles (B). Thus, the thermally conductive liquid composition has improved fluidity and is smoothly extruded from a discharge orifice of a small diameter while having high thermal conductivity.

A modified epoxy acrylic resin conductive adhesive is disclosed, based on 100 parts by total mass, including the following components: 49-75 parts of conductive particles, 24-45 parts of modified epoxy propylene resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator. The conductive particles include at least 5% conductive particles with a three-dimensional dendritic microstructure among all the conductive particles. A preparation method and application of the modified epoxy acrylic resin conductive adhesive are disclosed. The modified epoxy acrylic resin conductive adhesive of the present disclosure has advantages in good electrical conductivity, short curing time, strong adhesion, and capability being used for a long-time room temperature operation.

A modified epoxy acrylic resin conductive adhesive is disclosed, based on 100 parts by total mass, including the following components: 49-75 parts of conductive particles, 24-45 parts of modified epoxy propylene resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator. The conductive particles include at least 5% conductive particles with a three-dimensional dendritic microstructure among all the conductive particles. A preparation method and application of the modified epoxy acrylic resin conductive adhesive are disclosed. The modified epoxy acrylic resin conductive adhesive of the present disclosure has advantages in good electrical conductivity, short curing time, strong adhesion, and capability being used for a long-time room temperature operation.